Defect detection using thermal laser stimulation and atomic force microscopy
US-2024069095-A1 · Feb 29, 2024 · US
US12228610B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12228610-B2 |
| Application number | US-202217805274-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 3, 2022 |
| Priority date | Jun 3, 2021 |
| Publication date | Feb 18, 2025 |
| Grant date | Feb 18, 2025 |
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An illuminator system for semiconductor chip testing has a rotary plate and a first light source and second light source mounted on the rotary plate. A controller is configured to rotate the rotary plate to provide a desired light output. A light output of the illuminator system is aligned to the desired first or second light source. A first semiconductor chip receives illumination from the desired source. The rotary plate is rotated until the desired light source is aligned to the light output. A quality or characteristic of light emitted by the first light source can be measured, and then the first light source can be adjusted, or an alert can be generated, if the quality or characteristic falls outside of a preconfigured range.
Opening claim text (preview).
What is claimed: 1. A method of testing a semiconductor device, comprising: providing an illuminator system comprising, a rotary plate, a first light source mounted on the rotary plate, a second light source mounted on the rotary plate, a controller configured to rotate the rotary plate, and a light output aligned to the first light source; illuminating a first semiconductor package using the first light source, wherein a first photosensitive circuit of the first semiconductor package converts a first optical signal from the first light source into a first electrical signal; analyzing the first electrical signal to confirm proper operation of the first photosensitive circuit; rotating the rotary plate until the second light source is aligned to the light output after illuminating the first semiconductor package using the first light source; and illuminating a second semiconductor package using the second light source after rotating the rotary plate. 2. The method of claim 1 , further including: measuring a quality of a light emitted by the first light source using a light meter; and adjusting the first light source using the controller after detecting the quality of the light falling outside of a preconfigured range. 3. The method of claim 1 , further including: measuring a quality of a light emitted by the first light source using a light meter; and generating an alert after detecting the quality of the light falling outside of a preconfigured range. 4. The method of claim 1 , wherein the first light source is a halogen light source and the second light source is a light-emitting diode (LED) light source. 5. The method of claim 4 , further including an infra-red (IR) light source mounted on the rotary plate. 6. The method of claim 1 , further including coupling a plurality of secondary optical cables to the illuminator system, wherein the plurality of secondary optical cables has a variable pitch. 7. A semiconductor testing device, comprising: a rotary plate; a first light source mounted on the rotary plate; a second light source mounted on the rotary plate; a controller configured to rotate the rotary plate; a light output aligned to the first light source or second light source; a first light conduit positioned to route an optical signal from the light output; and a light meter configured to receive the optical signal from the first light conduit and measure a quality of the optical signal, wherein the controller is configured to communicate with the light meter and adjust the first light source or second light source based on the quality of the optical signal. 8. The semiconductor testing device of claim 7 , wherein the first light source includes a halogen light source and the second light source includes a light-emitting diode (LED) light source. 9. The semiconductor testing device of claim 8 , further including an infra-red light source mounted on the rotary plate. 10. The semiconductor testing device of claim 7 , further including a plurality of secondary optical cables coupled to the light output. 11. The semiconductor testing device of claim 10 , wherein the plurality of secondary optical cables has a variable pitch. 12. The semiconductor testing device of claim 7 , wherein the quality of the optical signal includes brightness or color temperature.
using non-ionising electromagnetic radiation, e.g. optical radiation · CPC title
for measurement in the infrared range · CPC title
Control of working procedures of a spectrometer; Failure detection; Bandwidth calculation · CPC title
making use of sensor-related data, e.g. for identification of sensor parts or optical elements · CPC title
Adjustable, e.g. focussing · CPC title
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