Thin film resistor

Patent metadata

Field	Value
Publication number	US-12224089-B2
Application number	US-202217716276-A
Country	US
Kind code	B2
Filing date	Apr 8, 2022
Priority date	Apr 8, 2022
Publication date	Feb 11, 2025
Grant date	Feb 11, 2025

Abstract

The present disclosure relates to semiconductor structures and, more particularly, to a thin film resistor and methods of manufacture. A structure includes: a thin film resistor having an opening and being between an upper insulator material and a lower insulator material; and a contact extending through the opening in the thin film resistor and into the lower insulator material.

First claim

What is claimed:

1. A structure comprising:
a thin film resistor comprising an opening and being between an upper insulator material and a lower insulator material; and
a contact extending through the opening in the thin film resistor and into the lower insulator material, wherein a sidewall of the contact physically contacts ends of the thin film resistor within the opening.

2. The structure of claim 1 , wherein the thin film resistor comprises SiCr.

3. The structure of claim 1 , wherein a minimum depth “x” of the contact into the lower insulator material is about 20 times a thickness of the thin film resistor.

4. The structure of claim 1 , wherein a minimum depth of the contact extending into the lower insulator material is about 40% of a thickness of the lower insulator material.

5. The structure of claim 1 , wherein a maximum depth of the contact extending into the lower insulator material is about 70% of a thickness of the lower insulator material.

6. The structure of claim 1 , wherein the contact comprises an overhang on an upper surface of the thin film resistor.

7. The structure of claim 6 , wherein the contact comprises a riveting layout.

8. The structure of claim 7 , wherein the contact comprises an upper-cross sectional area larger than a lower cross-sectional area, a junction between the upper cross-sectional area and the lower cross-sectional area comprises the overhang, and the lower cross-sectional area extends through the opening and into the lower insulator material.

9. A structure comprising:
a lower insulator material comprising a gouge;
a thin film resistor comprising an opening aligned with the gouge of the lower insulator material;
an upper insulator material comprising an opening aligned with the gouge of the lower insulator material and the opening of the thin film resistor; and
a contact extending through the openings of the thin film resistor and the upper insulator material and the gouge of the lower insulator material, the contact physically contacting ends of the thin film resistor within the opening of the thin film resistor.

10. The structure of claim 9 , wherein the thin film resistor comprises SiCr.

11. The structure of claim 9 , wherein the contact comprises a riveting layout.

12. The structure of claim 11 , wherein the contact comprises an overhang on an upper surface of the thin film resistor.

13. The structure of claim 12 , wherein the contact comprises an upper-cross sectional area larger than a lower cross-sectional area and a junction between the upper cross-sectional area and the lower cross-sectional area comprises the overhang.

14. The structure of claim 9 , wherein the thin film resistor comprises a thickness of about 25 Å to 30 Å.

15. The structure of claim 14 , wherein a minimum depth of the contact into the lower insulator material is about 20 times a thickness of the thin film resistor.

16. The structure of claim 14 , wherein a thickness of the lower insulator material is about 50 times a thickness of the thin film resistor.

17. The structure of claim 16 , wherein a minimum depth of the contact extending into the lower insulator material is about 40% of a thickness of the lower insulator material.

18. The structure of claim 16 , wherein a maximum depth of the contact into the lower insulator material is about 70% of a thickness of the lower insulator material.

19. A method comprising:
forming a thin film resistor on a lower insulator material;
forming an upper insulator material on the thin film resistor;
forming a trench into the upper insulator material, through the thin film resistor and into the lower insulator material below the thin film resistor;
forming a barrier liner on sidewalls of the trench, with the barrier liner contacting an upper surface of the thin film resistor and ends of the thin film resistor.

Assignees

• Globalfoundries Sg Pte Ltd

Inventors

• Wang Chuan
• Seet Chim Seng
• Setiawan Yudi

Classifications

• H10W20/498

  Resistive arrangements or effects of, or between, wiring layers · CPC title

• H10W20/435

  Cross-sectional shapes or dispositions of interconnections · CPC title

• H10W20/081

  by forming openings in the dielectric parts · CPC title

• H01C17/08

  by vapour deposition · CPC title

• H01C7/006 Primary

  Thin film resistors · CPC title