Capacitors with built-in electric fields

Patent metadata

Field	Value
Publication number	US-12224309-B2
Application number	US-202017116315-A
Country	US
Kind code	B2
Filing date	Dec 9, 2020
Priority date	Dec 9, 2020
Publication date	Feb 11, 2025
Grant date	Feb 11, 2025

Abstract

Disclosed herein are capacitors including built-in electric fields, as well as related devices and assemblies. In some embodiments, a capacitor may include a top electrode region, a bottom electrode region, and a dielectric region between and in contact with the top electrode region and the bottom electrode region, wherein the dielectric region includes a perovskite material, and the top electrode region has a different material structure than the bottom electrode region.

First claim

The invention claimed is:

1. An integrated circuit (IC) die, comprising:
a capacitor, including:
a top electrode comprising a first top electrode region and a second top electrode region wherein the first top electrode region has a different material composition than the first top electrode region;
a bottom electrode; and
a dielectric region between and in contact with the first top electrode region and the bottom electrode;
wherein the dielectric region includes a perovskite material, the first top electrode region has a same material composition as the bottom electrode, and the first top electrode region has at least one of a different crystal phase from the bottom electrode and a different defect density from the bottom electrode.

2. The IC die of claim 1 , wherein the first top electrode region has a different material composition than the bottom electrode.

3. The IC die of claim 2 , wherein the first top electrode region includes germanium, lanthanum, hafnium, zirconium, yttrium, barium, lead, calcium, magnesium, beryllium, or lithium.

4. The IC die of claim 3 , wherein the first top electrode region has a thickness between 0.1 nanometers and 5 nanometers.

5. The IC die of claim 1 , wherein the second top electrode region includes ruthenium, iridium, copper, titanium and nitrogen, titanium, gold, platinum, silver, cobalt, molybdenum, or tungsten.

6. The IC die of claim 1 , wherein the second top electrode region has a thickness between 5 nanometers and 50 nanometers.

7. The IC die of claim 1 , wherein the first top electrode region has a different crystal phase from the bottom electrode.

8. The IC die of claim 1 , wherein the first top electrode region has a different defect density from the bottom electrode.

9. The IC die of claim 1 , wherein the capacitor is in a metallization stack of the IC die.

10. The IC die of claim 1 , wherein a difference in defect density between the first top electrode region and the bottom electrode is between 1e16 defects per cubic centimeter and 1e20 defects per cubic centimeter.

11. An integrated circuit (IC) die, comprising:
a capacitor, wherein the capacitor includes a top electrode and, a bottom electrode comprising a first bottom electrode region and a second bottom electrode region, wherein the second bottom electrode region has a different material composition than the first bottom electrode; and
a dielectric region between and in contact with the top electrode and the first bottom electrode region, wherein the dielectric region includes a polar dielectric material, the top electrode has a same material composition as the first bottom electrode region, and the top electrode has a different material structure than the first bottom electrode region, the different material structure comprising at least one of a different crystal phase and a different defect density.

12. The IC die of claim 11 , wherein the bottom electrode further includes a third bottom electrode region, the second bottom electrode region is between the first bottom electrode region and the third bottom electrode region, and the third bottom electrode region has a different material composition than the second bottom electrode region.

13. The IC die of claim 12 , wherein the bottom electrode further includes a fourth bottom electrode region, the third bottom electrode region is between the second bottom electrode region and the fourth bottom electrode region, and the fourth bottom electrode region has a different material composition than the third bottom electrode region.

14. The IC die of claim 11 , wherein the capacitor is between a topmost metal layer and a second topmost metal layer of a metallization stack.

15. The IC die of claim 11 , wherein the top electrode has a different defect density from the first bottom electrode region, and a difference in defect density between the top electrode and the first bottom electrode region is between 1e16 defects per cubic centimeter and 1e20 defects per cubic centimeter.

16. An integrated circuit (IC) die, comprising:
a capacitor, wherein the capacitor includes a top electrode region, a bottom electrode region, and a dielectric region between and in contact with the top electrode region and the bottom electrode region, wherein the dielectric region includes strontium, barium, bismuth, or lead, and the top electrode region has a different defect density from the bottom electrode region, wherein a difference in defect density between the top electrode region and the bottom electrode region is between 1e16 defects per cubic centimeter and 1e20 defects per cubic centimeter.

17. The IC die of claim 16 , wherein the capacitor is a decoupling capacitor.

Assignees

• Intel Corp

Inventors

• Chang Sou-Chi
• Lin Chia-Ching
• Oguz Kaan
• Tung I-Cheng
• Avci Uygar E
• Metz Matthew V
• Penumatcha Ashish Verma
• Young Ian A
• Sen Gupta Arnab

Classifications

• H10W20/496

  Capacitor integral with wiring layers · CPC title

• H10W44/601

  Capacitive arrangements (H10W44/20 takes precedence) · CPC title

• H10D1/682

  having dielectrics comprising perovskite structures · CPC title

• H10D1/696 Primary

  comprising multiple layers, e.g. comprising a barrier layer and a metal layer (barrier layers to prevent diffusion of hydrogen or oxygen in perovskite based capacitors H10D1/688) · CPC title

• H10D1/694

  comprising noble metals or noble metal oxides · CPC title