Terminal device

US12219714B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12219714-B2
Application numberUS-202217756606-A
CountryUS
Kind codeB2
Filing dateJan 18, 2022
Priority dateJun 30, 2021
Publication dateFeb 4, 2025
Grant dateFeb 4, 2025

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A terminal device comprises a component and a circuit board. The circuit board comprises a circuit substrate and a solder mask layer, and wherein the circuit substrate comprises a medium layer and a circuit layer stacked with the medium layer. Openings with different depths are provided in the circuit board, and at least part of the component is accommodated in or arranged corresponding to the opening. This lowers an installation height between the component and the circuit board without affecting their performance.

First claim

Opening claim text (preview).

What is claimed is: 1. A terminal device, comprising: a decorative part; a lens module; and a circuit board; wherein the decorative part is located on a side of the lens module that faces away from the circuit board; the lens module is connected to the circuit board; wherein the circuit board comprises a circuit substrate and a solder mask layer, and the solder mask layer is located on a surface of the circuit substrate; and wherein the circuit board comprises an opening, the opening penetrates through the solder mask layer, at least part of the lens module is accommodated in the opening, and wherein the part of the lens module accommodated in the opening is electrically insulated from a surface of the circuit board. 2. The terminal device according to claim 1 , wherein the decorative part covers the lens module. 3. The terminal device according to claim 2 , wherein the decorative part comprises a convex portion. 4. The terminal device according to claim 1 , wherein a bottom surface of the lens module that is accommodated in the opening is electrically insulated from the surface of the circuit board. 5. The terminal device according to claim 1 , wherein the lens module is insulated from a surface of the lens module that faces the circuit board. 6. The terminal device according to claim 1 , wherein at least part of the surface of the circuit substrate exposed in the opening is a circuit layer, the circuit layer is configured for routing electrical connections in the circuit board, and the part of the lens module accommodated in the opening is electrically insulated from a surface of the circuit layer. 7. The terminal device according to claim 6 , wherein a surface of the lens module that faces the circuit board comprises an insulating material. 8. The terminal device according to claim 6 , wherein the terminal device further comprises a connecting member, and the connecting member is connected to a surface of the lens module that does not face the circuit board. 9. The terminal device according to claim 1 , wherein another part of the lens module protrudes from the circuit board. 10. The terminal device according to claim 1 , wherein the solder mask layer is an oil layer. 11. The terminal device according to claim 1 , wherein the circuit substrate comprises a medium layer and a circuit layer stacked with the medium layer. 12. The terminal device according to claim 1 , wherein the circuit substrate is a multi-layer circuit substrate. 13. A terminal device, comprising: a decorative part; a lens module; and a circuit board; wherein the decorative part is located on a side of the lens module that faces away from the circuit board and the decorative part covers the lens module; wherein the lens module is connected to the circuit board; wherein the circuit board comprises a circuit substrate and a solder mask layer, the solder mask layer is located on a surface of the circuit substrate, and wherein the circuit substrate comprises a medium layer and a circuit layer stacked with the medium layer; and wherein the circuit board comprises an opening, the opening penetrates through the solder mask layer, at least part of the lens module is accommodated in the opening, and wherein the part of the lens module accommodated in the opening is electrically insulated from the surface of the circuit board. 14. The terminal device according to claim 13 , wherein the decorative part comprises a convex portion. 15. The terminal device according to claim 13 , wherein a bottom surface of the lens module that is accommodated in the opening is electrically insulated from the surface of the circuit board. 16. The terminal device according to claim 13 , wherein the lens module is insulated from a surface of the lens module that faces the circuit board. 17. The terminal device according to claim 13 , wherein the surface of the circuit substrate exposed in the opening is a circuit layer, and the part of the lens module accommodated in the opening is electrically insulated from the surface of the circuit layer. 18. The terminal device according to claim 17 , wherein a surface of the lens module comprises an insulating material. 19. The terminal device according to claim 13 , further comprising a connecting member, and the connecting member is connected to a surface of the lens module that does not face the circuit board. 20. The terminal device according to claim 13 , wherein another part of the lens module protrudes from the circuit board.

Assignees

Inventors

Classifications

  • Optical component, e.g. opto-electronic component · CPC title

  • Solder masks · CPC title

  • Holes or slots in insulating substrate not used for electrical connections · CPC title

  • Recesses or grooves in insulating substrate · CPC title

  • Coating free areas, e.g. areas other than pads or lands free of solder resist · CPC title

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Frequently asked questions

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What does patent US12219714B2 cover?
A terminal device comprises a component and a circuit board. The circuit board comprises a circuit substrate and a solder mask layer, and wherein the circuit substrate comprises a medium layer and a circuit layer stacked with the medium layer. Openings with different depths are provided in the circuit board, and at least part of the component is accommodated in or arranged corresponding to the …
Who is the assignee on this patent?
Honor Device Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05K1/183. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 04 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).