Encapsulating cover plate, fabrication method thereof, display panel and fabrication method thereof

Patent metadata

Field	Value
Publication number	US-12225752-B2
Application number	US-202017293636-A
Country	US
Kind code	B2
Filing date	May 27, 2020
Priority date	May 31, 2019
Publication date	Feb 11, 2025
Grant date	Feb 11, 2025

Abstract

An encapsulating cover plate, a method for fabricating the same, a display panel and a method for fabricating the same are provided. The encapsulating cover plate includes a first base substrate; a first auxiliary electrode on the first base substrate; and a second auxiliary electrode on a side of the first auxiliary electrode away from the first base substrate, an orthographic projection of the second auxiliary electrode on the first base substrate being within an orthographic projection of the first auxiliary electrode on the first base substrate. A material of the first auxiliary electrode includes an organic conductive polymer, and a material of the second auxiliary electrode includes a conductive metal.

First claim

What is claimed is:

1. An encapsulating cover plate for an organic light emitting diode (OLED) display panel, comprising:
a first base substrate;
a first auxiliary electrode on the first base substrate; and
a second auxiliary electrode on a side of the first auxiliary electrode away from the first base substrate, an orthographic projection of the second auxiliary electrode on the first base substrate being within an orthographic projection of the first auxiliary electrode on the first base substrate,
wherein a material of the first auxiliary electrode comprises an organic conductive polymer, and a material of the second auxiliary electrode comprises a conductive metal, and
the orthographic of the first auxiliary electrode on the first base substrate does not overlap an orthographic projection of a first electrode of an OLED device on the first base substrate.

2. The encapsulating cover plate of claim 1 , wherein the organic conductive polymer comprises at least one of polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene, or polydiacetylene.

3. The encapsulating cover plate of claim 1 , wherein the material of the second auxiliary electrode comprises a conductive alloy.

4. The encapsulating cover plate of claim 1 , wherein the material of the second auxiliary electrode comprises at least one of silver, aluminum, copper, gold, or molybdenum.

5. An organic light emitting diode (OLED) display panel, comprising the encapsulating cover plate of claim 1 and an OLED array substrate.

6. The OLED display panel of claim 5 , wherein
the OLED array substrate comprises:
a second base substrate; and
the OLED device on the second base substrate; the OLED device comprising the first electrode, a transparent second electrode, and a light emitting layer between the first electrode and the transparent second electrode, wherein the transparent second electrode is on a light emitting surface of the OLED array substrate,

wherein the encapsulating cover plate and the OLED array substrate are arranged oppositely, and the second auxiliary electrode is electrically coupled to the transparent second electrode of the OLED device.

7. The OLED display panel of claim 6 , wherein the OLED device comprises a top-emission type OLED device.

8. The OLED display panel of claim 6 , wherein an orthographic projection of the first auxiliary electrode on the second base substrate does not overlap an orthographic projection of the light emitting layer on the second base substrate.

9. The OLED display panel of claim 6 , wherein the OLED array substrate comprises a plurality of OLED devices, and the plurality of OLED devices share a same transparent second electrode.

10. A method for fabricating an encapsulating cover plate, comprising:
forming a first auxiliary electrode on a first base substrate; a material of the first auxiliary electrode comprising an organic conductive polymer; and
forming a second auxiliary electrode on a side of the first auxiliary electrode away from the first base substrate through an electroplating process, a material of the second auxiliary electrode comprising a conductive metal, and an orthographic projection of the second auxiliary electrode on the first base substrate being within an orthographic projection of the first auxiliary electrode on the first base substrate,
wherein the orthographic of the first auxiliary electrode on the first base substrate does not overlap an orthographic projection of a first electrode of an OLED device on the first base substrate.

11. The method of claim 10 , wherein the first auxiliary electrode is formed on the first base substrate through an ink-jet printing process or a transfer printing process.

12. The method of claim 10 , wherein the material of the second auxiliary electrode comprises a conductive alloy.

13. The method of claim 10 , wherein the organic conductive polymer comprises at least one of polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene, or polydiacetylene.

14. The method of claim 10 , wherein the material of the second auxiliary electrode comprises at least one of silver, aluminum, copper, gold, or molybdenum.

15. A method for fabricating an organic light emitting diode (OLED) display panel, comprising:
fabricating an OLED array substrate, the OLED array substrate comprising a second base substrate and an OLED device on the second base substrate; the OLED device comprising a first electrode, a transparent second electrode, and a light emitting layer between the first electrode and the transparent second electrode, wherein the second transparent electrode is on a light emitting surface of the OLED array substrate;
fabricating an encapsulating cover plate by using the method of claim 10 ; and
aligning the OLED array substrate and the encapsulating cover plate to form a cell, such that the second auxiliary electrode of the encapsulating cover plate is electrically coupled to the transparent second electrode of the OLED device.

16. The method of claim 15 , wherein after the OLED array substrate and the encapsulating cover plate are aligned to form the cell, an orthographic projection of the first auxiliary electrode on the second base substrate does not overlap an orthographic projection of the light emitting layer on the second base substrate.

17. The encapsulating cover plate of claim 1 , wherein the organic conductive polymer comprises polyphenylene vinylene.

18. The method of claim 10 , wherein the organic conductive polymer comprises polyphenylene vinylene.

Assignees

• Boe Technology Group Co Ltd

Inventors

• You Juanjuan
• Sun Li

Classifications

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K59/871

  Self-supporting sealing arrangements · CPC title

• H10K59/80522 Primary

  combined with auxiliary electrodes · CPC title

• H10K50/824 Primary

  combined with auxiliary electrodes · CPC title

• H10K59/1201 Primary

  Manufacture or treatment · CPC title