Heat sink and communication device

Patent metadata

Field	Value
Publication number	US-12207447-B2
Application number	US-202318151566-A
Country	US
Kind code	B2
Filing date	Jan 9, 2023
Priority date	Jul 10, 2020
Publication date	Jan 21, 2025
Grant date	Jan 21, 2025

Abstract

A heat sink is provided. The heat sink includes a base board and a rib board. The base board includes a base board cavity, and the rib board includes a rib board cavity. The base board includes a first board face and a second board face. A groove is disposed on the second board face. The base board cavity is filled with a liquid working medium. The rib board includes at least one partition board. The at least one partition board separates the rib board cavity into at least two chambers. The at least two chambers are separately connected to the base board cavity. One end of the rib board is inserted in the base board through the groove. One end of the partition board is located in the base board. A communication device that includes the heat sink is also provided.

First claim

What is claimed is:

1. A heat sink, comprising a base board and one or more rib boards, wherein the base board comprises a base board cavity, and each rib board comprises a rib board cavity, wherein the base board comprises a first board face and a second board face, the second board face is provided with a plurality of grooves that are in one-to-one correspondence with the one or more rib boards, and a liquid working medium is filled in the base board cavity; one end of each rib board of the one or more rib boards is inserted in the base board cavity through a groove corresponding to the rib board, the base board cavity is connected to the rib board cavity of said each rib board, said each rib board comprises at least one partition board, the at least one partition board separates the rib board cavity into at least two chambers, one end of the at least one partition board is located in the base board cavity, and the at least two chambers are separately connected to the base board cavity; wherein the base board and the one or more rib boards are configured to enable a vapor working medium, produced by evaporation of at least a part of the liquid working medium in the base board cavity when the base board is heated, to enter the rib board cavity of at least one of the one or more rib boards; and the one or more rib boards are further configured to enable the vapor working medium to condense to become the liquid working medium again and then is refluxed to the base board cavity along the partition board;
wherein a board face of a rib board of the one or more rib boards is provided with a plurality of openings, and the plurality of openings are disposed at an end part that is of the rib board and that is inserted in the base board cavity; wherein a combining groove is disposed on an inner surface of the first board face of the base board and wherein a groove edge of the combining groove is a protrusion structure, the end part that is of the rib board and that is inserted in the base board cavity is provided with an opening, and the protrusion structure is inserted in the opening.

2. The heat sink according to claim 1 , wherein a board face of a rib board of the one or more rib boards is provided with a plurality of openings, and the plurality of openings are disposed at an end part that is of the rib board and that is inserted in the base board cavity.

3. The heat sink according to claim 1 , wherein the base board and the one or more rib boards are further configured to have, when the heat sink is arranged vertically in parallel to a gravity direction, an included angle between the at least one partition board and the gravity direction that is greater than or equal to 1° and less than or equal to 90°.

4. The heat sink according to claim 3 , wherein the included angle between the at least one partition board and the gravity direction is greater than or equal to 45° and less than or equal to 85°.

5. The heat sink according to claim 1 , wherein a rib plate is disposed on an external surface of a rib board of the one or more rib boards.

6. The heat sink according to claim 1 , wherein the one or more rib boards comprise a plurality of rib boards arranged side by side at intervals, and when the heat sink is arranged vertically in parallel to a gravity direction, an included angle between an arrangement direction of the plurality of rib boards and the gravity direction is 90°, or an included angle between an arrangement direction of the plurality of rib boards and the gravity direction is greater than or equal to 10° and less than 90°; or the plurality of rib boards are in a V-shaped layout; or the plurality of rib boards are in an inverted V-shaped layout; or the plurality of rib boards are in a W-shaped layout.

7. The heat sink according to claim 1 , wherein a quantity of combining grooves is the same as a quantity of components from which heat is to be dissipated, and the combining grooves are disposed in one-to-one correspondence with the components from which heat is to be dissipated.

8. The heat sink according to claim 1 , wherein after being inserted in the base board cavity, each rib board abuts against an inner surface of the first board face.

9. The heat sink according to claim 1 , wherein a capillary flow guide structure is further disposed on an inner surface of the first board face of the base board.

10. The heat sink according to claim 1 , wherein a column is further disposed on an inner surface of the first board face of the base board.

11. The heat sink according to claim 10 , wherein one end that is of the column and that is away from the first board face abuts against an inner surface of the second board face.

12. The heat sink according to claim 1 , wherein a liquid injection opening is disposed at an end part of the base board.

13. A communication device, comprising a component from which heat is to be dissipated and a heat sink, wherein, the heat sink comprises: a base board and one or more rib boards, wherein the base board is in contact with the component from which heat is to be dissipated, wherein the base board comprises a base board cavity, and each rib board comprises a rib board cavity, wherein the base board comprises a first board face and a second board face, the second board face is provided with a plurality of grooves that are in one-to-one correspondence with the one or more rib boards, and a liquid working medium is filled in the base board cavity; one end of each rib board of the one or more rib boards is inserted in the base board cavity through a groove corresponding to the rib board, the base board cavity is connected to the rib board cavity of said each rib board, said each rib board comprises at least one partition board, the at least one partition board separates the rib board cavity into at least two chambers, one end of the at least one partition board is located in the base board cavity, and the at least two chambers are separately connected to the base board cavity; wherein the base board and the one or more rib boards are configured to enable a vapor working medium, produced by evaporation of at least a part of the liquid working medium in the base board cavity when the base board is heated, to enter the rib board cavity of at least one of the one or more rib boards; and the one or more rib boards are further configured to enable the vapor working medium to condense to become the liquid working medium again and then is refluxed to the base board cavity along the partition board;
wherein a board face of a rib board of the one or more rib boards is provided with a plurality of openings, and the plurality of openings are disposed at an end part that is of the rib board and that is inserted in the base board cavity; wherein a combining groove is disposed on an inner surface of the first board face of the base board and wherein a groove edge of the combining groove is a protrusion structure, the end part that is of the rib board and that is inserted in the base board cavity is provided with an opening, and the protrusion structure is inserted in the opening.

14. The communication device according to claim 13 , wherein the base board and the one or more rib boards are further configured to have, when the heat sink is arranged vertically in parallel to a gravity direction, an included angle between the at least one partition board and the gravity direction that is greater than or equal to 1° and less than or equal to 90°.

15. The communication device according to claim 14 , wherein the included angle between the at least one partition board and the gravity direction is greater than or equal to 45° and less than

Assignees

• Huawei Tech Co Ltd

Inventors

• Hong Yuping
• Hui Xiaowei
• Wang Meng

Classifications

• H05K7/20318

  Condensers · CPC title

• H04B1/036

  Cooling arrangements · CPC title

• F28F2215/06

  Hollow fins; fins with internal circuits · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• H05K7/2029

  using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title