Embeddable electrically insulating thermal connector and circuit board including the same

Patent metadata

Field	Value
Publication number	US-12200853-B2
Application number	US-202217849841-A
Country	US
Kind code	B2
Filing date	Jun 27, 2022
Priority date	Jun 28, 2021
Publication date	Jan 14, 2025
Grant date	Jan 14, 2025

Abstract

A heat sink component can include a body including a thermally conductive material that is electrically non-conductive, a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer, and an upper conductive layer formed over a top surface of the body. The heat sink component can have a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface. A ratio of the length to the thickness can be greater than about 7.

First claim

What is claimed is:

1. A heat sink component comprising:
a body comprising a thermally conductive material that is electrically non-conductive;
a lower conductive layer formed over a bottom surface of the body and electrically connected with a ground plane layer;
a plurality of upper conductive layers formed on a top surface of the body, the plurality of upper conductive layers electrically isolated from the lower conductive layer;
wherein the heat sink component has a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface,
wherein a ratio of the length to the thickness is greater than about 7, and
wherein the plurality of upper conductive layers are arranged in a grid pattern having rows extending in the X-direction and columns extending in the Y-direction.

2. The heat sink component of claim 1 , further comprising at least one thin film component formed on at least one of the top surface, the bottom surface, or a side surface of the body.

3. The heat sink component of claim 2 , wherein the at least one thin film component comprises one or more of a resistor, varistor, capacitor, or inductor.

4. The heat sink component of claim 1 , wherein the upper conductive layer has a thickness in a Z-direction that is greater than about 1 micron.

5. The heat sink component of claim 1 , wherein the heat sink component has a width in a Y-direction that is perpendicular to the X-direction and parallel with the top surface, and wherein a ratio of the width of the heat sink component to the length of the heat sink component ranges from 0.2 to 5.

6. The heat sink component of claim 1 , wherein the heat sink component comprises a material having a thermal conductivity from about 150 W/m·° C. to about 300 W/m·° C. at about 22° C.

7. The heat sink component of claim 1 , wherein the heat sink component comprises aluminum nitride.

8. The heat sink component of claim 1 , wherein the heat sink component comprises beryllium oxide.

9. The heat sink component of claim 1 , wherein the thickness of the heat sink component is less than about 250 microns.

10. A circuit board comprising:
a substrate comprising a mounting surface;
a ground plane layer spaced apart from the mounting surface;
a first heat sink terminal on the mounting surface;
a second heat sink terminal on the mounting surface; and
a heat sink component at least partially embedded within the substrate, the heat sink component comprising:
a body comprising a thermally conductive material that is electrically non-conductive;
a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer;
an upper conductive layer formed over a top surface of the body;
a first via electrically connected with the upper conductive layer and extending toward the mounting surface; and
a second via electrically connected with the upper conductive layer and extending toward the mounting surface, the second via spaced apart from the first via in both an X-direction and a Y-direction such that the first via and the second via are not aligned with one another in the X-direction or the Y-direction, wherein the X-direction and the Y-direction are both parallel to the top surface of the body and perpendicular to one another,

wherein the first via extends from the upper conductive layer of the heat sink component to the mounting surface of the circuit board and connects with the first heat sink terminal of the circuit board, and
wherein the second via extends from the upper conductive layer of the heat sink component to the mounting surface of the circuit board and connects with the second heat sink terminal of the circuit board.

11. The circuit board of claim 10 , wherein the lower conductive layer of the heat sink component directly contacts the ground plane layer.

12. The circuit board of claim 10 , further comprising at least an additional via that electrically connects the lower conductive layer with the ground plane layer.

13. The circuit board of claim 10 , wherein the heat sink component further comprises at least one thin film component formed on at least one of the top surface, the bottom surface, or a side surface of the body.

14. The circuit board of claim 10 , wherein the heat sink component has a length in the X-direction parallel with the mounting surface of the substrate and a thickness in a direction perpendicular to the mounting surface, and wherein a ratio of the length to the thickness is greater than about 7.

15. The circuit board of claim 10 , wherein the heat sink component further comprises at least one additional upper conductive layer formed on the top surface of the body of the heat sink component, and wherein the at least one additional upper conductive layer is spaced apart on the top surface from the upper conductive layer.

16. The circuit board of claim 15 , wherein the at least one additional upper conductive layer and the upper conductive layer are arranged in a repeating pattern on the top surface of the body of the heat sink component.

17. The circuit board of claim 10 , wherein the upper conductive layer has a thickness in a Z-direction that is greater than about 1 micron.

18. The circuit board of claim 10 , wherein the heat sink component has a width in the Y-direction, and wherein a ratio of the width of the heat sink component to the length of the heat sink component ranges from 0.2 to 5.

19. The circuit board of claim 10 , wherein the heat sink component comprises a material having a thermal conductivity from about 150 W/m·° C. to about 300 W/m·° C. at about 22° C.

20. The circuit board of claim 19 , wherein the heat sink component comprises aluminum nitride.

21. The circuit board of claim 10 , wherein the heat sink component comprises beryllium oxide.

22. The circuit board of claim 10 , wherein the thickness of the heat sink component is less than about 250 microns.

23. The circuit board of claim 10 , further comprising:
at least an additional via that electrically connects the lower conductive layer of the heat sink component with the ground plane layer of the circuit board,
wherein the upper conductive layer of the heat sink component is electrically isolated from the lower conductive layer such that the heat sink terminal is electrically isolated from the ground plane layer.

Assignees

• Kyocera Avx Components Corp

Inventors

• Nelson Cory
• Borgman Jeff
• Berolini Marianne

Classifications

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K1/0207

  using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes · CPC title

• H05K1/0204

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title

• H05K1/0206

  by printed thermal vias · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title