Substrate treating apparatus and substrate treating method

Patent metadata

Field	Value
Publication number	US-12159793-B2
Application number	US-202217978328-A
Country	US
Kind code	B2
Filing date	Nov 1, 2022
Priority date	Dec 28, 2021
Publication date	Dec 3, 2024
Grant date	Dec 3, 2024

Abstract

A substrate treating method including removing particles formed on a substrate by continuously performing a process of supplying a treatment liquid including a polymer and a solvent onto the substrate, forming a solidified liquid film by volatilizing the solvent in the treatment liquid, removing the solidified liquid film from the substrate by supplying a stripping liquid onto the substrate, and supplying a rinse liquid onto the substrate may be provided.

First claim

What is claimed is:

1. A substrate treating method, comprising:
a prior removal operation of removing contaminants formed on the substrate; and
a post removal operation of further removing residual contaminants remaining on the substrate after the prior removal operation,
wherein each of the prior removal operation and the post removal operation includes:
a treatment liquid supply operation of supplying a treatment liquid including a polymer and a solvent onto the substrate;
a solidified liquid film formation operation of forming a solidified liquid film by volatilizing the solvent in the treatment liquid;
a stripping operation of supplying a stripping liquid onto the substrate to remove the solidified liquid film from the substrate; and
a rinsing operation of supplying a rinse liquid to the substrate to clean the substrate, wherein
the treatment liquid supply operation of the post removal operation includes supplying the treatment liquid to the substrate that is coated with the rinse liquid supplied in the prior removal operation, and
a surface tension of the rinse liquid is lower than a surface tension of the treatment liquid.

2. The substrate treating method of claim 1 , wherein the rinse liquid is isopropyl alcohol.

3. The substrate treating method of claim 1 , wherein the stripping liquid in the prior removal operation includes deionized water, and
the stripping liquid in the post removal operation includes a hydrogen peroxide solution or a mixed solution of a hydrogen peroxide solution and deionized water.

4. The substrate treating method of claim 3 , wherein in the treatment liquid supply operation of the prior removal operation, the treatment liquid is supplied to the substrate rotating at a first speed, and
in the treatment liquid supply operation of the post removal operation, the treatment liquid is supplied to the substrate rotating at a second average speed lower than the first speed, and a rotation speed of the substrate is changed from a third speed lower than the second average speed to the first speed while the treatment liquid is supplied to the substrate.

5. A substrate treating method for removing particles formed on a substrate, the substrate treating method comprising:
performing a first process of supplying a first treatment liquid including a polymer and a solvent onto the substrate rotating at a first speed;
forming a first solidified liquid film by volatilizing the solvent in the first treatment liquid;
removing the first solidified liquid film from the substrate by supplying a first stripping liquid onto the substrate;
supplying a first rinse liquid onto the substrate; and
performing a second process of supplying a second treatment liquid including a polymer and a solvent onto the substrate in a state in which the substrate is coated with the first rinse liquid,
wherein a surface tension of the first rinse liquid is lower than a surface tension of the second treatment liquid.

6. The substrate treating method of claim 5 , wherein the substrate is rotated during the first process and during the second process.

7. The substrate treating method of claim 5 , wherein
in the first process, the first treatment liquid is supplied to the substrate rotating at the first speed, and
in the second process, the second treatment liquid is supplied to the substrate rotating at a second average speed lower than the first speed.

8. The substrate treating method of claim 7 , wherein a rotation speed of the substrate is changed from a third speed that is lower than the second average speed to the first speed while the second treatment liquid is supplied to the substrate in the second process.

9. The substrate treating method of claim 8 , further comprising:
forming a second solidified liquid film by volatilizing the solvent in the second treatment liquid;
removing the second solidified liquid film from the substrate by supplying a second stripping liquid onto the substrate; and
supplying a second rinse liquid onto the substrate,
wherein the second stripping liquid includes a hydrogen peroxide solution or a mixed solution of a hydrogen peroxide solution and deionized water.

10. The substrate treating method of claim 9 , wherein the first stripping liquid includes deionized water.

11. The substrate treating method of claim 9 , wherein the first stripping liquid and the second stripping liquid are different from each other.

12. The substrate treating method of claim 9 , wherein the first rinse liquid and the second rinse liquid are isopropyl alcohol.

Assignees

• Semes Co Ltd

Inventors

• Cho Min Hee
• Lee Kyeong Min
• Kang Won Young
• Kim Kang Sul
• Kim Tae-Keun

Classifications

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P50/287

  by chemical means · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title