Sidewall connections and button interconnects for molded SiPs

Patent metadata

Field	Value
Publication number	US-12148741-B2
Application number	US-202217806412-A
Country	US
Kind code	B2
Filing date	Jun 10, 2022
Priority date	Aug 20, 2021
Publication date	Nov 19, 2024
Grant date	Nov 19, 2024

Abstract

Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

First claim

What is claimed is:

1. An electronic module comprising:
a system-in-package including:
a routing substrate;
a first electronic component mounted on a first side of the routing substrate and encapsulated in a first molding compound layer; and
a socket connector housing mounted on the routing substrate and within a cavity in the first molding compound layer, the socket connector housing including a side receptacle opening;
wherein the cavity is exposed along a first side surface of the first molding compound layer;

a flexible circuit extending into the cavity from outside the first molding compound layer and connected inside the side receptacle opening of the socket connector housing.

2. The electronic module of claim 1 , further comprising a shield can over the socket connector housing and embedded within the first molding compound layer.

3. The electronic module of claim 2 , wherein the cavity is defined by the shield can.

4. The electronic module of claim 3 , comprising an open space separating a top surface of the socket connector housing and a lid of the shield can.

5. The electronic module of claim 3 , wherein a lid of the shield can is directly on a top surface of the socket connector housing.

6. The electronic module of claim 2 , wherein the socket connector housing is laterally offset from the first side surface of the first molding compound layer.

7. The electronic module of claim 1 , further comprising an adhesive applied around the flexible circuit and adjacent the side receptacle opening to secure the flexible circuit inside the side receptacle opening.

8. The electronic module of claim 1 , wherein the socket connector housing includes a plurality of spring compression contacts.

9. The electronic module of claim 8 , wherein the plurality of spring compression contacts includes a top group of spring compression contacts and a bottom group of spring compression contacts.

10. The electronic module of claim 9 , wherein the flexible circuit includes a top group of contacts directly connected to the top group of spring compression contacts and a bottom group of contacts directly connected to the bottom group of spring compression contacts.

11. The electronic module of claim 1 , wherein the flexible circuit includes a plurality of spring compression contacts inserted into the socket connector.

12. The electronic module of claim 1 , further comprising a shield can over the socket connector housing and embedded within the first molding compound layer, wherein the shield can is electrically conductive.

13. The electronic module of claim 1 , further comprising a shield can over the socket connector housing and embedded within the first molding compound layer, wherein the shield can is electrically insulating.

14. The electronic module of claim 1 , further comprising an integrated electronic component mounted on the flexible circuit, wherein the integrated electronic component is electrically connected with the routing substrate.

15. The electronic module of claim 14 , wherein the electronic component comprises a sensor.

16. The electronic module of claim 15 , wherein the system-in-package and the flexible circuit are secured in a housing, and the sensor is oriented adjacent an opening in the housing.

Assignees

• Apple Inc

Inventors

• Kani Bilal Mohamed Ibrahim
• Ergun Ali N
• Renjan Kishore N
• Kim Kyusang
• Vadeentavida Manoj
• Grena Benjamin J
• Kindlon David M
• Hoang Lan H

Classifications

• H10W74/124

  the encapsulations having cavities other than that occupied by chips · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W72/801

  Interconnections on sidewalls of containers · CPC title