Metal-coated, polymer-encapsulated electronics modules and methods for making the same

Patent metadata

Field	Value
Publication number	US-12132010-B2
Application number	US-202117225508-A
Country	US
Kind code	B2
Filing date	Apr 8, 2021
Priority date	Apr 8, 2021
Publication date	Oct 29, 2024
Grant date	Oct 29, 2024

Abstract

Presented are metal-coated, polymer-encapsulated power semiconductor modules, methods for making/using such power modules, and vehicles with traction power inverters containing such power modules. A power electronics assembly includes one or more power semiconductor modules packaged inside an assembly housing. Each power module includes a substrate, a semiconductor device mounted on the substrate, a polymeric encapsulant encasing therein the substrate and semiconductor device, and an electrical lead connected to the semiconductor device and projecting from the polymeric encapsulant. A metallic or ceramic coating is applied to select sections of the polymeric encapsulant's exposed exterior surface. The metallic/ceramic coating may be a single metallic layer that covers substantially all of the exposed surface area of the polymeric encapsulant's exterior surface. An optional hydrophobic polymer layer, passivated layer, and/or oxidized layer may cover the exterior surface of this metallic layer. Alternatively, another metallic layer or intercalated lamellar microstructures may cover the metallic layer.

First claim

What is claimed:

1. A power electronics assembly, comprising:
an assembly housing; and
a power module packaged in the assembly housing and including a substrate, a semiconductor device mounted on the substrate, a polymeric encapsulant encasing therein the substrate and the semiconductor device, an electrical lead connected to the semiconductor device and projecting from the polymeric encapsulant, and a metallic and/or ceramic coating on an exterior surface of the polymeric encapsulant, the metallic and/or ceramic coating including:
a first metallic layer mounted directly onto and covering substantially all of an exposed surface area of the exterior surface of the polymeric encapsulant, and
intercalated lamellar microstructures on an exterior surface of the first metallic layer.

2. The power electronics assembly of claim 1 , wherein the metallic and/or ceramic coating further includes a hydrophobic polymer layer covering the exterior surface of the first metallic layer opposite an interior surface thereof adjoining the polymeric encapsulant.

3. The power electronics assembly of claim 2 , wherein the exterior surface of the first metallic layer covered by the hydrophobic polymer layer includes an etched or roughened finish.

4. The power electronics assembly of claim 1 , wherein the metallic and/or ceramic coating further includes a passivated layer and/or an oxidized layer on the exterior surface of the first metallic layer.

5. The power electronics assembly of claim 1 , wherein the metallic and/or ceramic coating further includes a second metallic layer covering the exterior surface of the first metallic layer, the first metallic layer including a first metallic material, and the second metallic layer including a second metallic material distinct from the first metallic material.

6. The power electronics assembly of claim 1 , wherein the metallic and/or ceramic coating has a thickness of about 1 micrometer (μm) to about 500 μm.

7. The power electronics assembly of claim 1 , wherein the assembly housing includes a first polymeric material and the polymeric encapsulant includes a second polymeric material distinct from the first polymeric material.

8. The power electronics assembly of claim 7 , wherein the first polymeric material includes an epoxy with silica, a polyamide, a polyphthalamide, and/or a polyphenylene sulfide, and the second polymeric material includes an epoxy-based, bismaleimide-based, and/or silicone-based mold compound.

9. The power electronics assembly of claim 1 , wherein the assembly housing includes an elongated housing body with an inlet port, an outlet port, and a coolant fluid channel fluidly connecting the inlet and outlet ports, the coolant fluid channel extending longitudinally through the elongated housing body between an interior surface of the assembly housing and a major surface of the power module.

10. The power electronics assembly of claim 9 , wherein the power module further comprises:
a thermally conductive heat transfer plate attached to the semiconductor device and defining the major surface of the power module; and
an array of heat transfer fins mounted onto the major surface of the power module and disposed within the fluid channel.

11. A power electronics assembly comprising:
an assembly housing; and
a power module packaged in the assembly housing and including a substrate, a semiconductor device mounted on the substrate, a polymeric encapsulant encasing therein the substrate and the semiconductor device, an electrical lead connected to the semiconductor device and projecting from the polymeric encapsulant, and a metallic and/or ceramic coating on an exterior surface of the polymeric encapsulant, the metallic and/or ceramic coating including:
a first metallic layer including a first metallic material and covering substantially all of an exposed surface area of the exterior surface of the polymeric encapsulant; and
a second metallic layer including a second metallic material, distinct from the first metallic material, and covering substantially all of an exposed surface area of an exterior surface of the first metallic layer, wherein the first metallic material includes zinc and the second metallic material includes steel.

12. The power electronics assembly of claim 11 , wherein the metallic and/or ceramic coating further includes intercalated lamellar microstructures on the exterior surface of the first metallic layer.

13. A method of manufacturing a power electronics assembly, the method comprising:
forming an assembly housing;
assembling a power module including a substrate, a semiconductor device mounted on the substrate, and an electrical lead connected to the semiconductor device;
encasing the substrate and the semiconductor device in a polymeric encapsulant;
applying a metallic and/or ceramic coating on an exterior surface of the polymeric encapsulant, the metallic and/or ceramic coating including:
a first metallic layer mounted directly onto and covering substantially all of an
exposed surface area of the exterior surface of the polymeric encapsulant, and intercalated lamellar microstructures on an exterior surface of the first metallic layer; and

locating the power module, with the substrate and the semiconductor device encased in the polymeric encapsulant with the metallic and/or ceramic coating, in the assembly housing.

14. The method of claim 13 , wherein the metallic and/or ceramic coating further includes a hydrophobic polymer layer covering the exterior surface of the first metallic layer opposite an interior surface thereof adjoining the polymeric encapsulant.

15. The method of claim 13 , wherein the metallic and/or ceramic coating further includes a passivated layer and/or an oxidized layer on the exterior surface of the first metallic layer.

16. The method of claim 13 , wherein the metallic and/or ceramic coating further includes a second metallic layer covering the exterior surface of the first metallic layer, the first metallic layer including a first metallic material, and the second metallic layer including a second metallic material distinct from the first metallic material.

17. The method of claim 16 , wherein the first metallic material includes zinc and the second metallic material includes steel.

18. The method of claim 13 , wherein the metallic and/or ceramic coating has a thickness of about 1 micrometer (μm) to about 500 μm.

19. The method of claim 13 , wherein the assembly housing includes a first polymeric material and the polymeric encapsulant includes a second polymeric material distinct from the first polymeric material.

20. The method of claim 13 , wherein the assembly housing includes a housing body with an inlet port, an outlet port, and a coolant fluid channel fluidly connecting the inlet and outlet ports, the coolant fluid channel extending through the housing body between an interior surface of the assembly housing and a major surface of the power module.

Assignees

• Gm Global Tech Operations Llc

Inventors

• Coppola Anthony M
• Pack Seongchan
• Liu Ming

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/347

  Dispositions of multiple die-attach connectors · CPC title