Chip on film and display device

Patent metadata

Field	Value
Publication number	US-12164201-B2
Application number	US-202117478267-A
Country	US
Kind code	B2
Filing date	Sep 17, 2021
Priority date	Feb 19, 2021
Publication date	Dec 10, 2024
Grant date	Dec 10, 2024

Abstract

The present disclosure provides a chip on film and a display device. The chip on film includes: a first end, wherein a first row of bonding terminals and a second row of bonding terminals are arranged on a first surface of the first end, the first row of bonding terminals and the second row of bonding terminals are spaced apart and insulated from each other, and the first row of bonding terminals is closer to a center of the chip on film than the second row of bonding terminals; and a plurality of leads, extending in a second direction and including a first part and a second part. A first end section of each lead of the first part serves as one of the first row of bonding terminals, a first end section of each lead of the second part serves as one of the second row of bonding terminals.

First claim

The invention claimed is:

1. A chip on film comprising:
a first end, wherein a first row of bonding terminals and a second row of bonding terminals are arranged in a first direction on a first surface of the first end, the first row of bonding terminals and the second row of bonding terminals are spaced apart and insulated from each other, and the first row of bonding terminals is closer to a center of the chip on film than the second row of bonding terminals;
a plurality of leads, extending in a second direction intersecting with the first direction, the plurality of leads comprising a first part and a second part;
a second end opposite to the first end; and
a widening portion between the first end and the second end,
wherein the first part is arranged on the first surface of the chip on film, a number of leads in the first part is equal to a number of bonding terminals in the first row of bonding terminals, and a first end section of each lead of the first part serves as a corresponding one of the first row of bonding terminals;
wherein a body of the second part is arranged on a second surface of the chip on film facing away from the first surface, a first end section of the second part penetrates the chip on film and is arranged on the first surface of the chip on film, a number of leads in the second part is equal to a number of bonding terminals in the second row of bonding terminals, and the first end section of each lead of the second part serves as a corresponding one of the second row of bonding terminals; and
wherein a width of the widening portion in the first direction is greater than a width of the first end and a width of the second end in the first direction.

2. The chip on film according to claim 1 , wherein the plurality of leads are divided into a plurality of lead groups, and a spacing between two adjacent leads in each lead group of the plurality of lead groups is equal.

3. The chip on film according to claim 2 , wherein each lead group further comprises a plurality of pads, and a number of the plurality of pads is equal to a number of leads in each lead group, and a second end section of each lead in each lead group opposite to the first end section is connected to a corresponding one of the plurality of pads.

4. The chip on film according to claim 3 , wherein the spacing between two adjacent leads in each lead group is smaller than a spacing between two adjacent lead groups.

5. The chip on film according to claim 4 , wherein the spacing between two adjacent lead groups is greater than a width of one of the plurality of pads in the first direction.

6. The chip on film according to claim 3 , wherein a width of the first end section of each lead in the first direction is greater than a width of the second end section of each lead in the first direction.

7. The chip on film according to claim 3 , wherein the spacing between two adjacent leads in each lead group is equal to a spacing between two adjacent lead groups.

8. The chip on film according to claim 7 , wherein the spacing between two adjacent lead groups is smaller than a width of one of the plurality of pads in the first direction.

9. The chip on film according to claim 8 ,
wherein in adjacent first lead group and second lead group of the plurality of lead groups, a first lead at an edge in the first lead group is connected to a first pad, and a second lead in the second lead group adjacent to the first lead is connected to a second pad, and
wherein the second pad is offset from the first pad by a first distance in the first direction, the first distance is smaller than a width of the first pad in the first direction, and the second pad is offset from the first pad by a second distance in the second direction.

10. The chip on film according to claim 9 , wherein each lead in a part of the plurality of lead groups is a bent line.

11. The chip on film according to claim 3 , wherein lengths of the plurality of leads in each lead group gradually decrease in the first direction, or lengths of the plurality of leads in one lead group of the plurality of lead groups gradually increase in the first direction, and lengths of the plurality of leads in another lead group adjacent to the one lead group gradually decrease in the first direction.

12. The chip on film according to claim 11 ,
wherein in each lead group, one lead is connected to a third pad, and another lead adjacent to the one lead is connected to a fourth pad, and
wherein the fourth pad is offset from the third pad by a third distance in the first direction, and the third distance is smaller than a width of the third pad in the first direction, the fourth pad is offset from the third pad by a fourth distance in the second direction, and the fourth distance is greater than a length of the third pad in the second direction.

13. The chip on film according to claim 12 , wherein a number of pads in each lead group satisfies a formula:

w
+

(

m
+
h

)

*

(

x
-
1

)

x

≥

h
0

where x is the number of pads in each lead group, w is a width of the pad in the first direction, m is a width of the lead in the first direction, h is the spacing between two adjacent leads, h0 is a bonding pitch between two adjacent bonding terminals in the first row of bonding terminals or the second row of bonding terminals.

14. The chip on film according to claim 1 , wherein the second row of bonding terminals is offset by a distance in the first direction relative to the first row of bonding terminals, and each of the second row of bonding terminals is between two adjacent bonding terminals in the first row of bonding terminals.

15. The chip on film according to claim 1 , further comprising:
an integrated circuit,
wherein the integrated circuit is arranged at the widening portion, and the first row of bonding terminals and the second row of bonding terminals are respectively connected to the integrated circuit through the first part and the second part of the plurality of leads.

16. A display device comprising a display panel, a circuit board, and at least two chip on films according to claim 1 .

17. The display device according to claim 16 , wherein each of the at least two chip on films further comprises a third row of bonding terminals and a fourth row of bonding terminals arranged in the first direction on the first surface of the second end, the third row of bonding terminals and the fourth row of bonding terminals are spaced apart and insulated from each other, and the third row of bonding terminals is closer to the center of the chip on film than the fourth row of bonding terminals,
wherein the first end of each chip on film is bonded to the display panel through the first row of bonding terminals and the second row of bonding terminals, and
wherein the second end of each chip on film

Assignees

• Hefei Boe Joint Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Li Huihui
• Bao Wenchao
• Meng Song

Classifications

• H10W72/50

  Bond wires · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• G09F9/30

  in which the desired character or characters are formed by combining individual elements (panels comprising a number of electrodes in a single cell controlling light arriving from an independent light source, e.g. electro-optical or magneto-optical cell, G02F1/00) · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• G02F1/13458 Primary

  Terminal pads · CPC title