Display apparatus and electronic device

Patent metadata

Field	Value
Publication number	US-12127345-B2
Application number	US-202117779572-A
Country	US
Kind code	B2
Filing date	Jun 11, 2021
Priority date	Jul 22, 2020
Publication date	Oct 22, 2024
Grant date	Oct 22, 2024

Abstract

The present disclosure relates to a display apparatus and an electronic device, relating to the technical field of display. The display apparatus may comprise a display panel, a main circuit board, a bridging circuit board, and a first shielding adhesive tape. The main circuit board may be provided on the back surface of the display panel; the bridging circuit board may be provided at the side of the main circuit board distant from the display panel, and may be connected to the main circuit board in a binding mode; and the first shielding adhesive tape may be provided at the side of the main circuit board distant from the display panel, and expose the bridging circuit board.

First claim

What is claimed is:

1. A display apparatus, comprising:
a display panel;
a main circuit board, disposed on a back surface of the display panel;
a bridging circuit board, disposed on a side of the main circuit board away from the display panel, and coupled to the main circuit board in a binding mode; and
a first shielding adhesive tape, disposed on the side of the main circuit board away from the display panel, wherein the bridging circuit board is exposed by the first shielding adhesive tape;
wherein the bridging circuit board is provided with a plurality of metallized vias; and
the display apparatus further comprises a second shielding adhesive tape, disposed on a side of the bridging circuit board away from the display panel, and an orthographic projection of the second shielding adhesive tape on the bridging circuit board is not overlapped with each metallized via.

2. The display apparatus according to claim 1 , wherein the first shielding adhesive tape is provided with a bridging opening, and the bridging circuit board is within the bridging opening.

3. The display apparatus according to claim 1 , wherein a gap between the bridging circuit board and the first shielding adhesive tape is equal to 0.3-0.8 mm.

4. The display apparatus according to claim 1 , wherein the main circuit board comprises at most two lead layers.

5. The display apparatus according to claim 1 , wherein the bridging circuit board comprises at most two lead layers.

6. The display apparatus according to claim 1 , wherein a thickness of the bridging circuit board is equal to 0.8-1.2 times a thickness of the first shielding adhesive tape.

7. The display apparatus according to claim 1 , wherein a thickness of the bridging circuit board is equal to 0.09-0.14 mm, and a thickness of the first shielding adhesive tape is equal to 0.09-0.14 mm.

8. The display apparatus according to claim 1 , wherein the second shielding adhesive tape is provided with a plurality of avoidance openings disposed in a one-to-one correspondence with the plurality of the metallized vias; and
any one of the metallized vias is located within an orthographic projection of a corresponding avoidance opening on the bridging circuit board.

9. The display apparatus according to claim 8 , wherein a gap between any one of the metallized vias and the orthographic projection of the second shielding adhesive tape on the bridging circuit board is equal to 0.3-0.8 mm.

10. The display apparatus according to claim 1 , wherein the orthographic projection of the second shielding adhesive tape on the bridging circuit board is located within the bridging circuit board, and a gap between an outer edge of the second shielding adhesive tape and an edge of the bridging circuit board is equal to 0-0.5 mm.

11. The display apparatus according to claim 1 , wherein the second shielding adhesive tape is coupled with the first shielding adhesive tape in an integrated structure.

12. An electronic device, comprising a display apparatus, wherein the display apparatus comprises:
a display panel;
a main circuit board, disposed on a back surface of the display panel;
a bridging circuit board, disposed on a side of the main circuit board away from the display panel, and coupled to the main circuit board in a binding mode; and
a first shielding adhesive tape, disposed on the side of the main circuit board away from the display panel, wherein the bridging circuit board is exposed by the first shielding adhesive tape;
wherein the bridging circuit board is provided with a plurality of metallized vias; and
the display apparatus further comprises a second shielding adhesive tape, disposed on a side of the bridging circuit board away from the display panel, and an orthographic projection of the second shielding adhesive tape on the bridging circuit board is not overlapped with each metallized via.

13. The electronic device according to claim 12 , wherein the first shielding adhesive tape is provided with a bridging opening, and the bridging circuit board is within the bridging opening.

14. The electronic device according to claim 12 , wherein a gap between the bridging circuit board and the first shielding adhesive tape is equal to 0.3-0.8 mm.

15. The electronic device according to claim 12 , wherein the main circuit board comprises at most two lead layers.

16. The electronic device according to claim 12 , wherein the bridging circuit board comprises at most two lead layers.

17. The electronic device according to claim 12 , wherein a thickness of the bridging circuit board is equal to 0.8-1.2 times a thickness of the first shielding adhesive tape.

18. The electronic device according to claim 12 , wherein a thickness of the bridging circuit board is equal to 0.09-0.14 mm, and a thickness of the first shielding adhesive tape is equal to 0.09-0.14 mm.

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd

Inventors

• Huang Xiaoxia
• Li Fan

Classifications

• H05K2201/10128

  Display · CPC title

• H05K2201/09545

  Plated through-holes or blind vias without lands · CPC title

• H05K9/0073

  Shielding materials (H05K9/0003 takes precedence) · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K2201/0715

  provided by an outer layer of PCB · CPC title