System and method for chemical mechanical polishing pad replacement

Patent metadata

Field	Value
Publication number	US-12202094-B2
Application number	US-202217579775-A
Country	US
Kind code	B2
Filing date	Jan 20, 2022
Priority date	Jul 9, 2021
Publication date	Jan 21, 2025
Grant date	Jan 21, 2025

Abstract

A system and method for chemical mechanical polishing (“CMP”) pad replacement on a CMP processing tool. A platen carrier having two or more platens is positioned within a platen cleaning process module. Each platen includes a CMP pad affixed thereto, and is capable of being independently rotated during operations. When a pad requires replacement, the platen carrier rotates towards a pad tearer tool, which extends and pivots to remove the used pad from the platen as the carrier rotates. A pad tape replacement module is positioned above the CMP tool with pad tape extending from a supply roll to a recycle roll. As the pad tape transits through the module, a backing of the tape is separated and recycled. A pad disposed in the pad tape is then applied to a platen via a pressure roller.

First claim

What is claimed is:

1. A method for in-situ chemical mechanical polishing (CMP) pad replacement in an associated CMP tool, comprising:
receiving, at a controller including a processor in communication with memory, an output from a pad wear detection module corresponding to a state of a CMP pad on a first platen of a plurality of platens of a platen carrier;
positioning a pad tape replacement module proximate to the first platen responsive to an output of the pad wear detection module, the pad tape replacement module including a pad tape supply having a plurality of pads disposed therein;
rotating the platen carrier toward a pad tearer tool movably positioned adjacent to the platen carrier;
engaging the pad tearer tool to remove the CMP pad on the first platen; and
rolling, via a pressure roller of the pad tape replacement module, a pad disposed in the pad tape supply onto a second platen of the plurality of platens of the platen carrier.

2. The method of claim 1 , further comprising detecting, via a pad bubble detection module, at least one deformity in the pad on the second platen.

3. The method of claim 2 , further comprising rotating the platen carrier toward the pad tearer tool to remove the pad on the second platen.

4. The method of claim 1 , further comprising advancing the pad tape supply to position a new pad over the second platen.

5. The method of claim 4 , further comprising separating a backing layer from the pad tape supply prior to advancing the pad tape supply.

6. The method of claim 1 , further comprising generating an alert responsive to an output of the pad wear detection module.

7. The method of claim 1 , wherein the pad tape replacement module comprises: a pad tape supply, a backing recycle roller, the pressure roller, and a pad tape recycle roller.

8. The method of claim 1 , wherein the platen carrier is four-platen carrier or a two platen carrier.

9. The method of claim 1 , wherein the pad tape comprises a pad layer, a backing layer, and an adhesive.

10. The method of claim 1 , wherein the pad tape is precut into pads corresponding to a size of each of the plurality of platens.

11. A chemical mechanical polishing (CMP) pad replacement system comprising:
a pad tape replacement module configured to removably engage a first and second rotatable platen of an associated CMP processing tool,
the CMP processing tool comprising:
a rotatable platen carrier including the first rotatable platen and the second rotatable platen,
a first CMP pad affixed to the first rotatable platen,
a pad wear detection module configured to output a state of the first CMP pad affixed to the first rotatable platen, and
a pad tearer tool configured to rotate and engage the first rotatable platen to remove the first CMP pad therefrom;
the pad tape replacement module comprising:
a pad tape supply roller storing pad tape,
at least one backing removal roller,
a backing recycle roller,
a pressure roller, and
a pad tape recycle roller; and
a CMP tool controller in data communication with the pad tape replacement module and the CMP processing tool, and the CMP tool controller including a processor in communication with a memory, wherein the memory stores instructions which are executed by the processor causing the processor to:
receive an output from a wear detection sensor operatively associated with the pad wear detection module corresponding to a state of the first CMP pad on the first rotatable platen of the rotatable platen carrier;
using an operatively connected first motor to position the pad tape replacement module proximate to the first rotatable platen responsive to an output of the pad wear detection module;
using an operatively connected second motor to rotate the rotatable platen carrier toward the pad tearer tool movably positioned adjacent to the rotatable platen carrier;
using an operatively connected third motor to engage the pad tearer tool to remove the first CMP pad affixed to the first rotatable platen; and
roll, via the pressure roller, a second CMP pad disposed in the pad tape onto the second rotatable platen of the rotatable platen carrier.

12. The system of claim 11 , further comprising a pad bubble detection module configured to detect at least one deformity in the second CMP pad on the second platen.

13. The system of claim 12 , wherein the memory further stores instructions which are executed by the processor causing the processor to rotate the rotatable platen carrier toward the pad tearer tool to remove the second CMP pad on the second rotatable platen.

14. The system of claim 11 , wherein the pad tape comprises a pad layer, a backing layer, and an adhesive, and wherein the at least one backing removal roller is configured to separate the backing layer from the pad tape.

15. The system of claim 11 , wherein the rotatable platen carrier is four-platen carrier or a two-platen carrier.

16. A chemical mechanical polishing (CMP) device, comprising:
a platen carrier positioned within an interior chamber of the CMP device and comprising
a plurality of independently rotatable platens coupled thereto;
a plurality of polishing pads correspondingly affixed to each of the independently rotatable platens;
a rotation motor coupled to a central shaft of the platen carrier and configured to rotate the platen carrier;
a platen rotation motor removably coupled to at least one platen, the platen rotation motor
configured to rotate the at least one platen during chemical mechanical polishing operation; and
a pad tearer tool positioned within the chamber, the pad tearer tool configured to rotate and engage one of the platens to remove a pad therefrom.

17. The device of claim 16 , further comprising a support structure configured to support the platen rotation motor, wherein the support structure is movable relative to the central shaft via a sweep motor.

18. The device of claim 16 , wherein each of the plurality of platens further comprises a corresponding drive coupling mechanism configured to engage with the platen rotation motor.

19. The device of claim 16 , further comprising a pad tape replacement module configured to removably engage one of the plurality of independently rotatable platens, the pad tape replacement module comprising:
a pad tape supply roller storing pad tape,
at least one backing removal roller,
a backing recycle roller,
a pressure roller, and
a pad tape recycle roller.

20. The device of claim 16 , wherein the platen carrier is four-platen carrier or a two platen carrier.

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Shih-Chung
• Tu Wei-Kang
• Cheng Ching-Wen
• Chen chun yan

Classifications

• B24B49/186 Primary

  taking regard of the wear of the dressing tools · CPC title

• B24B29/00

  Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents (polishing tools in general B24D13/00) · CPC title

• B24B41/005 Primary

  Feeding or manipulating devices specially adapted to grinding machines (feeding, loading or unloading work specially adapted to lapping machines B24B37/345) · CPC title