Method for applying a coating to at least one electronic component, sensor arrangement comprising a coating and coating carrier

Patent metadata

Field	Value
Publication number	US-12172184-B2
Application number	US-202218029765-A
Country	US
Kind code	B2
Filing date	Aug 2, 2022
Priority date	Sep 8, 2021
Publication date	Dec 24, 2024
Grant date	Dec 24, 2024

Abstract

A method for applying a coating to at least one electronic component. The method includes providing a coating carrier having a main base, a coating base having a recess, and a moveable reservoir having a further recess. The method further includes filling a coating material into the recess of the reservoir; sliding the reservoir along a longitudinal axis of the coating carrier such that the recess of the coating base is filled with coating material; providing an electronic component and dipping at least parts of the electronic component into the coating material provided in the recess of the coating base to form a coating of the electronic component. Furthermore, a sensor arrangement for measuring a temperature is described having a coating applied by the method. A coating carrier for applying a coating to an electronic component is described.

First claim

The invention claimed is:

1. A method of applying a coating to at least one electronic component, comprising:
A) Providing a coating carrier having
a main base,
a coating base arranged on the main base and comprising a coating-base recess,
a moveable reservoir comprising a reservoir recess;

B) Filling a coating material into the reservoir recess;
C) Sliding the reservoir along a longitudinal axis of the coating carrier such that the coating-base recess is filled with coating material;
D) Providing at least one electronic component and dipping at least parts of the electronic component into the coating material provided in the coating-base recess to form a coating of the electronic component.

2. The method of claim 1 , wherein the reservoir recess comprises a cut-out arranged in a bottom of the reservoir recess and, wherein, in step C), the reservoir is moved over the coating base until the cut-out is arranged above the coating-base recess.

3. The method of claim 1 , wherein the reservoir recess comprises a cut-out arranged in a bottom of the reservoir recess and, wherein, in step C), the reservoir is slid from an initial position, where the cut-out in the reservoir recess is closed, to a final position, where the cut-out in the reservoir recess is no longer closed, such that coating material is transferred from the reservoir recess via the cut-out into the coating-base recess.

4. The method of claim 3 , wherein, after having filled the coating-base recess with coating material, the reservoir is slid back to the initial position.

5. The method of claim 1 , wherein the coating carrier comprises at least two guiding elements arranged at least partly along the main base, wherein in step D), the reservoir is slid along the at least two guiding elements.

6. The method of claim 1 , wherein no spilling of the coating material takes place when the reservoir is moved along the longitudinal axis and/or when the reservoir recess and coating-base recess are filled with coating material.

7. The method of claim 1 , wherein the coating material comprises a coating powder or a resin.

8. The method of claim 1 , wherein the at least one electronic component comprises a sensor arrangement for measuring a temperature.

Assignees

• Tdk Electronics Ag

Inventors

• Ravichandran Subramanian
• Hojas Gerhard

Classifications

• G01K7/22

  the element being a non-linear resistance, e.g. thermistor (G01K7/26 takes precedence) · CPC title

• B05C11/10

  Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material {(B05C1/0813, B05C5/0225, B05C17/002 and B05C19/06 take precedence)} · CPC title

• B05C19/00

  Apparatus specially adapted for applying particulate materials to surfaces · CPC title

• H01G13/00

  Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00 · CPC title

• H01C17/02

  adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52) · CPC title