Photonics integrated circuit architecture

Patent metadata

Field	Value
Publication number	US-12197020-B2
Application number	US-202218079672-A
Country	US
Kind code	B2
Filing date	Dec 12, 2022
Priority date	Sep 28, 2018
Publication date	Jan 14, 2025
Grant date	Jan 14, 2025

Abstract

This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.

First claim

What is claimed is:

1. A photonics integrated chip comprising:
a plurality of light source banks;
a combiner; and
a detector array; wherein:
each light source bank of the plurality of light source banks comprises:
a set of light sources;
a first optical trace connected to the combiner;
a second optical trace connected to the detector array; and
a crossing at which the first trace of the light source bank crosses the second trace.

2. The photonics integrated chip of claim 1 , wherein:
the combiner combines inputs received from the first optical traces of the plurality of light source banks and outputs a combined signal.

3. The photonics integrated chip of claim 2 , comprising a splitter positioned to receive the combined signal and configured to split the combined signal into a plurality of signals.

4. The photonics integrated chip of claim 3 , comprising a plurality of emission regions from which the plurality of signals exit the photonic integrated chip.

5. The photonics integrated chip of claim 4 , wherein:
the plurality of emission regions comprises a plurality of outcouplers.

6. The photonics integrated chip of claim 4 , comprising:
a controller that receives detector signals from the detector array and monitors and controls a frequency of light emitted the plurality of emission regions.

7. The photonics integrated chip of claim 1 , wherein:
each light source bank of the plurality of light source banks comprises a third optical trace connected to the detector array.

8. The photonics integrated chip of claim 7 , wherein:
each light source bank of the plurality of light source banks comprises a photonic component that is configured to receive signals from the set of light sources and to output a corresponding signal output to each of the first, second, and third trace of the light source bank.

9. The photonics integrated chip of claim 8 , wherein:
the photonic component is an arrayed waveguide grating.

10. A photonics integrated chip comprising:
a plurality of light source banks;
a combiner; and
a detector array; wherein:
each light source bank of the plurality of light source banks comprises:
a plurality of light sources;
a first optical trace connected to the combiner;
a second optical trace connected to the detector array; and
a multiplexer that connects the plurality of light sources to each of the first optical trace and the second optical trace.

11. The photonics integrated chip of claim 10 , wherein:
the combiner combines inputs received from the first optical traces of the plurality of light source banks and outputs a combined signal.

12. The photonics integrated chip of claim 11 , comprising a splitter positioned to receive the combined signal and configured to split the combined signal into a plurality of signals.

13. The photonics integrated chip of claim 12 , comprising a plurality of emission regions from which the plurality of signals exit the photonic integrated chip.

14. The photonics integrated chip of claim 13 , wherein:
the plurality of emission regions comprises a plurality of outcouplers.

Assignees

• Apple Inc

Inventors

• Bismuto Alfredo
• Arbore Mark
• Pelc Jason
• Abediasl Hooman
• Trita Andrea

Classifications

• G02B6/4206

  Optical features (G02B6/4207, G02B6/421 take precedence) · CPC title

• G02B6/29301

  based on a phased array of light guides (integrated arrayed waveguide gratings G02B6/12009) · CPC title

• G02B6/2938

  for multiplexing or demultiplexing, i.e. combining or separating wavelengths, e.g. 1xN, NxM · CPC title

• G01N2021/3181

  using LEDs · CPC title

• G02B6/29379

  characterised by the function or use of the complete device · CPC title