Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device

Patent metadata

Field	Value
Publication number	US-12216404-B2
Application number	US-202017106170-A
Country	US
Kind code	B2
Filing date	Nov 29, 2020
Priority date	Aug 29, 2018
Publication date	Feb 4, 2025
Grant date	Feb 4, 2025

Abstract

An actinic ray-sensitive or radiation-sensitive resin composition includes a photoacid generator A that generates an acid represented by General Formula (I), the acid having a pKa of −1.00 or more; one or more selected from the group consisting of a photoacid generator B that generates an acid having a pKa larger than that of an acid generated from the photoacid generator A by 1.00 or more, and a nitrogen-containing compound C having a pKa of a conjugate acid thereof larger than that of the acid generated from the photoacid generator A by 1.00 or more; and an acid-decomposable resin, in which in a case where the actinic ray-sensitive or radiation-sensitive resin composition includes a photoacid generator D that generates an acid having a pKa of less than −1.00, a ratio of the number of moles of the photoacid generator A to the number of moles of the photoacid generator D in the composition, is 1.0 or more.

First claim

What is claimed is:

1. An actinic ray-sensitive or radiation-sensitive resin composition comprising:
a photoacid generator A that generates an acid having a pKa of −1.00 or more;
one or more selected from the group consisting of a photoacid generator B that generates an acid having a pKa larger than that of an acid generated from the photoacid generator A by 1.00 or more, and a nitrogen-containing compound C having a pKa of a conjugate acid thereof larger than that of the acid generated from the photoacid generator A by 1.00 or more; and
an acid-decomposable resin,
wherein the actinic ray-sensitive or radiation-sensitive resin composition may further include a photoacid generator D that is a compound different from the nitrogen-containing compound C and generates an acid having a pKa of less than −1.00, and
in a case where the actinic ray-sensitive or radiation-sensitive resin composition includes the photoacid generator D, a ratio of the number of moles of the photoacid generator A to the number of moles of the photoacid generator D in the actinic ray-sensitive or radiation-sensitive resin composition, is 1.0 or more,
wherein, the photoacid generator A is any one selected from the group consisting of PAG-4, PAG-6, PAG-11, PAG-14 to PAG-16, PAG-18 and PAG-20,

2. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ,
wherein the acid-decomposable resin is a methacrylic ester-based resin.

3. A resist film formed from the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 .

4. A pattern forming method comprising:
forming a resist film using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 on a support;
exposing the resist film; and
developing the exposed resist film using a developer.

5. A method for manufacturing an electronic device, comprising the pattern forming method according to claim 4 .

Assignees

• Fujifilm Corp

Inventors

• KOJIMA Masafumi
• Uemura Minoru
• Kawashima Takashi
• Goto Akiyoshi
• Yamamoto Kei
• Marumo Kazuhiro
• OU Keiyu

Classifications

• G03F7/32

  Liquid compositions therefor, e.g. developers · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

• G03F7/0382

  the macromolecular compound being present in a chemically amplified negative photoresist composition · CPC title

• C08L33/10

  Homopolymers or copolymers of methacrylic acid esters · CPC title

• G03F7/26

  Processing photosensitive materials; Apparatus therefor (G03F7/12 - G03F7/24 take precedence) · CPC title