Descending etching resistance in advanced substrate patterning

Patent metadata

Field	Value
Publication number	US-12120925-B2
Application number	US-202318301805-A
Country	US
Kind code	B2
Filing date	Apr 17, 2023
Priority date	Aug 4, 2021
Publication date	Oct 15, 2024
Grant date	Oct 15, 2024

Abstract

Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

First claim

What is claimed is:

1. A device, comprising:
a substrate;
pixel-defining layer (PDL) structures disposed over the substrate; and
a plurality of overhang structures, each overhang structure defined by an extension of a second structure extending laterally past a first structure, each first structure disposed over an upper surface of each PDL structure, adjacent overhang structures of the plurality overhang structures defining a plurality of sub-pixels including a first sub-pixel and a second sub-pixel;
the first sub-pixel comprising:
a first anode;
a first organic light-emitting diode (OLED) material disposed over the first anode;
a first cathode disposed over the first OLED material; and
a first encapsulation layer disposed over the first cathode, extending under the adjacent overhang structures, and disposed over a topmost surface of the extension of the second structure, the first encapsulation layer having a first thickness; and

the second sub-pixel comprising:
a second anode;
a second organic light-emitting diode (OLED) material disposed over the second anode;
a second cathode disposed over the second OLED material; and
a second encapsulation layer disposed over the second cathode, extending under the adjacent overhang structures, the second encapsulation layer having a second thickness different than the first thickness and is separated from the first encapsulation layer over the topmost surface by a passivation layer disposed on the topmost surface and disposed in a well of the second sub-pixel.

2. The device of claim 1 , wherein the second encapsulation layer of the second sub-pixel extends under the adjacent overhang structures and contacts a portion of a sidewall of the first structure and a bottom surface of the second structure.

3. The device of claim 1 , further comprising a third sub-pixel comprising:
a third anode;
a third organic light-emitting diode (OLED) material disposed over the third anode;
a third cathode disposed over the third OLED material; and
a third encapsulation layer disposed over the third cathode, extending under the adjacent overhang structures, the third encapsulation layer having a third thickness different than the first thickness and the second thickness.

4. The device of claim 3 , wherein the third encapsulation layer of the third sub-pixel extends under the adjacent overhang structures and contacts a portion of a sidewall of the first structure, and a bottom surface of the second structure, a sidewall of the second structure.

5. The device of claim 3 , wherein the first encapsulation layer, the second encapsulation layer, and the third encapsulation layer comprise a silicon nitride material, silicon oxynitride material, silicon oxide material, or a combination thereof.

6. The device of claim 3 , wherein the first encapsulation layer comprises a material different than at least one of the second encapsulation layer or the third encapsulation layer.

7. The device of claim 1 , wherein the first structure comprises an inorganic material or a metal-containing material.

8. The device of claim 3 , wherein the first encapsulation layer, the second encapsulation layer, and the third encapsulation layer include at least two layers of a silicon-containing material, the at least two layers of the silicon-containing material of at least one the first encapsulation layer, the second encapsulation layer, and the third encapsulation layer is different than each other.

9. The device of claim 1 , wherein the first OLED material is disposed over and in contact with the first anode and is disposed under the overhang structures such that the first OLED material contacts the PDL structure and second OLED material is disposed over and in contact with the second anode and is disposed under the overhang structures such that the second OLED material contacts the PDL structure.

10. A device, comprising:
a substrate;
pixel-defining layer (PDL) structures disposed over the substrate; and
a plurality of overhang structures, each overhang structure defined by an extension of a second structure extending laterally past a first structure to form an overhang, each first structure disposed over an upper surface of each PDL structure, adjacent overhang structures of the plurality overhang structures defining a plurality of sub-pixels including a first sub-pixel and a second sub-pixel;
the first sub-pixel comprising:
a first anode;
a first organic light-emitting diode (OLED) material disposed over the first anode;
a first cathode disposed over the first OLED material; and
a first encapsulation layer disposed over the first cathode, extending under the adjacent overhang structures, contacting a portion of a sidewall of the overhang structures, and disposed over a topmost surface of the extension of the second structure, the first encapsulation layer having a first thickness; and

the second sub-pixel comprising:
a second anode;
a second organic light-emitting diode (OLED) material disposed over the second sub-pixel;
a second cathode disposed over the second OLED material; and
a second encapsulation layer disposed over the second cathode, extending under the adjacent overhang structures and contacting a portion of a sidewall of the adjacent overhang structures, the second encapsulation layer having a second thickness that is different than the first thickness and is separated from the first encapsulation layer over the topmost surface by a passivation layer disposed on the topmost surface and disposed in a well of the second sub-pixel.

11. The device of claim 10 , wherein in the overhang:
a gap is between a second encapsulation layer on a bottom surface of the second structure and the second encapsulation layer over the second cathode in the overhang; or
the gap is between an underside edge of the second structure and the second encapsulation layer over the second cathode in the overhang.

12. The device of claim 11 , further comprising a third sub-pixel comprising:
a third anode;
a third organic light-emitting diode (OLED) material disposed over the third anode;
a third cathode disposed over the third OLED material; and
a third encapsulation layer disposed over the third cathode, extending under the adjacent overhang structures and contacting a portion of a sidewall of the overhang structures, the third encapsulation layer having a third thickness that is different than the first thickness and the second thickness.

13. The device of claim 12 , wherein the first encapsulation layer, the second encapsulation layer, and the third encapsulation layer comprise a silicon nitride material, silicon oxynitride material, silicon oxide material, or a combination thereof.

14. The device of claim 10 , wherein the first structure comprises an inorganic material or a metal-containing material.

15. The device of claim 10 , wherein the second structure comprises a non-conductive material, an inorganic material, or a metal-containing material.

16. The device of claim 10 , wherein the first cathode extends to contact the PDL structure past an endpoint of the first OLED material and the second cathode extends to contact the PDL structure past an endpoint of the second OLED material.

17. The device of claim 10 , wherein the first OLED material is disposed over and in contact with the first anode and is disposed under the overhang structures such that the first OLED material contacts the PDL structure and the second OLED material is disposed over and in contact with the second anode and is disposed under the overhang structures such that the second

Assignees

• Applied Materials Inc

Inventors

• Chen Chung-Chia
• Choung Ji Young
• Haas Dieter
• Lin Yu-Hsin
• Lee Jungmin
• Wu Wen-Hao
• Kim Si Kyoung

Classifications

• H10K59/873

  Encapsulations · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K2102/00

  Constructional details relating to the organic devices covered by this subclass · CPC title

• H10K2102/351

  Thickness · CPC title

• H10K59/8052

  Cathodes · CPC title