Substrate treating apparatus

US12224200B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12224200-B2
Application numberUS-202117394868-A
CountryUS
Kind codeB2
Filing dateAug 5, 2021
Priority dateAug 25, 2020
Publication dateFeb 11, 2025
Grant dateFeb 11, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a heating unit that irradiates a beam to the substrate and heat the substrate, and the heating unit further includes an irradiation part that irradiates the beam, and a rotation part that rotates the beam.

First claim

Opening claim text (preview).

What is claimed is: 1. A substrate treating apparatus comprising: a support unit configured to support a substrate; and a heating unit configured to irradiate a beam to the substrate and heat the substrate, wherein the heating unit further includes: an irradiation part configured to irradiate the beam; and a rotation part configured to rotate the beam and including a pair of cylindrical lenses located on a travel path of the beam irradiated by the irradiation part; wherein the pair of cylindrical lenses are configured to be rotatable and rotational directions of the pair of cylindrical lenses are the same; wherein the support unit and the heating unit are arranged on the same side with respect to the substrate. 2. The substrate treating apparatus of claim 1 , wherein each of the cylindrical lenses has a shape, one surface of which is a planar surface that is flat, and an opposite surface of which is a curved surface. 3. The substrate treating apparatus of claim 2 , wherein the planar surface of any one of the pair of cylindrical lenses and the planar surface of the other of the pair of cylindrical lenses face each other. 4. The substrate treating apparatus of claim 1 , wherein the heating unit further includes: a reflection part configured to reflect the beam that passed through the rotation part in a direction that faces the substrate. 5. The substrate treating apparatus of claim 4 , wherein the reflection part includes: a reflective mirror, of which a surface, to which the beam is input, has a flat or deflected shape. 6. The substrate treating apparatus of claim 5 , wherein the heating unit further includes: a dispersion part configured to disperse the beam reflected by the reflection part. 7. The substrate treating apparatus of claim 6 , wherein the dispersion part includes:' a lens barrel; and one or more dispersion lenses housed in the lens barrel. 8. The substrate treating apparatus of claim 7 , wherein a plurality of dispersion lenses are provided, and a relative distance of the plurality of dispersion lenses is variable. 9. The substrate treating apparatus of claim 8 , wherein the support unit further includes: a transmission plate formed of a transparent material; and a chuck pin configured to chuck the substrate while an upper surface of the transmission plate and a lower surface of the substrate are spaced apart from each other, and wherein the beam irradiated by the irradiation part is irradiated to the lower surface of the substrate. 10. The substrate treating apparatus of claim 9 , wherein the support unit further includes: a support member configured to support an edge of the transmission plate; and a rotation member configured to rotate the support member. 11. A substrate treating apparatus comprising: a support unit configured to support a substrate and optionally rotate the substrate; a liquid supply unit configured to supply a treatment liquid to the substrate; and a heating unit configured to irradiate a beam to the substrate and heat the substrate, and wherein the heating unit includes: an irradiation part configured to irradiate the beam; and a rotation part configured to rotate the beam and including a pair of cylindrical lenses located on a travel path of the beam irradiated by the irradiation part; wherein the pair of cylindrical lenses are configured to be rotatable and rotational directions of the pair of cylindrical lenses are the same; wherein the support unit and the heating unit are arranged on the same side with respect to the substrate. 12. The substrate treating apparatus of claim 11 , wherein the support unit further includes: a transmission plate formed of a transparent material; and a chuck pin configured to chuck the substrate while an upper surface of the transmission plate and a lower surface of the substrate are spaced apart from each other, and wherein the beam irradiated by the irradiation part is irradiated to the lower surface of the substrate. 13. The substrate treating apparatus of claim 12 , wherein the support unit further includes: a support member configured to support an edge of the transmission plate; and a rotation member configured to rotate the support member. 14. The substrate treating apparatus of claim 11 , wherein each of the cylindrical lenses has a shape, one surface of which is a planar surface that is flat, and an opposite surface of which is a curved surface. 15. A substrate treating apparatus comprising: a support member configured to support a substrate and formed of a transparent material; and a heating unit configured to heat the substrate by irradiating a laser beam to a lower surface of the substrate supported by the support member, wherein the heating unit includes: an irradiation part configured to irradiate the laser beam; and a rotation part configured to rotate the laser beam, and wherein the rotation part includes: a cylindrical lens located on a travel path of the laser beam irradiated by the irradiation part and configured to be rotatable. 16. The substrate treating apparatus of claim 15 , wherein rotational directions of the cylindrical lenses are the same, and wherein each of the cylindrical lenses has a shape, one surface of which is a planar surface that is flat, and an opposite surface of which is a curved surface.

Assignees

Inventors

Classifications

  • Apparatus for thermal treatment · CPC title

  • characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

  • mainly by radiation · CPC title

  • for wet cleaning or washing · CPC title

  • characterised by the construction of the shaft · CPC title

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Frequently asked questions

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What does patent US12224200B2 cover?
The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a heating unit that irradiates a beam to the substrate and heat the substrate, and the heating unit further includes an irradiation part that irradiates the beam, and a rotation part that rotates the beam.
Who is the assignee on this patent?
Semes Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/7618. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 11 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).