Heat transfer chassis and method for forming the same

Patent metadata

Field	Value
Publication number	US-10032693-B2
Application number	US-201514918082-A
Country	US
Kind code	B2
Filing date	Oct 20, 2015
Priority date	Oct 20, 2015
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

A system includes a front plate, a manifold cover, and bridge heat sinks. The manifold cover is secured to the front plate to define a fluid distribution chamber along a front side of the front plate. The manifold cover defines a port opening through which a cooling fluid is received from outside of the manifold cover. The bridge heat sinks extend rearward from a back side of the front plate. The bridge heat sinks define fluid channels that are fluidly connected with the fluid distribution chamber through corresponding slots in the front plate. The fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.

First claim

What is claimed is:

1. A system comprising:
a front plate having multiple slots therethrough and multiple cooling fins located between the slots;
a manifold cover secured to the front plate to define a fluid distribution chamber along the front plate, the manifold cover defining a port opening through which a cooling fluid is received from outside of the manifold cover;
a rear plate spaced apart from the front plate, the rear plate having multiple slots therethrough that are aligned with the slots in the front plate along directions that extend from the front plate to the rear plate; and
bridge heat sinks extending away from the front plate and toward the rear plate, the bridge heat sinks defining multiple separate fluid channels that are aligned with and fluidly connected with the fluid distribution chamber through the slots in the front plate, the cooling fins of the front plate spaced apart from the bridge heat sinks, wherein each of the separate fluid channels is aligned with and fluidly coupled with a different slot of the slots in the rear plate,
wherein the fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks,
wherein the slots in the rear plate are positioned to separately direct different portions of the cooling fluid out of the rear plate without mixing the different portions of the cooling fluid inside the rear plate.

2. The system of claim 1 , wherein the fluid distribution chamber is configured to receive ambient air as the cooling fluid.

3. The system of claim 1 , wherein the front plate and the bridge heat sinks are electrically conductive, the front plate being joined to the bridge heat sinks at respective front chassis joints that are also electrically conductive, the front plate and the bridge heat sinks defining a ground path that extends across the front chassis joints to electrically ground at least one of the one or more electronics packages to an electronic ground reference.

4. The system of claim 1 , wherein the bridge heat sinks are spaced apart from each other along a width of the front plate to define one or more cavities between adjacent bridge heat sinks that are shaped and sized to receive the one or more electronics packages.

5. The system of claim 4 , wherein the one or more cavities defined between the bridge heat sinks are configured to receive two or more of the electronics packages such that a first bridge heat sink of the bridge heat sinks is thermally engaged with a first electronics package of the two or more electronics packages and a second bridge heat sink of the bridge heat sinks is thermally engaged with a second electronics package of the two or more electronics packages.

6. The system of claim 1 , wherein at least one of the bridge heat sinks includes a base plate and a fin plate joined together to define the fluid channel of the at least one bridge heat sink, the base plate being joined to the fin plate along a top interface and a bottom interface, the fin plate including plural fins that protrude from an interior surface of the fin plate toward the base plate.

7. The system of claim 6 , wherein the at least one bridge heat sink includes a metallic filler material disposed along the top interface and the bottom interface between the base plate and the fin plate, the metallic filler material configured to fuse the base plate to the fin plate and seal the top and bottom interfaces responsive to application of heat at one or more temperatures above a melting point of the metallic filler material and below one or more melting points of the base plate and the fin plate.

8. The system of claim 1 , wherein the rear plate includes an array of fins that protrude from the rear plate.

9. The system of claim 1 , wherein the manifold cover includes a base wall and multiple side walls that extend from edges of the base wall to the front plate, the fluid distribution chamber being at least partially defined between the base wall and the front side of the front plate, the port opening of the manifold cover extending through one of the side walls.

10. The system of claim 1 , wherein front ends of the bridge heat sinks engage the front plate at respective front chassis joints, and further including a metallic filler material disposed along the front chassis joints, the metallic filler material configured to fuse the bridge heat sinks to the front plate and seal the front chassis joints responsive to an application of heat at one or more temperatures above a melting point of the metallic filler material and below one or more melting points of the front plate and the bridge heat sinks.

11. The system of claim 1 , wherein the bridge heat sinks include side walls that face the one or more electronics packages, the side wall of at least one of the bridge heat sinks configured to thermally engage at least one of the electronics packages by abutting a thermally conductive panel of the at least one electronics package.

12. The system of claim 1 , wherein the bridge heat sinks include side walls and at least one of the bridge heat sinks includes a front ledge at a front end of the at least one bridge heat sink and a rear ledge at a rear end of the at least one bridge heat sink, the front and rear ledges projecting beyond the side wall of the at least one bridge heat sink and configured to abut a thermally conductive panel of at least one of the electronics packages without the side wall engaging the at least one electronics package.

13. The system of claim 1 , wherein the bridge heat sinks extend parallel to one another and generally perpendicular to the front plate.

14. The system of claim 1 , wherein the bridge heat sinks extend longitudinally between front ends and rear ends, the front ends of the bridge heat sinks joined to the front plate,
wherein the front plate and the bridge heat sinks are electrically conductive, the front plate being joined to the bridge heat sinks at respective front chassis joints that also are electrically conductive, the front plate and the bridge heat sinks defining a ground path that extends across the front chassis joints to electrically ground at least one of the electronics packages to an electronic ground reference; and
wherein the bridge heat sinks extend parallel to one another and generally perpendicular to the front plate and are spaced apart from each other along a width of the front plate and the rear plate to define cavities between adjacent bridge heat sinks that are shaped and sized to receive the one or more electronics packages.

15. The system of claim 1 , wherein front ends of the bridge heat sinks engage the front plate at respective front chassis joints, the bridge heat sinks being fused to the front chassis joints by a fused metallic filler material disposed along the front chassis joints, the metallic filler material having a melting point above an operational temperature of the system and below one or more melting points of the front plate and the bridge heat sinks.

16. The system of claim 1 , wherein the cooling fins of the front plate extend into the fluid distribution chamber towards the manifold cover.

17. A method comprising:
coupling a plurality of bridge heat sinks between a front plate and a rear plate to form a chassis assembly, the bridge heat sinks each including a fluid channel that extends through the bridge heat sink from the front plate to the rear plate, the fluid channels of the bridge heat sinks be

Assignees

• Gen Electric

Inventors

• Krivonak Andrew Louis
• Perlaguri Shreenath Shekar
• Yammanuru Rajendra
• Radhakrishnan Arunpandi
• Brown Theodore Clark

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/43 Primary

  by flowing gases, e.g. forced air cooling · CPC title

• B23K1/00

  Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence) · CPC title

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title

• B23K2101/36

  Electric or electronic devices · CPC title