Method of producing resin and method of producing insulating structure

Patent metadata

Field	Value
Publication number	US-12168722-B2
Application number	US-202017634996-A
Country	US
Kind code	B2
Filing date	Dec 22, 2020
Priority date	Aug 31, 2020
Publication date	Dec 17, 2024
Grant date	Dec 17, 2024

Abstract

A resin producing method is a method of producing a resin with which an insulating structure formed on an outer peripheral portion of a conductor is impregnated, the method including: a filler mixing step of mixing a nanofiller at a ratio of 15 wt % or more with an epoxy resin to form a mixture; a shear mixing step of causing the mixture to be subjected to shear mixing; a diluent mixing step of mixing a reactive diluent that reduces a viscosity of the epoxy resin, with the mixture after the shear mixing step; and a curing agent mixing step of mixing an acid anhydride curing agent with the mixture after the diluent mixing step.

First claim

The invention claimed is:

1. A method of producing an insulating structure formed on an outer peripheral portion of a conductor, the method comprising:
a resin production step of producing a resin including a nanofiller; and
a step of impregnating a non-conductive tape-shaped member wound around the outer peripheral portion of the conductor with the resin, wherein
the resin production step includes:
a filler mixing step of mixing the nanofiller at a ratio of 15 wt % or more with an epoxy resin to form a mixture;
a shear mixing step of mixing the mixture to disperse the nanofiller in the mixture by shear mixing;
a diluent mixing step of mixing a reactive diluent that reduces a viscosity of the epoxy resin, with the mixture after the shear mixing step, and
a curing agent mixing step of mixing an acid anhydride curing agent with the mixture after the diluent mixing step,

wherein the resin production step further comprising a dispersiveness evaluation step of evaluating dispersiveness of the nanofiller in the mixture after the diluent mixing step, and
wherein the curing agent mixing step is performed when dispersiveness of the nanofiller is evaluated to satisfy a predetermined criterion in the dispersiveness evaluation step.

2. The method of producing the insulating structure according to claim 1 , wherein
the mixture after the filler mixing step has a viscosity of 100 P or more.

3. The method of producing the insulating structure according to claim 2 , wherein
the mixture after the diluent mixing step has a viscosity of 10 P or less.

4. The method of producing the insulating structure according to claim 1 , wherein
the epoxy resin includes an alicyclic epoxy resin.

5. The method of producing the insulating structure according to claim 4 , wherein
the reactive diluent includes butyl glycidyl ether.

6. A method of producing a resin with which an insulating structure formed on an outer peripheral portion of a conductor is impregnated, the method comprising:
mixing a nanofiller at a ratio of 15 wt % or more with an epoxy resin to form a mixture;
mixing the mixture to disperse the nanofiller in the mixture by shear mixing;
mixing a reactive diluent that reduces a viscosity of the epoxy resin, with the mixture after the shear mixing; and
mixing an acid anhydride curing agent with the mixture after mixing the reactive diluent,
wherein evaluating dispersiveness of the nanofiller in the mixture is performed after mixing the reactive diluent, and
wherein mixing the acid anhydride curing agent with the mixture is performed when dispersiveness of the nanofiller is evaluated to satisfy a predetermined criterion by evaluating dispersiveness of the nanofiller.

7. The method of producing a resin according to claim 6 , wherein
the mixture after mixing the nanofiller has a viscosity of 100 P or more.

8. The method of producing a resin according to claim 7 , wherein
the mixture after the diluent mixing step has a viscosity of 10 P or less.

9. The method of producing a resin according to claim 6 , wherein
the epoxy resin includes an alicyclic epoxy resin.

10. The method of producing a resin according to claim 9 , wherein
the reactive diluent includes butyl glycidyl ether.

Assignees

• Toshiba Mitsubishi Electric Industrial Systems Corp
• Tmeic Corp

Inventors

• Ushiwata Kodai
• Yamashita Yu
• Yoshimitsu Tetsuo
• Imai Takahiro
• Hirai Hiromitsu

Classifications

• H02K3/32

  Windings characterised by the shape, form or construction of the insulation · CPC title

• H01B17/56

  Insulating bodies · CPC title

• H01B13/0036

  Details · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• C08G59/42 Primary

  Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof · CPC title