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US-2024147789-A1 · May 2, 2024 · US
Package of environmental sensitive element
US9101005B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9101005-B2 |
| Application number | US-201313867136-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 22, 2013 |
| Priority date | Sep 15, 2009 |
| Publication date | Aug 4, 2015 |
| Grant date | Aug 4, 2015 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A package of an environmental sensitive element including a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure is provided. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a plurality of first thin films and the flexible sacrificial layer includes a plurality of second thin films. The bonding strength between two adjacent second thin films is substantially equal to or lower than the bonding strength between two adjacent first thin films. Further, the packaging structure covers the environmental sensitive element and the flexible sacrificial layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A package of an environmental sensitive element, comprising: a flexible substrate; an environmental sensitive element disposed on the flexible substrate; a first packaging structure covering the environmental sensitive element; and a first flexible sacrificial layer disposed on the first packaging structure, and the first flexible sacrificial layer and the environmental sensitive element being located on two opposite sides of the first packaging struct…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H05B33/04Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9101005B2 cover?
- A package of an environmental sensitive element including a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure is provided. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a …
- Who is the assignee on this patent?
- Ind Tech Res Inst
- What technology area does this patent fall under?
- Primary CPC classification H05B33/04. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 04 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).