Substrate treating apparatus

Patent metadata

Field	Value
Publication number	US-12145179-B2
Application number	US-202117496826-A
Country	US
Kind code	B2
Filing date	Oct 8, 2021
Priority date	Oct 29, 2020
Publication date	Nov 19, 2024
Grant date	Nov 19, 2024

Abstract

Disclosed is a substrate treating apparatus for performing treatment with supply of fluids to a substrate. The apparatus includes a first treatment housing, a treating section provided inside of the first treatment housing and configured to treat a substrate placed on a mount table with the fluids, a first fluid supplying section located on a first lateral side of the treating section, seen from a front side face where maintenance is performed to the first treatment housing, and configured to supply a first fluid of the fluids to the treating section, and a second fluid supplying section located on a second lateral side of the treating section, seen from the front side face, and configured to supply a second fluid of the fluids to the treating section.

First claim

What is claimed is:

1. A substrate treating apparatus for performing treatment with supply of fluids to a substrate, the apparatus comprising:
a first treatment housing;
a lateral wall provided in the first treatment housing and located toward an outer side of the apparatus, where maintenance of the apparatus is performed;
a treating section provided inside of the first treatment housing and configured to treat a substrate placed on a mount table with the fluids;
a first supplying section located on a first lateral side of the treating section, seen from the lateral wall to the first treatment housing, and configured to supply a first fluid of the fluids to the treating section; and
a second supplying section located on a second lateral side of the treating section, seen from the lateral wall to the first treatment housing, and configured to supply a second fluid of the fluids to the treating section, wherein
the first suppling section includes:
a first nozzle configured to supply the first fluid to a substrate placed on the mount table; and
a first fluid supplying section configured to supply the first fluid to the first nozzle, and
the second supplying section includes:
a second nozzle configured to supply the second fluid to a substrate placed on the mount table, and
a second fluid supplying section configured to supply the second fluid to the second nozzle,
the first nozzle includes a first proximal end configured to supply the first fluid from the first fluid supplying section, a first eject part in fluid communication with the first proximal end, and an arm connecting the first proximal end to the first eject part, the first proximal end is located closer to the first fluid supplying section than the mount table, and the first eject part swings about the first proximal end between a supply position above the mount table and a standby position away from the mount table, and
the second nozzle includes a second proximal end configured to supply the second fluid from the second fluid supplying section, a second eject part in fluid communication with the second proximal end, and an arm connecting the second proximal end to the second eject part, and the second proximal end is located closer to the second fluid supplying section than the mount table, and the second eject part swings about the second proximal end between a supply position above the mount table and a standby position away from the mount table,
the first proximal end of the fist nozzle and the second proximal end of the second nozzle are located adjacent to the lateral wall of the first treatment housing,
the first fluid supplying section is located adjacent to a third lateral side of the first proximal end of the first nozzle, and
the second fluid supplying section is located adjacent to a fourth lateral side of the second proximal end of the second nozzle.

2. The substrate treating apparatus according to claim 1 , wherein
the first fluid differs from the second fluid.

3. The substrate treating apparatus according to claim 1 , wherein
the first fluid and the second fluid are each a liquid.

4. The substrate treating apparatus according to claim 2 , wherein
the first fluid and the second fluid are each a liquid.

5. The substrate treating apparatus according to claim 1 , wherein
the first fluid supplying section includes:
a first fluid reservoir configured to store the first fluid and having a feed portion through which the first fluid is fed and a return portion through which the first fluid returns;
a supplying pipe in fluid communication with the feed portion of the first fluid reservoir;
a collecting pipe in fluid communication with the return portion of the first fluid reservoir;
a collecting section provided at the standby position for collecting the first fluid fed through the first nozzle;
a discharge pipe in fluid communication with the collecting section for discharging the first fluid collected in the collecting section;
a supply branch pipe whose one end is in fluid communication with the supplying pipe and whose other end is in fluid communication with the first proximal end;
a flow meter configured to determine a flow rate of the first fluid in the supply branch pipe;
a flow rate regulating valve provided closer to the supply branch pipe than the flow meter and configured to operate a flow rate of the first fluid in the supply branch pipe; and
a supply control valve configured to supply and stop the first fluid, adjusted with the flow rate regulating valve, through the first nozzle.

6. The substrate treating apparatus according to claim 5 , wherein
the flow rate regulating valve is located adjacent to the lateral wall of the first treatment housing.

7. The substrate treating apparatus according to claim 5 , wherein
the first fluid supplying section further includes:
a return pipe whose one end is in fluid communication with a portion of the supply branch pipe between the supply control valve and the flow rate regulating valve and whose other end is in fluid communication with the collecting pipe; and
a return on-off valve provided in the return pipe and configured to permit and block flow of the first fluid in the return pipe, and

when the first nozzle is at the standby position, the supply control valve closes and the return on-off valve opens to return the first fluid to the first fluid reservoir via the return pipe for circulating the first fluid.

8. The substrate treating apparatus according to claim 6 , wherein
the first fluid supplying section further includes:
a return pipe whose one end is in fluid communication with a portion of the supply branch pipe between the supply control valve and the flow rate regulating valve and whose other end is in fluid communication with the collecting pipe; and
a return on-off valve provided in the return pipe and configured to permit and block flow of the first fluid in the return pipe, and

when the first nozzle is at the standby position, the supply control valve closes and the return on-off valve opens to return the first fluid to the first fluid reservoir via the return pipe for circulating the first fluid.

9. The substrate treating apparatus according to claim 7 , further comprising:
a first manual on-off valve provided in the supply branch pipe and configured to manually permit and block flow of the first fluid in the supply branch pipe; and
a second manual on-off valve provided in the return pipe and configured to manually permit and block flow of the first fluid in the return pipe.

10. The substrate treating apparatus according to claim 5 , wherein
the first fluid is an organic solvent,
the flow meter and the flow rate regulating valve are housed in a shielding container that shields the atmosphere in the container from the surroundings of the container, and
the shielding container is internally exhausted.

11. The substrate treating apparatus according to claim 9 , wherein
the first manual on-off valve and the second manual on-off valve are located adjacent to the lateral wall of the first treatment housing.

12. The substrate treating apparatus according to claim 1 , wherein
an exhaust box configured to exhaust gas from the treating section is located adjacent to the first supplying section.

13. The substrate treating apparatus according to claim 1 , further comprising:
a second treatment housing located below the first treatment housing, and
the second treatment housing includes:
a second treating section provided inside of the second treatment housing and configured to treat a substrate placed on a mount table with the fluids;
a first fluid supplying se

Assignees

• Screen Holdings Co Ltd

Inventors

• Sawashima Jun
• Yamaguchi Takahiro

Classifications

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0411

  for wet cleaning or washing · CPC title

• H10P72/0404

  for general liquid treatment, e.g. etching followed by cleaning · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/3202

  Mechanical details, e.g. rollers or belts · CPC title