Coolant system for a busbar assembly

Patent metadata

Field	Value
Publication number	US-12178019-B2
Application number	US-202117557112-A
Country	US
Kind code	B2
Filing date	Dec 21, 2021
Priority date	Dec 3, 2021
Publication date	Dec 24, 2024
Grant date	Dec 24, 2024

Abstract

A busbar assembly includes a first busbar having a mating interface for mating with an electrical component to power the electrical component and a second busbar having a mating interface for mating with the electrical component to power the electrical component. The busbar assembly includes a first thermal conduit extending along the first busbar that allows liquid coolant to flow therethrough to dissipate heat from the first busbar. The busbar assembly includes a second thermal conduit extending along the second busbar that allows liquid coolant to flow therethrough to dissipate heat from the second busbar.

First claim

What is claimed is:

1. A busbar assembly comprising:
a first busbar having a mating interface for mating with an electrical component to provide a power supply path for the electrical component;
a second busbar having a mating interface for mating with the electrical component to provide a power return path for the electrical component;
an isolator panel positioned between the first busbar and the second busbar, the isolator panel supporting the first busbar at a first side thereof, the isolator panel supporting the second busbar at a second side thereof, wherein the first and second busbars and the isolator panel extend along parallel paths through the busbar assembly in a busbar stack;
a first thermal conduit extending along the first busbar, the first thermal conduit allowing liquid coolant to flow therethrough to dissipate heat from the first busbar; and
a second thermal conduit extending along the second busbar, the second thermal conduit allowing liquid coolant to flow therethrough to dissipate heat from the second busbar.

2. The busbar assembly of claim 1 , wherein the first busbar includes a first busbar channel, the first thermal conduit being located in the first busbar channel, wherein the second busbar includes a second busbar channel, the second thermal conduit being located in the second busbar channel.

3. The busbar assembly of claim 2 , wherein the first busbar channel is open along a side of the first busbar to receive the first thermal conduit, the second busbar channel being open along the side of the second busbar to receive the second thermal conduit.

4. The busbar assembly of claim 2 , wherein the first busbar channel is interior to the first busbar, the first thermal conduit passing through the interior of the first busbar, the second busbar channel being interior to the second busbar, the second thermal conduit passing through the interior of the second busbar.

5. The busbar assembly of claim 1 , wherein the first thermal conduit is electrically isolated from the first busbar and the second thermal conduit is electrically isolated from the second busbar.

6. The busbar assembly of claim 1 , wherein the first busbar extends between an upper end and a lower end, the first thermal conduit extending substantially an entire height of the first busbar between the upper end and the lower end, the second busbar extending between an upper end and a lower end, the second thermal conduit extending substantially an entire height of the second busbar between the upper end and the lower end.

7. The busbar assembly of claim 1 , wherein the first thermal conduit is defined by a first coolant tube having a first coolant channel forming the first thermal conduit, the first coolant tube being thermally coupled to the first busbar, the second thermal conduit being defined by a second coolant tube having a second coolant channel forming the second thermal conduit, the second coolant tube being thermally coupled to the second busbar.

8. The busbar assembly of claim 7 , wherein the first coolant tube is press-fit into a first channel in the first busbar and the second coolant tube is press-fit into a second channel in the second busbar.

9. The busbar assembly of claim 7 , wherein the first coolant tube includes an electrical insulating layer to electrically isolate the first coolant tube from the first busbar and the second coolant tube includes an electrical insulating layer to electrically isolate the second coolant tube from the second busbar.

10. The busbar assembly of claim 7 , further comprising support brackets coupled to the first and second busbars to secure the first and second coolant tubes to the first and second busbars, respectively.

11. The busbar assembly of claim 7 , wherein the first coolant tube includes an inlet port and a return port, the liquid coolant flowing through the first coolant channel from the inlet port to the return port, the second coolant tube including in an inlet port and a return port, the liquid coolant flowing through the second coolant channel from the inlet port to the return port.

12. The busbar assembly of claim 1 , further comprising:
a first supply line coupled to the first thermal conduit by a first supply fitting;
a first return line coupled to the first thermal conduit by a first return fitting;
a second supply line coupled to the second thermal conduit by a second supply fitting; and
a second return line coupled to the second thermal conduit by a second return fitting.

13. The busbar assembly of claim 1 , wherein the busbar assembly is a laminated structure with the isolator panel laminated between the first busbar and the second busbar.

14. The busbar assembly of claim 1 , wherein the first busbar includes an inner surface and an outer surface opposite the inner surface, the inner surface facing the second busbar, the first busbar having a front and a rear, the first busbar having an upper end and a lower end, the mating interface of the first busbar being located proximate to the front, the first thermal conduit extending along the outer surface and located rearward of the mating interface, the first thermal conduit extending substantially an entire height of the first busbar between the upper end and the lower end, and wherein the second busbar includes an inner surface and an outer surface opposite the inner surface, the inner surface facing the first busbar, the second busbar having a front and a rear, the second busbar having an upper end and a lower end, the mating interface of the second busbar be located proximate to the front, the second thermal conduit extending along the outer surface and located rearward of the mating interface, the second thermal conduit extending substantially an entire height of the second busbar between the upper end and the lower end.

15. The busbar assembly of claim 1 , further comprising
a third thermal conduit extending along the first busbar, the third thermal conduit allowing liquid coolant to flow therethrough to dissipate heat from the first busbar; and
a fourth thermal conduit extending along the second busbar, the fourth thermal conduit allowing liquid coolant to flow therethrough to dissipate heat from the second busbar.

16. The busbar assembly of claim 1 , further comprising:
a first power supply electrically coupled to the first busbar, the first thermal conduit including an inlet port receiving the liquid coolant, the inlet port being located proximate to the first power supply; and
a second power supply electrically coupled to the second busbar, the second thermal conduit including an inlet port receiving the liquid coolant, the inlet port being located proximate to the second power supply.

17. A busbar assembly comprising:
a first busbar having a mating interface for mating with an electrical component to provide a power supply path for the electrical component, the first busbar having an inner surface and an outer surface opposite the inner surface, the outer surface defining the mating interface;
a second busbar having a mating interface for mating with the electrical component to provide a power return for the electrical component, the second busbar having an inner surface and an outer surface opposite the inner surface, the outer surface defining the mating interface, wherein the second busbar is oriented parallel to the first busbar with the inner surface of the second busbar facing the inner surface of the first busbar and electrically isolated therefrom, the mating interface of the second busbar facing outward in an opposite direction as the mating interface of the fir

Assignees

• TE Connectivity Services Gmbh
• Tyco Electronics Shanghai Co Ltd
• Te Connectivity Solutions Gmbh Et Al

Inventors

• Costello Brian Patrick
• Luo Jie

Classifications

• H05K7/20945

  Thermal management, e.g. inverter temperature control · CPC title

• H02B1/20

  Bus-bar or other wiring layouts, e.g. in cubicles, in switchyards (installations of bus-bars H02G5/00) · CPC title

• H01R13/533

  Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure (H01R13/52 takes precedence) · CPC title

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/20781 Primary

  within cabinets for removing heat from server blades · CPC title