Fabrication of superconducting devices that control direct currents and microwave signals

Patent metadata

Field	Value
Publication number	US-12148974-B2
Application number	US-202217658283-A
Country	US
Kind code	B2
Filing date	Apr 7, 2022
Priority date	Oct 15, 2018
Publication date	Nov 19, 2024
Grant date	Nov 19, 2024

Abstract

Fabrication of superconducting devices that combine or separate direct currents and microwave signals is provided. A method can comprise forming a direct current circuit that supports a direct current, a microwave circuit that supports a microwave signal, and a common circuit that supports the direct current and the microwave signal. The method can also comprise operatively coupling a first end of the direct current circuit and a first end of the microwave circuit to a first end of the common circuit. The direct current circuit can comprise a bandstop circuit and the microwave circuit can comprise a capacitor. Alternatively, the direct current circuit can comprise a bandstop circuit and the microwave circuit can comprise a bandpass circuit. Alternatively, the microwave circuit can comprise a capacitor and the direct current circuit can comprise one or more quarter-wavelength transmission lines.

First claim

What is claimed is:

1. A circuit comprising:
a direct current circuit that comprises a bandstop circuit that transmits a direct current, wherein the bandstop circuit comprises a bandstop filter that transmits the direct current and blocks microwave signals that are within a bandwidth range of a superconducting device;
a microwave circuit that comprises a bandpass circuit that transmits a microwave signal, wherein the bandpass circuit comprises a bandpass filter that transmits microwave signals that are within a microwave bandwidth range of a superconducting circuit and blocks the direct current; and
a common circuit that transmits the direct current and the microwave signal, wherein a first end of the common circuit is coupled to a first end of the direct current circuit and to a first end of the microwave circuit.

2. The circuit of claim 1 , wherein the common circuit comprises a common node at the first end of the common circuit, and wherein the common node is coupled to the first end of the direct current circuit and to the first end of the microwave circuit.

3. The circuit of claim 2 , wherein a second end of the direct current circuit is coupled to a direct current port that transmits the direct current, a second end of the microwave circuit is coupled to a microwave port that transmits the microwave signal, and a second end of the common circuit is coupled to a common port that transmits the direct current and the microwave signal.

4. The circuit of claim 1 , further comprising:
a first superconducting film deposited on a wafer comprising an inductor;
a second superconducting film deposited on the first superconducting film;
a dielectric film deposited on the second superconducting film; and
a third superconducting film deposited on the dielectric film.

5. The circuit of claim 4 , wherein the second superconducting film comprises the direct current circuit, the common circuit, and a first portion of the microwave circuit, and wherein the third superconducting film comprises a second portion of the microwave circuit.

6. The circuit of claim 4 , wherein the second superconducting film comprises a first portion of the microwave circuit, and wherein the third superconducting film comprises the direct current circuit, the common circuit, and a second portion of the microwave circuit.

7. A circuit, comprising:
a direct current circuit that transmits a direct current comprising a first capacitor coupled to electrical ground and that shunts a first quarter-wavelength transmission line;
a microwave circuit that transmits a microwave signal comprising a second capacitor coupled to electrical ground, wherein the second capacitor shunts a second quarter-wavelength transmission line, and wherein the microwave circuit comprises a third capacitor coupled to electrical ground; and
a common circuit that transmits the direct current and the microwave signal and is coupled to a first end of the direct current circuit and to a first end of the microwave circuit.

8. The circuit of claim 7 , further comprising:
a first superconducting film deposited on a wafer comprising an inductor;
a second superconducting film deposited on the first superconducting film;
a dielectric film deposited on the second superconducting film; and
a third superconducting film deposited on the dielectric film.

9. The circuit of claim 8 , wherein the second superconducting film comprises the direct current circuit, the common circuit, and a first portion of the microwave circuit, and wherein the third superconducting film comprises a second portion of the microwave circuit.

10. The circuit of claim 8 , wherein the second superconducting film comprises a first portion of the microwave circuit, and wherein the third superconducting film comprises the direct current circuit, the common circuit, and a second portion of the microwave circuit.

11. A circuit comprising:
a direct current circuit that transmits a direct current comprising a first capacitor coupled to electrical ground that shunts a first quarter-wavelength transmission line and a second capacitor coupled to electrical ground that shunts a second quarter-wavelength transmission line;
a microwave circuit that transmits a microwave signal comprising a third capacitor coupled to electrical ground; and
a common circuit that transmits the direct current and the microwave signal and is coupled to a first end of the direct current circuit and to a first end of the microwave circuit.

12. The circuit of claim 11 , wherein the direct current circuit comprises a second end coupled to a direct current port that transmits the direct current, the microwave circuit comprises a second end coupled to a microwave port that transmits the microwave signal, and the common circuit comprises a second end coupled to a common port that transmits the directed current and the microwave signal.

13. The circuit of claim 11 , further comprising:
a first superconducting film deposited on a wafer comprising an inductor;
a second superconducting film deposited on the first superconducting film;
a dielectric film deposited on the second superconducting film; and
a third superconducting film deposited on the dielectric film.

14. The circuit of claim 13 , wherein the second superconducting film comprises the direct current circuit, the common circuit, and a first portion of the microwave circuit, and wherein the third superconducting film comprises a second portion of the microwave circuit.

15. The circuit of claim 13 , wherein the second superconducting film comprises a first portion of the microwave circuit, and wherein the third superconducting film comprises the direct current circuit, the common circuit, and a second portion of the microwave circuit.

16. A circuit comprising:
a first superconducting film deposited on a wafer comprising an inductor;
a second superconducting film deposited on the first superconducting film;
a dielectric film deposited on the second superconducting film;
a third superconducting film deposited on the dielectric film;
a direct current circuit that comprises a bandstop circuit that transmits a direct current;
a microwave circuit that comprises a bandpass circuit that transmits a microwave signal; and
a common circuit that transmits the direct current and the microwave signal, wherein a first end of the common circuit is coupled to a first end of the direct current circuit and to a first end of the microwave circuit;
wherein the second superconducting film comprises the direct current circuit, the common circuit, and a first portion of the microwave circuit, and wherein the third superconducting film comprises a second portion of the microwave circuit.

17. The circuit of claim 16 , wherein the bandstop circuit comprises a bandstop filter that transmits the directed current and blocks microwave signals that are within a bandwidth range of a superconducting device, and wherein the bandpass circuit comprises a bandpass filter that transmits microwave signals that are within a microwave bandwidth range of a superconducting circuit and blocks direct current.

18. The circuit of claim 16 , wherein the common circuit comprises a common node at the first end of the first of the common circuit, and wherein the common node is coupled to the first end of the direct current circuit and to the first end of the microwave circuit.

19. The circuit of claim 18 , wherein a second end of the direct current circuit is coupled to a direct current port that transmits the direct current, a second end of the microwa

Assignees

• IBM

Inventors

• Abdo Baleegh
• Brink Markus

Classifications

• H03H2007/013

  Notch or bandstop filters · CPC title

• H03H7/0161

  Bandpass filters (H03H7/12 takes precedence) · CPC title

• H01P1/2007 Primary

  Filtering devices for biasing networks or DC returns · CPC title

• H01P1/2039

  Galvanic coupling between Input/Output · CPC title

• H03H7/46

  Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source · CPC title