Method and apparatus for layer thickness control in additive manufacturing

Patent metadata

Field	Value
Publication number	US-12226960-B2
Application number	US-202318371903-A
Country	US
Kind code	B2
Filing date	Sep 22, 2023
Priority date	Feb 20, 2019
Publication date	Feb 18, 2025
Grant date	Feb 18, 2025

Abstract

An additive manufacturing apparatus is disclosed. The apparatus includes a build surface, at least a portion of which is transparent. The apparatus includes a first material depositor operable to deposit a curable resin to form a deposited resin layer on the build surface. A first sensing device is configured to measure the thickness of the deposited resin layer; and wherein the at least one sensing device is configured to generate a signal indicative of the thickness of the deposited resin layer. The first sensing device can be connected to a computer such that the additive manufacturing apparatus is configured to control the thickness of the deposited resin layer. The thickness of the deposited resin layer can be controlled such that it varies from side to side. The thickness can also be controlled such that it varies with time.

First claim

What is claimed is:

1. A method for using an apparatus for additive manufacturing to produce a three dimensional part that includes a void, the method comprising the steps of:
depositing an uncured layer of resin that defines a resin surface and a resin base that are spaced apart a thickness and wherein the uncured layer of resin includes multiple thicknesses such that a first uncured layer profile is defined;
curing the layer of resin to create a build layer that is a component of the part; and
wherein the build layer has a build layer profile that defines at least a portion of the void.

2. The method of claim 1 , wherein the first uncured layer profile is substantially the same as the build layer profile.

3. The method of claim 1 , wherein dimensions of the build layer are defined by dimensions of the uncured resin layer produced by the depositing step.

4. The method of claim 1 , further comprising the steps of repeating the depositing and curing steps to create a part that includes multiple build layers and that includes the void and the void has a predetermined geometry.

5. The method of claim 4 , wherein the predetermined geometry can include at least a portion of one of the following: an overhang, an internal void, an internal void that includes a structure positioned therein, and a combination thereof.

6. The method of claim 1 , wherein the uncured layer of resin is positioned such that it has an x-axis, a y-axis, and a z-axis and the first profile is oriented generally perpendicular to the x-axis.

7. The method of claim 1 , wherein the uncured layer of resin is positioned such that it has an x-axis, a y-axis, and a z-axis and the first profile is oriented generally perpendicular to the y-axis.

8. The method of claim 1 , further comprising the step of depositing the uncured layer of resin such that multiple lanes are defined within the uncured layer of resin.

9. The method of claim 8 , further comprising the step of depositing the multiple lanes such that at least two lanes have different thicknesses.

10. The method of claim 8 , further comprising the step of depositing the multiple lanes such that at least two lanes have substantially similar thicknesses.

11. The method of claim 10 , further comprising the step of depositing an additional lane between the two lanes that have substantially similar thicknesses such that the additional lane has a different thickness than within the thickness of the two lines that have substantially similar thicknesses.

12. The method of claim 11 , wherein the additional lane is thinner than at least a portion of the two lanes that have substantially similar thicknesses.

13. The method of claim 1 , further comprising the steps of contacting at least a portion of the resin surface with a working surface; and
changing the first uncured layer profile to define a second uncured layer profile during the step of contacting.

14. The method of claim 13 , wherein the second uncured layer profile is substantially the same as build layer profile.

15. The method of claim 13 , further comprising the step of cleaning residual uncured resin from the part.

16. The method of claim 13 , further comprising the step of removing undesired cured resin to define a final part shape.

17. The method of claim 1 , further comprising the step of curing by exposing different portions of the resin layer with different amounts of radiation.

18. The method of claim 1 , further comprising the step of repeating the depositing and curing steps to create at least one additional build layer that further defines the void.

Assignees

• Gen Electric

Inventors

• Dubelman Meredith Elissa
• Thompson Mary Kathryn
• Barnhill Christopher
• Yang Xi

Classifications

• B29C64/268

  using laser beams; using electron beams [EB] · CPC title

• B29C64/135

  the energy source being concentrated, e.g. scanning lasers or focused light sources · CPC title

• B29C64/245

  Platforms or substrates (support structures intended to be sacrificed after manufacture B29C64/40) · CPC title

• B33Y50/02

  for controlling or regulating additive manufacturing processes · CPC title

• B33Y30/00

  Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title