Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board

Patent metadata

Field	Value
Publication number	US-12213249-B2
Application number	US-202117632016-A
Country	US
Kind code	B2
Filing date	May 11, 2021
Priority date	May 18, 2020
Publication date	Jan 28, 2025
Grant date	Jan 28, 2025

Abstract

A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding. A mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater. An average particle diameter of the silica is 0.1 μm or greater but 3.0 μm or less. A reduction ratio of the extrusion molding is 8 or less.

First claim

The invention claimed is:

1. A dielectric sheet comprising:
spherical silica, and polytetrafluoroethylene, wherein:
a mass ratio of the spherical silica with respect to the polytetrafluoroethylene is 1.3 or greater,
a ratio of a maximum tensile elongation with respect to a minimum tensile elongation is 1.5 or less, and the minimum tensile elongation is 40% or greater, and
the spherical silica includes a first silica having an average particle diameter of 0.1 μm or greater but 0.9 μm or less, and a second silica having an average particle diameter of 4.0 μm or greater but 9.0 μm or less.

2. The dielectric sheet as claimed in claim 1 , wherein, in a longitudinal cross section in a thickness direction, the dielectric sheet has a layered first phase including the polytetrafluoroethylene as a main component, and a layered second phase including the spherical silica as a main component.

3. The dielectric sheet as claimed in claim 2 , wherein the first phase has a thickness of 0.1 μm or greater but 10.0 μm or less.

4. The dielectric sheet as claimed in claim 1 , wherein the spherical silica includes an alkyl group having a carbon number of 4 or greater on a surface of the spherical silica.

5. The dielectric sheet as claimed in claim 4 , wherein the spherical silica does not include a functional group other than the alkyl group on the surface of the spherical silica.

6. A substrate for a high-frequency printed wiring board, comprising:
the dielectric sheet according to claim 1 ; and
a copper film laminated directly or indirectly on the surface of the dielectric sheet.

7. The substrate for the high-frequency printed wiring board as claimed in claim 6 , wherein a maximum height roughness Rz of the copper film at a surface of the copper film on the side of the dielectric sheet is less than or equal to 2 μm.

8. The substrate for the high-frequency printed wiring board as claimed in claim 6 , wherein the copper film is laminated on the surface of the dielectric sheet via an adhesive layer including a fluororesin as a main component.

9. A dielectric sheet comprising:
a mixture of spherical silica and polytetrafluoroethylene formed by an extrusion molding, wherein:
a mass ratio of the spherical silica with respect to the polytetrafluoroethylene is 1.3 or greater,
a ratio of a maximum tensile elongation with respect to a minimum tensile elongation is 1.5 or less, and the minimum tensile elongation is 40% or greater,
a reduction ratio of the extrusion molding of the mixture is 2 or greater but 8 or less, and
the spherical silica includes a first silica having an average particle diameter of 0.1 μm or greater but 0.9 μm or less, and a second silica having an average particle diameter of 4.0 μm or greater but 9.0 μm or less.

Assignees

• Sumitomo Electric Industries
• Sumitomo Electric Printed Circuits Inc

Inventors

• Kaimori Shingo
• Ninomiya Takashi
• Sugiura Motohiko
• Okuda Yasuhiro
• Kashihara Hideki
• KIYA Satoshi
• Nakabayashi Makoto
• Okamoto Kentaro
• Tokuda Chiaki

Classifications

• H05K2201/0266

  Size distribution · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• H05K2201/015

  Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] · CPC title

• H05K3/386

  by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title

• H05K3/022

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title