Substrate treating apparatus with exhaust airflow guide

Patent metadata

Field	Value
Publication number	US-12140868-B2
Application number	US-202217749437-A
Country	US
Kind code	B2
Filing date	May 20, 2022
Priority date	May 20, 2022
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes substrate treating apparatus comprising: a treating container having an inner space; a support unit configured to support and rotate a substrate within the inner space; an exhaust duct configured to exhaust the inner space; and at least one guide member combined with the treating container and configured to guide an airflow within the inner space, and wherein the at least one guide member is arranged such that the airflow within the inner space obliquely flows with respect to a rotation direction of the substrate supported by the support unit when seen from above.

First claim

What is claimed is:

1. A substrate treating apparatus comprising:
a treating container comprising an inner cup and an outer cup, the treating container

having an inner space encircled by an outer cup;
a support configured to support and rotate a substrate within the inner space;
an exhaust duct configured to exhaust the inner space, the inner cup having an outer wall

and an inner wall, an outer wall of the inner cup is located between the exhaust duct and the outer cup such that a first surface of the outer wall of the inner cup faces the exhaust duct and a second surface of the outer wall faces away from the exhaust duct, the exhaust duct located within the inner space and between the inner wall and the outer wall of the inner cup; and
at least one guide plate combined with the treating container and configured to guide an airflow within the inner space,
wherein the at least one guide plate is inclined with respect to a tangential direction of the substrate supported by the support such that the airflow within the inner space obliquely flows with respect to the tangential direction of the substrate,
wherein, in a stacking direction of the substrate on the support, a bottom surface of the guide plate is inclined such that the airflow passes below the bottom surface of the guide plate, a direction of the airflow being different at a first edge of the bottom surface of the guide plate than at a second edge of the bottom surface of the guide plate, and
wherein the guide plate is disposed on the second surface of the inner cup that faces away from the exhaust duct.

2. The substrate treating apparatus of claim 1 , wherein each of the at least one guide plate comprises:
a coupling part configured to combine with the treating container; and
an extension part extending from the coupling part, provided in a direction from a top to a bottom so a lengthwise direction of the extension part has a predetermined angle with respect to the tangential direction of the substrate.

3. The substrate treating apparatus of claim 2 , wherein one end of the coupling part is combined to the treating container.

4. The substrate treating apparatus of claim 2 , wherein the predetermined angle is 45 degrees.

5. The substrate treating apparatus of claim 2 , wherein each of the at least guide plate further comprises a hinge pin configured to combine the extension part to the treating container at a middle point of the extension part, and
wherein the extension part further comprises:
a fixing part disposed above the hinge pin and configured to be fixed to the treating container; and
a rotation plate disposed below the hinge pin and configured to rotate based on the hinge pin.

6. The substrate treating apparatus of claim 5 , wherein the each of the at least guide plate further comprises a stopper configured to limit a rotation angle of the rotation plate so the rotation plate rotate within between the tangential direction of the substrate and a direction perpendicular to the substrate.

7. The substrate treating apparatus of claim 1 , further comprising:
a fan unit configured to supply a downward airflow into the inner space; and
a nozzle configured to supply a treating liquid to the substrate supported by the support.

8. The substrate treating apparatus of claim 1 , wherein the at least one guide plate comprises a plurality of guide plates spaced apart along a circumferential direction of the substrate supported by the support.

9. A substrate treating apparatus comprising:
a treating container having an inner space;
a support configured to support and rotate a substrate within the inner space;
an exhaust duct configured to exhaust an airflow within the inner space; and a plurality of guide plates disposed in the treating container and configured to guide the airflow within the inner space, wherein the plurality of guide plates are disposed adjacent so as to be inclined with respect to a tangential direction of the substrate supported by the support,
wherein a first guide plate of the plurality of guide plates is provided; wherein a lengthwise direction of the first guide plate extending in a direction from a top to a bottom, wherein the treating container comprises:
an outer cup having an inner space with an open top; and an inner cup disposed within the inner space, having a cup shape with an opening formed at a top of the inner cup, and having a treating space formed within,
wherein the inner cup has an outer wall and an inner wall, an outer wall of the inner cup is located between the exhaust duct and the outer cup such that a first surface of the outer wall of the inner cup faces the exhaust duct and a second surface of the outer wall faces away from the exhaust duct, the exhaust duct located within the inner space and between the inner wall and the outer wall of the inner cup, and
wherein, in a stacking direction of the substrate on the support, a bottom surface of the first guide plate is inclined such that the airflow passes below the bottom surface of the first guide plate, a direction of the airflow being different at a first edge of the bottom surface of the first guide plate than at a second edge of the bottom surface of the first guide plate, and wherein the first guide plate is disposed on the second surface of the inner cup that faces away from the exhaust duct.

10. The substrate treating apparatus of claim 9 , wherein the guide plate is provided between the outer cup and the inner cup.

11. The substrate treating apparatus of claim 9 , wherein the first guide plate comprises:
a coupling part configured to combine with the inner cup; and
an extension part extending from the coupling part, provided in a direction from the top to the bottom so a lengthwise direction of the extension part has a predetermined angle with respect to the tangential direction of the substrate.

12. The substrate treating apparatus of claim 11 , wherein a bottom end of the extension part is provided to be downwardly inclined in a direction facing the inner cup.

13. The substrate treating apparatus of claim 11 , wherein at an outer surface of the extension part adjacent to the outer cup, a groove portion is configured to form an inclined airflow based on the tangential direction of the substrate.

14. The substrate treating apparatus of claim 13 , wherein the inner cup defines an exhaust space coupled to an exhaust pipe within the inner space, and
an airflow within the inner space is exhausted from the treating container after being introduced into the exhaust space.

15. The substrate treating apparatus of claim 14 , wherein the extension part is disposed at a position higher than a top end of the exhaust duct provided at the exhaust space.

16. The substrate treating apparatus of claim 11 , wherein the first guide plate further comprises a hinge pin configured to couple the extension part to the treating container at a central region of a lengthwise direction of the extension part, and
wherein the extension part further comprises:
a fixing part disposed above the hinge pin and configured to be fixed to the treating container; and
a rotation plate disposed below the hinge pin and configured to rotate based on the hinge pin.

17. The substrate treating apparatus of claim 16 , wherein the inner cup further comprises a stopper configured to limit a rotation angle of the rotation plate so the rotation plate rotate within between the tangential direction of the substrate and a direction perpendicular to the substrate.

18. The substrate treating apparatus of claim

Assignees

• Semes Co Ltd

Inventors

• Jung Sun Wook
• Eum Ki Sang
• Choi Jin Ho
• Choi Byoung Doo
• Ahn Hee Man

Classifications

• B05C11/1039

  Recovery of excess liquid or other fluent material; Controlling means therefor · CPC title

• G03F7/162 Primary

  Coating on a rotating support, e.g. using a whirler or a spinner · CPC title