Substrate polishing apparatus and polishing liquid discharge method in substrate polishing apparatus

Patent metadata

Field	Value
Publication number	US-12138734-B2
Application number	US-202318297469-A
Country	US
Kind code	B2
Filing date	Apr 7, 2023
Priority date	Aug 21, 2017
Publication date	Nov 12, 2024
Grant date	Nov 12, 2024

Abstract

In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a substrate; a rotary table that has a surface to which a first opening portion is provided; a polishing liquid discharge mechanism disposed to the rotary table; and a controller configured to control at least the polishing liquid discharge mechanism. The polishing liquid discharge mechanism includes a first cylinder, a first piston, and a driving mechanism that drives the first piston. The first opening portion is communicated with a liquid holding space defined by the first cylinder and the first piston. The controller controls the driving of the first piston by the driving mechanism to increase and decrease a volume of the liquid holding space.

First claim

The invention claimed is:

1. A polishing liquid discharge method in a substrate polishing apparatus, comprising:
a step of preparing a rotary table that includes a cylinder and a piston and has a surface to which an opening portion is provided for discharging a polishing liquid;
a step of communicating with a liquid holding space and filling the polishing liquid in the liquid holding space from the opening portion, the liquid holding space being defined by the cylinder and the piston; and
a step of discharging the polishing liquid from the opening portion by driving the piston to press the polishing liquid filled in the liquid holding space.

2. The polishing liquid discharge method according to claim 1 , wherein
the step of filling the polishing liquid in the liquid holding space includes:
a step of supplying the polishing liquid to the opening portion from a position opposing the rotary table; and
a step of driving the piston to increase a volume of the liquid holding space after the step of supplying the polishing liquid or in at least a part of a period in the step of supplying the polishing liquid.

3. The polishing liquid discharge method according to claim 1 , further comprising:
a step of sensing, by a sensor, a flow rate or a pressure of a driving fluid for driving the piston; and
a step of driving the piston based on a measurement value of the sensor.

4. The polishing liquid discharge method according to claim 1 , wherein the step of driving the piston to increase a volume of the liquid holding space after the step of supplying the polishing liquid or in at least a part of a period in the step of supplying the polishing liquid comprises:
discharging the polishing liquid from the opening portion by driving the piston to press the polishing liquid filled in the liquid holding space when a substrate covers the opening portion; and
stopping discharging the polishing liquid from the opening portion when the substrate does not cover the opening portion.

5. The polishing liquid discharge method according to claim 1 , wherein the rotary table comprises a second cylinder and a second piston connected with the piston,
the method further comprising:
a step of driving the piston by driving the second piston.

6. The polishing liquid discharge method according to claim 1 , wherein the rotary table comprises a biasing mechanism for biasing the piston in a direction to increase a volume of the liquid holding space.

7. The polishing liquid discharge method according to claim 1 , wherein the rotary table comprises a second cylinder and a second piston defining a second liquid holding space,
wherein the surface of the rotary table has a second opening portion provided for discharging a polishing liquid from the second liquid holding space, the second piston is configured to be driven independently from the piston.

Assignees

• Ebara Corp

Inventors

• Togawa Tetsuji
• Kobayashi Kenichi

Classifications

• H10P52/402

  of semiconductor materials · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B47/26

  Accessories, e.g. stops · CPC title

• B24B55/06

  Dust extraction equipment on grinding or polishing machines (B24B31/12 takes precedence) · CPC title

• B24B37/00

  Lapping machines or devices; Accessories (B24B3/00 takes precedence) · CPC title