Wearable device

Patent metadata

Field	Value
Publication number	US-12222246-B2
Application number	US-202318330371-A
Country	US
Kind code	B2
Filing date	Jun 7, 2023
Priority date	Mar 20, 2015
Publication date	Feb 11, 2025
Grant date	Feb 11, 2025

Abstract

A wearable device includes a case and a temperature sensing device. The case has a first opening. The temperature sensing device is disposed inside the case of the wearable device. The temperature sensing device includes a first substrate, a sensor chip, and a metal shielding structure. The sensor chip is disposed on the first substrate. The metal shielding structure surrounds the sensor chip, and has a second opening. The sensor chip faces towards the first opening and the second opening.

First claim

What is claimed is:

1. A wearable device, comprising:
a case having a first opening; and
a temperature sensing device disposed inside the case of the wearable device, and the temperature sensing device including:
a first substrate;
a sensor chip which is disposed on the first substrate; and
a metal shielding structure which surrounds the sensor chip, wherein the metal shielding structure has a second opening, and the sensor chip faces towards the first opening and the second opening.

2. The wearable device as claimed in claim 1 , wherein the temperature sensing device further comprises:
a second substrate disposed in the case; and
a waterproof structure disposed in the first opening of the case;
wherein the waterproof structure is used to enclose the case.

3. The wearable device as claimed in claim 1 , wherein the sensor chip is electrically connected to the first substrate by at least one wire.

4. The wearable device as claimed in claim 2 , wherein the waterproof structure is an infrared passing structure.

5. The wearable device as claimed in claim 2 , wherein the first substrate is disposed on the second substrate.

6. The wearable device as claimed in claim 1 , wherein the sensor chip is configured to detect a far infrared which has a wavelength ranging from 15 to 1000 μm.

7. The wearable device as claimed in claim 1 , wherein the metal shielding structure is configured to block the noise generated from other sensors and external electronic products, and prevent other far infrared from passing into the case.

8. The wearable device as claimed in claim 1 , wherein the case is a watch case of a smartwatch, the first substrate is a SMD substrate or a CLCC substrate, and the sensor chip is a far infrared sensor chip.

9. The wearable device as claimed in claim 2 , wherein the second substrate is a PCB and the waterproof structure is a waterproof glue or a waterproof layer.

10. A wearable device, comprising:
a case having a first opening;
a far infrared temperature sensing device disposed inside the case of the wearable device, and the far infrared temperature sensing device including:
a first substrate;
a sensor chip which is disposed on the first substrate; and
a metal shielding structure which is disposed on the first substrate and surrounds the sensor chip, wherein the metal shielding structure has a second opening; and

at least one of a heart sensor, a blood pressure sensor, a blood sugar sensor and a blood oxygen sensor, disposed simultaneously inside the case of the wearable device.

11. A wearable device, comprising:
a case having a first opening;
a far infrared temperature sensing device disposed inside the case of the wearable device, and the far infrared temperature sensing device including:
a first substrate;
a sensor chip which is disposed on the first substrate; and
a metal shielding structure which is disposed on the first substrate and surrounds the sensor chip, wherein the metal shielding structure has a second opening; and

an optical sensor disposed inside the case of the wearable device, wherein the optical sensor is disposed outside the metal shielding structure.

Assignees

• Pixart Imaging Inc

Inventors

• Sun Chih-Ming
• Tsai Ming-Han
• Tsai Cheng-Nan

Classifications

• H04N5/33

  Transforming infrared radiation (cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20) · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• B81B7/0067

  for controlling the passage of optical signals through the package · CPC title

• B81B7/0064

  for protecting against electromagnetic or electrostatic interferences · CPC title

• G01J5/06

  Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity (for adjusting of solid angle of collected radiation G01J5/07; means for wavelength selection G01J5/0801) · CPC title