Polishing apparatus

Patent metadata

Field	Value
Publication number	US-12128523-B2
Application number	US-202016890833-A
Country	US
Kind code	B2
Filing date	Jun 2, 2020
Priority date	May 31, 2012
Publication date	Oct 29, 2024
Grant date	Oct 29, 2024

Abstract

A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface for pressing the substrate against the polishing surface and further having a retaining ring arranged so as to surround the substrate and brought into contact with the polishing surface, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface. The at least one local load exerting mechanism is arranged so as not to rotate together with the substrate holder.

First claim

What is claimed is:

1. A polishing apparatus for polishing a substrate by bringing (Previously presented) the substrate into sliding contact with a polishing surface, comprising:
a substrate holder having a substrate holding surface for pressing the substrate against the polishing surface and further having a retaining ring arranged around the substrate holding surface, the retaining ring being configured to be brought into contact with the polishing surface;
a rotating mechanism configured to rotate the substrate holder about its own axis; and
at least one local load exerting mechanism configured to tilt the retaining ring with respect to the substrate holding surface by exerting a local load on a part of the retaining ring in a direction perpendicular to the polishing surface; and
a suction line coupled to the substrate holder,
wherein the substrate holder includes
a pressure ring having a roller disposed therein which is in contact with the retaining ring, the at least one local load being coupled to the pressure ring, the suction line being in communication with a space in which the roller is disposed,
a carrier having the substrate holding surface,
a top ring base coupled to the rotating mechanism, the carrier being separated from the top ring base,
the retaining ring fixed to the top ring base and configured to be tiltable and rotatable together with the top ring base,
a first elastic membrane coupling the carrier to the top ring base, a first pressure chamber being defined by the carrier, the top ring base, and the first elastic membrane, and
a second elastic membrane coupled to the carrier and forming the substrate holding surface, a second pressure chamber being defined by the carrier and the second elastic membrane, and
wherein the at least one local load exerting mechanism is arranged so as not to rotate together with the retaining ring.

2. The polishing apparatus according to claim 1 , further comprising a retaining ring pressing mechanism configured to exert a uniform downward load on an entire upper surface of the retaining ring to press a lower surface of the retaining ring against the polishing surface.

3. The polishing apparatus according to claim 1 , wherein the substrate holding surface and the retaining ring are vertically movable relative to each other.

4. The polishing apparatus according to claim 1 , wherein the substrate holder further includes a supporting mechanism configured to receive a lateral force applied from the substrate to the retaining ring during polishing of the substrate.

5. The polishing apparatus according to claim 1 , wherein the at least one local load exerting mechanism includes an air cylinder configured to generate the local load to be exerted on a part of the retaining ring.

6. The polishing apparatus according to claim 1 , wherein the at least one local load exerting mechanism includes a magnet configured to generate the local load to be exerted on a part of the retaining ring.

7. The polishing apparatus according to claim 6 , wherein the magnet is an electromagnet configured to generate a downward local load and an upward local load to be selectively exerted on a part of the retaining ring.

8. The polishing apparatus according to claim 1 , further comprising structure configured to allow for changing an installation position of the at least one local load exerting mechanism.

9. The polishing apparatus according to claim 1 , further comprising a polishing surface moving mechanism configured to move the polishing surface horizontally relative to the substrate holder, the at least one local load exerting mechanism being located downstream of the substrate holding surface with respect to a moving direction of the polishing surface.

10. The polishing apparatus according to claim 1 , wherein the at least one local load exerting mechanism comprises a plurality of local load exerting mechanisms.

11. The polishing apparatus according to claim 1 , further comprising a retaining ring height sensor arranged to measure a displacement of the retaining ring in a vertical direction.

12. The polishing apparatus according to claim 11 being configured to change either one or both of a magnitude and a position of the local load based on a measurement result of the displacement of the retaining ring.

13. The polishing apparatus according to claim 1 , further comprising a film thickness sensor configured to generate film thickness signals indicating film thicknesses of a plurality of areas of the substrate when the film thickness sensor is moving across a surface of the substrate,
wherein the polishing apparatus is configured to change either one or both of a magnitude and a position of the local load based on the film thickness signals.

14. The polishing apparatus according to claim 1 , wherein the at least one local load exerting mechanism includes a wheel configured to press the top ring base to tilt the retaining ring and the top ring base.

Assignees

• Ebara Corp

Inventors

• Fukushima Makoto
• Yasuda Hozumi
• Namiki Keisuke
• Nabeya Osamu
• Togashi Shingo
• Yamaki Satoru

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B49/16

  taking regard of the load · CPC title

• B24B37/005

  Control means for lapping machines or devices · CPC title

• B24B37/32 Primary

  Retaining rings · CPC title

• H01L21/304

  Electricity · mapped topic