Cooling device and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-12219735-B2
Application number	US-202017425181-A
Country	US
Kind code	B2
Filing date	May 15, 2020
Priority date	May 28, 2019
Publication date	Feb 4, 2025
Grant date	Feb 4, 2025

Abstract

A cooling device, including at least one of following: a casing and a flow channel that is disposed inside the casing, the casing including a metal portion and a resin portion that is bonded to at least a portion of the metal portion; a casing that includes a metal, a flow channel that is disposed inside the casing, and a component that includes a resin and is bonded to a surface of the casing, and a method of manufacturing the cooling device including the steps of a first process of bonding the component to the first metal member by injection molding and a second process of connecting the second metal member with the first metal member to which the component is bonded.

First claim

The invention claimed is:

1. A cooling device, comprising a casing and a flow channel inside the casing, the casing comprising a first metal portion, a second metal portion and a resin portion, wherein each of the first metal portion and the second metal portion has a principal surface, the principal surface of the first metal portion faces the principal surface of the second metal portion, the principal surface of the first metal portion and the principal surface of the second metal portion are principal surfaces of the casing, the principal surface of the first metal portion has a concave-and-convex pattern corresponding to a shape of the flow channel, the resin portion is between the first metal portion and the second metal portion, the resin portion is bonded to each of the first metal portion and the second metal portion, thereby connecting the first metal portion with second metal portion, a convex part of the concave-and-convex pattern of the principal surface of the first metal portion is in direct contact with the principal surface of the second metal portion.

2. The cooling device according to claim 1 , wherein the resin portion is bonded to a roughened surface of at least one of the first metal portion and the second metal portion.

3. The cooling device according to claim 1 , wherein the resin portion is disposed at a periphery of the casing.

4. The cooling device according to claim 3 , wherein the resin portion has a ribbon shape along the periphery of the casing.

5. A method of manufacturing a cooling device, the cooling device comprising a casing including a first metal member and a second metal member, a flow channel inside the casing, and a resin component, the method comprising:
bonding the resin component to the first metal member by injection molding; and
then providing by injection molding a resin member between the first metal member and the second metal member having a concave-and-convex pattern corresponding to a shape of the flow channel and thereby connecting the second metal member with the first metal member previously bonded to the resin component.

6. The method of manufacturing a cooling device according to claim 5 , further comprising forming the flow channel within the second metal member, wherein the flow channel is integrally formed within the second metal member, wherein said forming is performed prior to said connecting the second metal member with the first metal member.

7. The method of manufacturing a cooling device according to claim 5 , wherein said bonding comprises bonding the resin component to a roughened surface of the first metal member.

Assignees

• Mitsui Chemicals Inc

Inventors

• Tominaga Takahiro
• Kimura Kazuki

Classifications

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• F28F21/081

  Heat exchange elements made from metals or metal alloys · CPC title

• F28F3/10

  Arrangements for sealing the margins · CPC title

• F28F21/067 Primary

  Details · CPC title