PCB laminated structure and mobile terminal having the same

Patent metadata

Field	Value
Publication number	US-10342131-B1
Application number	US-201816041147-A
Country	US
Kind code	B1
Filing date	Jul 20, 2018
Priority date	Apr 5, 2018
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

The present disclosure relates to a PCB laminated structure, including a first substrate; a second substrate disposed to overlap with the first substrate on the top and bottom; and an interposer assembly provided between the first substrate and the second substrate to allow electromagnetic connection between the first and second substrates, wherein the interposer assembly includes a housing configured to form a closed region along a top surface circumference of the first substrate and a bottom surface circumference of the second substrate to support the first and second substrates; a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate; and a ground via connected to the housing to serve as a ground, and spaced a set distance from the signal via at one side of the signal via.

First claim

What is claimed is:

1. A printed circuit board (PCB) laminated structure, comprising:
a first substrate;
a second substrate disposed to overlap with the first substrate; and
an interposer assembly disposed between the first substrate and the second substrate and configured to allow signal communication between the first and second substrates,
wherein the interposer assembly comprises:
a housing configured to form a closed region between a top surface of the first substrate and a bottom surface of the second substrate;
a signal via electrically coupling the first substrate and the second substrate and configured to transmit signals between the first substrate and the second substrate; and
a ground via electrically coupled to the housing and configured to serve as a ground, wherein the ground via is positioned apart from the signal via by a predetermined distance, and
a metal coating layer disposed at a side surface of the housing and configured to shield signals, wherein the metal coating layer is selectively disposed along the side surface of the housing to be adjacent to signal emission devices mounted on the first and second substrates such that portions of the side surface of the housing are exposed between gaps of the selectively disposed metal coating layer.

2. The PCB laminated structure of claim 1 , further comprising a plurality of signal vias and a plurality of ground vias which are arranged at predetermined intervals along a circumference of the closed region.

3. The PCB laminated structure of claim 2 , wherein two or more signal vias are consecutively arranged with ground vias on both sides of the two or more signal vias.

4. The PCB laminated structure of claim 2 , wherein signal vias are arranged on both sides of each ground via.

5. The PCB laminated structure of claim 1 , wherein the signal via comprises:
a signal via hole configured to transmit signals therethrough; and
a signal via pad portion coupled to portions surrounding both ends of the signal via hole.

6. The PCB laminated structure of claim 5 , wherein a central portion of the signal via hole overlaps with a center of the signal via pad portion.

7. The PCB laminated structure of claim 1 , wherein the ground via comprises ground via pad portions at both ends of the ground via and configured to contact the housing.

8. The PCB laminated structure of claim 1 , wherein the housing comprises:
support portions coupled to the top surface of the first substrate and the bottom surface of the second substrate; and
one or more sidewall portions connecting the support portions.

9. The PCB laminated structure of claim 2 , wherein the ground vias adjacent to the metal coating layer are spaced apart such that a distance between the centers of each ground via is 0.6 mm or less.

10. The PCB laminated structure of claim 4 , wherein groupings of two consecutive signal vias are arranged with a ground via interposed between each grouping, and wherein each grouping of signal vias is configured to have a phase difference of 180 degrees between electromagnetic signals transmitted by each signal via of the grouping.

11. A mobile terminal, comprising:
a terminal body;
an inner case disposed inside the terminal body;
a display mounted at a front of the inner case;
a rear case coupled to a rear of the inner case to cover a rear portion of the terminal body;
a main circuit board disposed between the inner case and the rear case; and
a PCB laminated structure disposed at one side of the main circuit board and comprising:
a first substrate;
a second substrate disposed to overlap with the first substrate; and
an interposer assembly disposed between the first substrate and the second substrate and configured to allow signal communication between the first and second substrates,
wherein the interposer assembly comprises:
a housing configured to form a closed region between a top surface of the first substrate and a bottom surface of the second substrate;
a signal via electrically coupling the first substrate and the second substrate and configured to transmit signals between the first substrate and the second substrate;
a ground via electrically coupled to the housing and configured to serve as a ground, wherein the ground via is positioned apart from the signal via by a predetermined distance; and
a metal coating layer disposed at a side surface of the housing and configured to shield signals, wherein the metal coating layer is selectively disposed along the side surface of the housing to be adjacent to signal emission devices mounted on the first and second substrates such that portions of the side surface of the housing are exposed between gaps of the selectively disposed metal coating layer.

12. The mobile terminal of claim 11 , further comprising a plurality of signal vias and a plurality of ground vias which are arranged at predetermined intervals along a circumference of the closed region.

13. The mobile terminal of claim 12 , wherein two or more signal vias are consecutively arranged with ground vias on both sides of the two or more signal vias.

14. The mobile terminal of claim 12 , wherein signal vias are arranged on both sides of each ground via.

15. The mobile terminal of claim 14 , wherein groupings of two consecutive signal vias are arranged with a ground via interposed between each grouping, and wherein each grouping of signal vias is configured to have a phase difference of 180 degrees between electromagnetic signals transmitted by each signal via of the grouping.

16. The mobile terminal of claim 11 , wherein the housing comprises:
support portions coupled to the top surface of the first substrate and the bottom surface of the second substrate; and
one or more sidewall portions connecting the support portions.

17. The mobile terminal of claim 11 , wherein the signal via comprises:
a signal via hole configured to transmit signals therethrough; and
a signal via pad portion coupled to portions surrounding both ends of the signal via hole,
wherein a central portion of the signal via hole overlaps with a center of the signal via pad portion.

Assignees

• Lg Electronics Inc

Inventors

• Kim Jaehyuk
• Paek Kyungcheol
• Lim Chaejoo

Classifications

• H05K2201/10378

  Interposers · CPC title

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title

• H05K2201/09618

  Via fence, i.e. one-dimensional array of vias · CPC title

• H01Q1/243

  with built-in antennas · CPC title