Injection mould and injection moulding method

Patent metadata

Field	Value
Publication number	US-11820058-B2
Application number	US-202117373930-A
Country	US
Kind code	B2
Filing date	Jul 13, 2021
Priority date	Feb 19, 2020
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

An injection mould and an injection moulding method are provided. The injection mould includes a base plate used to place a packaged chip to be injection moulded including a substrate and at least one of the chips fixed on the front substrate by a flip chip process. The substrate has a gas hole. Two or more gas ducts that extend in at least two intersected directions and connect with one another are formed in the base plate. Two ends of each one of gas ducts are open, and at least one of the gas ducts is buried into the base plate. Each one of gas ducts is provided with a gas outlet. When the packaged chip is placed on the base plate, the gas outlet connects with the gas hole of the substrate.

First claim

The invention claimed is:

1. An injection mould, comprising,
a base plate used to place a packaged chip to be injection moulded, wherein the packaged chip comprises a substrate and at least one chip fixed on a front surface of the substrate by a flip chip process, and the substrate has a gas hole penetrating through the substrate;
wherein two or more gas ducts that extend in at least two intersecting directions and connect with one another are formed in the base plate; two ends of each one of the two or more gas ducts are open and connect to an exterior of the injection mould, at least one of the two or more gas ducts is buried into the base plate, and in a direction perpendicular to a surface of the base plate, the two or more gas ducts that extend in the at least two intersecting directions are respectively located at different depths in the base plate; and
wherein each of the two or more gas ducts is provided with a gas outlet used to connect with the gas hole penetrating through the substrate, and the gas outlet is located at an intersection of different gas ducts of the two or more gas ducts, so that the intersected gas ducts connect with one another.

2. The injection mould according to claim 1 , wherein at least one of the two or more gas ducts is located on a front surface of the base plate; the at least one gas duct located on the front surface of the base plate is a groove located on the front surface of the base plate; and the at least one gas duct buried into the base plate is a tunnel located inside the base plate.

3. The injection mould according to claim 1 , wherein all gas ducts that extend in at least one of the directions are buried into the base plate.

4. The injection mould according to claim 1 , wherein a maximum distance between any two points on an edge of a cross section perpendicular to a length direction of each of the two or more gas ducts ranges from 500 μm to 5 mm.

5. The injection mould according to claim 1 , wherein a size of the gas outlet of each of the two or more gas ducts is larger than or equal to a size of the gas hole penetrating through the substrate.

6. The injection mould according to claim 1 , wherein a first gas duct of the two or more gas ducts extending in a first direction and a second gas duct of the two or more gas ducts extending in a second direction are formed in the base plate; the first gas duct is a groove formed on the surface of the base plate; the second gas duct is a tunnel buried into the base plate; and the second gas duct and the first gas duct connect with each other at the intersection.

7. The injection mould according to claim 6 , wherein a step is provided in the second gas duct at a position connecting to the first gas duct; and the step is connected to a bottom of the first gas duct in an extending direction of the first gas duct.

8. The injection mould according to claim 6 , wherein the substrate has a plurality of gas holes penetrating through the substrate; the two or more gas ducts comprise a plurality of first gas ducts, the plurality of gas holes of the substrate of the packaged chip to be injection moulded are arranged in a straight line; an extending direction of the first gas duct is consistent with a direction in which the plurality of gas holes are arranged; and each of the plurality of first gas ducts is used to connect to the plurality of gas holes on a same straight line.

9. The injection mould according to claim 1 , further comprising a cover used to cover the base plate to form a cavity with the base plate; the cavity is used to accommodate the packaged chip to be injection moulded; each of the two or more gas ducts of the base plate connects the cavity with the exterior of the injection mould; and the cover is provided with at least one injection hole used to inject a moulding compound to the cavity.

10. An injection moulding method, comprising:
providing the injection mould according to claim 9 and the packaged chip to be injection moulded;
placing the packaged chip on the base plate of the injection mould and covering the base plate with the cover to form the cavity, the packaged chip being located in the cavity, a back surface of the substrate being contacted to the surface of the base plate, and the gas hole penetrating through the substrate of the packaged chip connecting with the two or more gas ducts of the base plate; and
injecting the moulding compound in a state of liquid to the cavity through the injection hole of the cover, at least part of gas in the cavity being exhausted out of the injection mould through the gas hole and each of the two or more gas ducts during injection of the moulding compound.

11. The injection moulding method according to claim 10 , wherein the moulding compound is injected to the cavity through two or more injection holes.

12. The injection moulding method according to claim 10 , wherein at least one of the gas holes is formed in a substrate region on which each one of a plurality of packaged chips is located.

13. The injection moulding method according to claim 10 , further comprising: after the cavity is filled up with the moulding compound in the state of liquid, performing heat treatment to solidify the moulding compound in the state of liquid; and taking out the packaged chip wrapped by a solidified moulding compound from the cavity.

Assignees

• Changxin Memory Tech Inc

Inventors

• He Jun
• Liu Jie
• Quan Changhao
• Ying Zhan

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/016

  using moulds · CPC title