System, method and device for temperature control

Patent metadata

Field	Value
Publication number	US-12176226-B2
Application number	US-202217647738-A
Country	US
Kind code	B2
Filing date	Jan 12, 2022
Priority date	Jul 30, 2021
Publication date	Dec 24, 2024
Grant date	Dec 24, 2024

Abstract

A method for temperature control includes: acquiring the present temperature of a reaction window in a process chamber of a semiconductor machine; comparing the present temperature with the preset temperature to acquire a comparison result; and adjusting the exhaust amount of an exhaust passage of the process chamber based on the comparison result to control the temperature of the reaction window.

First claim

What is claimed is:

1. A method for temperature control, comprising:
acquiring a working state of a heating assembly of the reaction window in the semiconductor machine;
reducing the opening degree of the exhaust valve to be fully closed in case that the working state of the heating assembly is turned off;
acquiring a present temperature of the reaction window in the process chamber of the semiconductor machine in case that the working state of the heating assembly is turned on;
comparing the present temperature with a preset temperature to acquire a comparison result; and
adjusting an exhaust amount of an exhaust passage of the process chamber and an output power of the heating assembly based on the comparison result, to control the temperature of the reaction window; and
wherein the exhaust passage of the process chamber is provided with an exhaust valve; and
wherein adjusting the exhaust amount of the exhaust passage of the process chamber based on the comparison result comprises:
adjusting an opening degree of the exhaust valve based on the comparison result.

2. The method according to claim 1 , wherein the preset temperature comprises a first preset temperature; and
wherein comparing the present temperature with the preset temperature to acquire the comparison result comprises: comparing the present temperature with the first preset temperature to acquire a comparison result; and
wherein adjusting the opening degree of the exhaust valve based on the comparison result comprises: increasing the opening degree of the exhaust valve in case that the present temperature is greater than the first preset temperature.

3. The method according to claim 2 , wherein the preset temperature further comprises a second preset temperature, the second preset temperature is greater than the first preset temperature;
wherein comparing the present temperature with the preset temperature to acquire the comparison result further comprises: comparing the present temperature with the second preset temperature to acquire a comparison result; and
wherein increasing the opening degree of the exhaust valve in case that the present temperature is greater than the first preset temperature comprises: increasing the opening degree of the exhaust valve to be fully opened in case that the present temperature is greater than the second preset temperature.

4. The method according to claim 3 , wherein the first preset temperature is 120° C., and the second preset temperature is 125° C.

5. The method according to claim 2 , wherein adjusting the opening degree of the exhaust valve based on the comparison result comprises:
reducing the opening degree of the exhaust valve in case that the present temperature is less than the first preset temperature.

6. The method according to claim 5 , wherein the preset temperature further comprises a third preset temperature, the third preset temperature is less than the first preset temperature;
wherein comparing the present temperature with the preset temperature to acquire the comparison result further comprises: comparing the present temperature with the third preset temperature to acquire a comparison result; and
wherein reducing the opening degree of the exhaust valve in case that the present temperature is less than the first preset temperature comprises: reducing the opening degree of the exhaust valve to be fully closed in case that the present temperature is less than the third preset temperature.

7. The method according to claim 6 , wherein the third preset temperature is 115° C.

8. A device for temperature control, applied to a semiconductor machine, comprising:
an acquisition circuit, configured to acquire a present temperature of a reaction window in a process chamber of the semiconductor machine;
a temperature comparison circuit, configured to compare the present temperature with a preset temperature to acquire a comparison result; and
an adjustment circuit, configured to adjust an exhaust amount of an exhaust passage of the process chamber based on the comparison result, to control a temperature of the reaction window;
wherein the acquisition circuit is configured to acquire the present temperature of the reaction window in the process chamber of the semiconductor machine based on:
acquiring a working state of a heating assembly of the reaction window in the semiconductor machine;
reducing the opening degree of the exhaust valve to be fully closed in case that the working state of the heating assembly is turned off; and
acquiring a present temperature of the reaction window in the process chamber of the semiconductor machine in case that the working state of the heating assembly is turned on; and
wherein the adjustment circuit is configured to adjust the exhaust amount of the exhaust passage of the process chamber based on the comparison result, to control the temperature of the reaction window by adjusting the exhaust amount of the exhaust passage of the process chamber and an output power of the heating assembly based on the comparison result, to control the temperature of the reaction window;
wherein the exhaust passage of the process chamber is provided with an exhaust valve; and
wherein the adjustment circuit is further configured to:
adjust an opening degree of the exhaust valve based on the comparison result.

9. The device according to claim 8 , wherein the preset temperature comprises a first preset temperature; and
wherein the temperature comparison circuit is further configured to: compare the present temperature with the first preset temperature to acquire a comparison result; and
the adjustment circuit is further configured to: increase the opening degree of the exhaust valve in case that the present temperature is greater than the first preset temperature.

10. The device according to claim 9 , wherein the preset temperature further comprises a second preset temperature, the second preset temperature is greater than the first preset temperature;
wherein the temperature comparison circuit is further configured to: compare the present temperature with the second preset temperature to acquire a comparison result; and
the adjustment circuit is further configured to: increase the opening degree of the exhaust valve to be fully opened in case that the present temperature is greater than the second preset temperature.

11. A system for temperature control, applied to a semiconductor machine, comprising:
a temperature sensing assembly, a control assembly, an exhaust adjusting assembly, and a heating assembly, wherein
the temperature sensing assembly is arranged on a reaction window of a process chamber of the semiconductor machine, and configured to sense a temperature of the reaction window;
the control assembly is connected with the temperature sensing assembly, and configured to: acquire a present temperature of the reaction window from the temperature sensing assembly; compare the present temperature with a preset temperature to acquire a comparison result; and control the exhaust adjusting assembly to adjust an exhaust amount of an exhaust passage of the process chamber based on the comparison result, to control the temperature of the reaction window; and
the exhaust adjusting assembly is arranged on the exhaust passage of the process chamber, connected with the control assembly, and configured to control the exhaust amount of the exhaust passage;
the heating assembly is arranged in the process chamber, and configured to heat the reaction window, wherein
the control assembly is further configured to: acquire a working state of the heating assembly; reducing the opening degree of the exhaust valve to be fully closed in case that th

Assignees

• Changxin Memory Tech Inc

Inventors

• Zhang Guoqing
• Yang Su
• Sun Duocai
• Hong Xingfeng
• Li Yiqun

Classifications

• H10P72/0602 Primary

  Temperature monitoring · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• G05D23/1917

  using digital means · CPC title

• F27D2019/0018

  Monitoring the temperature of the atmosphere of the kiln · CPC title

• F27B17/0025

  specially adapted for treating semiconductor wafers · CPC title