Forming connections to flexible interconnect circuits

Patent metadata

Field	Value
Publication number	US-12176640-B2
Application number	US-202318457200-A
Country	US
Kind code	B2
Filing date	Aug 28, 2023
Priority date	Oct 2, 2020
Publication date	Dec 24, 2024
Grant date	Dec 24, 2024

Abstract

Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.

First claim

The invention claimed is:

1. A circuit assembly comprising:
a flexible interconnect circuit comprising a first outer dielectric, a second outer dielectric, and a conductive element disposed between the first outer dielectric and the second outer dielectric;
a printed circuit board comprising a printed circuit board base and a printed circuit board conductive layer, wherein a portion of the conductive element of the flexible interconnect circuit extends past at least one or both of the first outer dielectric and the second outer dielectric of the flexible interconnect circuit and forms an electrical connection with the printed circuit board conductive layer; and
a conductor joining structure interconnecting the printed circuit board and the flexible interconnect circuit, wherein:
the conductor joining structure comprises a first portion and a second portion stacked with the first portion such that the first portion has a different material composition than the second portion,
the first portion directly interfaces and is welded to the conductive element of the flexible interconnect circuit, and
the second portion directly interfaces and is soldered to the printed circuit board conductive layer.

2. The circuit assembly of claim 1 , wherein:
the printed circuit board base comprises a printed circuit board opening formed by a through-hole, and
the printed circuit board conductive layer extends through the printed circuit board opening and positioned on both sides of the printed circuit board base.

3. A circuit assembly comprising:
a flexible interconnect circuit comprising a first outer dielectric, a second outer dielectric, and a conductive element disposed between the first outer dielectric and the second outer dielectric;
a printed circuit board comprising a printed circuit board base and a printed circuit board conductive layer, wherein a portion of the conductive element of the flexible interconnect circuit extends past at least one or both of the first outer dielectric and the second outer dielectric of the flexible interconnect circuit and forms an electrical connection with the printed circuit board conductive layer; and
a conductor joining structure interconnecting the printed circuit board and the flexible interconnect circuit, wherein:
the printed circuit board base comprises a printed circuit board opening formed by a through-hole,
the printed circuit board conductive layer extends through the printed circuit board opening and positioned on both sides of the printed circuit board base, and
the conductor joining structure comprises a protrusion extending into the printed circuit board opening.

4. The circuit assembly of claim 3 , wherein the protrusion extends through the printed circuit board base and forms an electrical connection to the printed circuit board conductive layer disposed on a side of the printed circuit board base that faces away from the flexible interconnect circuit.

5. The circuit assembly of claim 1 , wherein:
the first outer dielectric comprises a dielectric opening, overlapping with and providing access to the portion of the conductive element, which forms the electrical connection with the printed circuit board conductive layer, and
the portion of the conductive element, which forms the electrical connection with the printed circuit board conductive layer, extends past the second outer dielectric.

6. The circuit assembly of claim 1 , further comprising an assembly adhesive, disposed between and bonding the flexible interconnect circuit and the printed circuit board.

7. The circuit assembly of claim 6 , wherein the assembly adhesive is positioned between and contacts the second outer dielectric of the flexible interconnect circuit and the printed circuit board.

8. The circuit assembly of claim 1 , wherein the conductor joining structure comprises a plate, which extends adjacent to one side of the printed circuit board.

9. The circuit assembly of claim 8 , wherein the plate directly contacts and forms an electrical connection to the printed circuit board conductive layer.

10. The circuit assembly of claim 8 , wherein:
the plate has a plate thickness,
the conductive element comprises a conductive element thickness, and
a ratio of the plate thicknesses to the conductive element thickness is between 2:1 and 1:2.

11. The circuit assembly of claim 8 , wherein the plate and the conductive element are formed from same material.

12. The circuit assembly of claim 1 , wherein at least a portion of the conductor joining structure is directly adhered to the flexible interconnect circuit.

13. The circuit assembly of claim 12 , wherein:
the conductor joining structure comprises a plate, which extends adjacent to one side of the printed circuit board, and
the first outer dielectric extends over a portion of the plate of the conductor joining structure and is adhered to the plate using a dielectric adhesive.

14. The circuit assembly of claim 1 , wherein the conductor joining structure is directly welded, soldered, or otherwise electrically coupled to the conductive element forming a contact interface between the conductor joining structure and the conductive element.

15. The circuit assembly of claim 14 , wherein the flexible interconnect circuit extends on both sides of the contact interface between the conductor joining structure and the conductive element.

16. The circuit assembly of claim 1 , further comprising a support structure, connecting and mechanically attaching the conductor joining structure and the printed circuit board.

17. The circuit assembly of claim 16 , wherein:
the conductor joining structure comprises a plate, and
the support structure forces the plate against the printed circuit board conductive layer thereby forming an electrical connection between the conductor joining structure and the printed circuit board conductive layer through direct contact between the plate against the printed circuit board conductive layer.

18. The circuit assembly of claim 1 , wherein:
the flexible interconnect circuit comprises an additional conductive element and an inner dielectric, disposed between the conductive element and the additional conductive element,
both the conductive element and the additional conductive element are connected to the conductor joining structure.

19. The circuit assembly of claim 3 , wherein the conductor joining structure is a monolithic structure formed from a conductive material selected from the group consisting of copper and aluminum.

20. The circuit assembly of claim 3 , wherein:
the first portion comprises aluminum, and
the second portion comprises copper.

Assignees

• Cellink Corp

Inventors

• Coakley Kevin Michael
• Hernandez Emily
• Terlaak Mark
• Brown Malcolm Parker

Classifications

• H01R12/7064

  Press fitting · CPC title

• H01R12/714

  with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit · CPC title

• H01R12/716

  Coupling device provided on the PCB · CPC title

• H01R2201/26

  for vehicles · CPC title

• H01R4/029

  Welded connections (H01R4/021 - H01R4/028 take precedence) · CPC title