Electronic device including interposer

Patent metadata

Field	Value
Publication number	US-12171065-B2
Application number	US-202318456153-A
Country	US
Kind code	B2
Filing date	Aug 25, 2023
Priority date	Jul 17, 2019
Publication date	Dec 17, 2024
Grant date	Dec 17, 2024

Abstract

An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.

First claim

What is claimed is:

1. A portable communication device comprising:
a housing;
a first printed circuit board (PCB) accommodated in the housing, the first PCB including a first conductive terminal formed on a surface thereof;
a second PCB accommodated in the housing as substantially parallel with the first PCB, the second PCB including a second conductive terminal formed on a surface thereof facing the surface of the first PCB;
an interposer including a conductive post formed from a first surface to a second surface of the interposer opposite to the first surface, a third conductive terminal formed at a first end of the conductive post, and a fourth conductive terminal formed at a second end of the conductive post opposite to the first end, the interposer disposed between the first and second PCBs such that the third conductive terminal is soldered with the first conductive terminal, and that the fourth conductive terminal is connected with the second conductive terminal via a conductive support terminal soldered therebetween; and
an overflow prevention portion disposed around the third conductive terminal soldered with the first conductive terminal and the fourth conductive terminal soldered with the second conductive terminal.

2. The portable communication device of claim 1 , wherein the conductive support terminal is stacked on the third conductive terminal or the fourth conductive terminal.

3. The portable communication device of claim 1 , wherein the conductive support terminal is pattern plated on the third conductive terminal or the fourth conductive terminal.

4. The portable communication device of claim 1 , wherein the conductive support terminal maintains a distance between the interposer and the second PCB.

5. The portable communication device of claim 1 , wherein the conductive support terminal includes a plurality of conductive layers formed over one another.

6. The portable communication device of claim 1 , wherein the first conductive terminal is electrically connected with the second conductive terminal via the third conductive terminal, the conductive post, the fourth conductive terminal and the conductive support terminal.

7. The portable communication device of claim 1 , wherein the overflow prevention portion comprises a recess formed lower than the first surface and the second surface of the interposer.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Ha Sangwon
• Kang Subyung
• Park Sanghoon
• Seo Soohyun
• Woo Yongjin
• Yoon Yeomoon

Classifications

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H05K2201/0989

  Coating free areas, e.g. areas other than pads or lands free of solder resist · CPC title

• H05K1/144 Primary

  Stacked arrangements of planar printed circuit boards · CPC title

• H04M1/0277

  for a printed circuit board assembly · CPC title

• H04M1/0274

  for an electrical connector module · CPC title