Injection mould and injection moulding method

Patent metadata

Field	Value
Publication number	US-12186952-B2
Application number	US-202117472814-A
Country	US
Kind code	B2
Filing date	Sep 13, 2021
Priority date	Feb 19, 2020
Publication date	Jan 7, 2025
Grant date	Jan 7, 2025

Abstract

An injection mould and an injection moulding method are provided. The injection mould includes: a base plate, configured to place a package chip to be injection-moulded, the package chip including a substrate and at least one chip fixed on a surface of the substrate by a flip chip process, the substrate having a through hole, a glue injection channel being formed in the base plate and configured to inject a moulding compound, and the glue injection channel being connected with the through hole on the substrate. The above-mentioned injection mould can improve the reliability of the package chip after injection moulding.

First claim

The invention claimed is:

1. An injection moulding method, comprising:
providing the injection mould and a package chip to be injection-moulded, the package chip comprising a substrate and at least one chip fixed on a surface of the substrate by a flip chip process, and the substrate having a through hole; and, wherein the injection mould, comprises: a base plate, configured to place a package chip to be injection-moulded, the package chip comprising a substrate and at least one chip fixed on a surface of the substrate by a flip chip process, the substrate having a through hole; and a glue injection channel formed in the base plate, configured to inject a moulding compound, the glue injection channel being connected with the through hole on the substrate; wherein one end of the glue injection channel has a first opening on a surface of the base plate in contact with the package chip, the first opening being connected with the through hole on the substrate, another end of the glue injection channel has a second opening on a surface of the base plate farther away from the package chip, and the second opening being configured to inject the moulding compound into the injection mould from outside, an area of the second opening of the glue injection channel is larger than that of the first opening;
placing the package chip on a base plate of the injection mould, and covering with a cover on the base plate to form a cavity, the package chip being located in the cavity, a back surface of the substrate being contacted to a surface of the base plate, and the through hole on the substrate of the package chip being connected with a glue injection channel in the base plate;
executing a first injection, the first injection comprising: injecting a moulding compound in a liquid state into the cavity via the glue injection channel in the base plate and the through hole on the substrate; and
executing a second injection, the second injection comprising: injecting the moulding compound in the liquid state into the cavity through an opening hole on the cover of the injection mould, wherein the moulding compound flow rate of the second injection is higher than that of the first injection.

2. The injection moulding method of claim 1 , wherein in a process of executing the first injection, when the moulding compound in the liquid state fills up a gap between the chip and the substrate, the first injection is stopped, and the second injection is executed until the cavity is filled up.

3. The injection moulding method of claim 1 , wherein the moulding compound is injected into the cavity through the opening hole.

4. The injection moulding method of claim 3 , wherein the through hole is formed in a substrate area on which each of the package chips is disposed.

5. The injection moulding method of claim 4 , wherein in the first injection process, the moulding compound is injected into each through hole simultaneously or sequentially via the glue injection channel.

6. The injection moulding method of claim 1 , further comprising: after the moulding compound in the liquid state fills up the cavity, executing a heat treatment to solidify the moulding compound in the liquid state.

Assignees

• Changxin Memory Tech Inc

Inventors

• He Jun
• Liu Jie
• Quan Changhao
• Ying Zhan

Classifications

• H10W74/016

  using moulds · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title

• H10W74/014 Primary

  using batch processing · CPC title

• B29L2031/34

  Electrical apparatus, e.g. sparking plugs or parts thereof · CPC title