Thermal conductive film

Patent metadata

Field	Value
Publication number	US-12183653-B2
Application number	US-202217726916-A
Country	US
Kind code	B2
Filing date	Apr 22, 2022
Priority date	Dec 28, 2018
Publication date	Dec 31, 2024
Grant date	Dec 31, 2024

Abstract

An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

First claim

What is claimed is:

1. A thermal conductive film, comprising:
a porous metal layer consisting of a sponge comprised entirely of metal, the sponge including pores distributed as an open cell structure throughout an entire thickness of the sponge;
an adhesive substance filling the pores of the porous metal layer;
a first adhesive layer on and contacting one side of the porous metal layer; and
a plurality of first thermal conductive members distributed in the first adhesive layer.

2. The thermal conductive film as claimed in claim 1 , wherein a porosity of the porous metal layer is about 30% to less than 100%.

3. The thermal conductive film as claimed in claim 1 , wherein:
at least one of the pores is open at a surface of the porous metal layer, and
the adhesive substance filling the at least one of the pores is exposed at the surface of the porous metal layer.

4. The thermal conductive film as claimed in claim 1 , wherein:
the adhesive substance and the first adhesive layer are in contact with each other at an interface between the porous metal layer and the first adhesive layer, and
the adhesive substance and the first adhesive layer are provided in the form of a single body including the same material.

5. The thermal conductive film as claimed in claim 1 , wherein a major axis of the pores has a length of about 5 μm to about 3000 μm.

6. The thermal conductive film as claimed in claim 1 , wherein the plurality of first thermal conductive members have one or more of a bead shape, a wire shape, or a rod shape.

7. The thermal conductive film as claimed in claim 1 , wherein the plurality of first thermal conductive members occupy a volume fraction of about 1% to about 50% of a total volume of the first adhesive layer.

8. The thermal conductive film as claimed in claim 1 , wherein the plurality of first thermal conductive members are distributed in the adhesive substance.

9. The thermal conductive film as claimed in claim 1 , further comprising a second adhesive layer on another side of the porous metal layer, the other side being opposite to the first adhesive layer.

10. The thermal conductive film as claimed in claim 9 , further comprising a plurality of second thermal conductive members distributed in the second adhesive layer, wherein:
the first adhesive layer includes a different material from that of the adhesive substance, and
the second adhesive layer includes a different material from that of the adhesive substance.

11. The thermal conductive film as claimed in claim 9 , further comprising:
a first removable polyethylene terephthalate (PET) or paper layer covering the second adhesive layer; and
a second removable polyethylene terephthalate (PET) or paper layer covering the first adhesive layer.

12. A thermal conductive film, comprising:
a porous metal layer consisting of a sponge made entirely of metal, the sponge including pores distributed as an open cell structure throughout an entire thickness of the sponge;
an adhesive substance filling the pores of the porous metal layer;
a first adhesive layer on and contacting one side of the porous metal layer; and
a plurality of thermal conductive members distributed in the adhesive substance.

13. The thermal conductive film as claimed in claim 12 , further comprising a second adhesive layer on another side of the porous metal layer, the other side being opposite to the first adhesive layer.

14. The thermal conductive film as claimed in claim 13 , wherein:
the plurality of thermal conductive members are distributed in the first adhesive layer,
the first adhesive layer includes a different material from that of the adhesive substance, and
the second adhesive layer includes a different material from that of the adhesive substance.

15. The thermal conductive film as claimed in claim 12 , wherein:
at least one of the pores is open at a surface of the porous metal layer, and
the adhesive substance filling the at least one of the pores is exposed at the surface of the porous metal layer.

16. The thermal conductive film as claimed in claim 12 , wherein:
the adhesive substance and the first adhesive layer are in contact with each other at an interface between the porous metal layer and the first adhesive layer, and
the adhesive substance and the first adhesive layer are provided in the form of a single body including the same material.

17. The thermal conductive film as claimed in claim 12 , wherein a major axis of the pores has a length of about 5 μm to about 3000 μm.

18. The thermal conductive film as claimed in claim 12 , wherein the plurality of thermal conductive members occupy a volume fraction of about 1% to about 50% of a total volume of the first adhesive layer.

19. A thermal conductive film, comprising:
a porous metal layer consisting of a sponge, the sponge including pores distributed as an open cell structure throughout an entire thickness of the sponge;
an adhesive substance filling the pores of the porous metal layer;
a first adhesive layer on one side of the porous metal layer; and
a plurality of first thermal conductive members distributed in the first adhesive layer,
wherein a major axis of the pores has a length in the range of 5 μm to 3000 μm.

20. The thermal conductive film as claimed in claim 19 , wherein a porosity of the porous metal layer is about 30% to less than 100%.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Joungphil
• Kang Myung-Sung
• Kim Yeongseok
• Seo Gwangsun
• Yoo Hyein
• Choi Yongwon

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W72/357

  Multiple die-attach connectors having different materials · CPC title