Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part

Patent metadata

Field	Value
Publication number	US-12119131-B2
Application number	US-202117397500-A
Country	US
Kind code	B2
Filing date	Aug 9, 2021
Priority date	Jul 25, 2017
Publication date	Oct 15, 2024
Grant date	Oct 15, 2024

Abstract

A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

First claim

The invention claimed is:

1. A method for synthesizing a copper-silver alloy, comprising:
an ink preparation step of mixing a copper salt particle, an amine-based solvent, and a silver salt particle, thereby preparing a copper-silver ink;
a coating step of coating a member to be coated with the copper-silver ink to form a coated member;
a crystal nucleus formation step of forming at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less from the copper-silver ink; and
a crystal nucleus synthesis step of synthesizing the crystal nucleus of copper and the crystal nucleus of silver, wherein
the crystal nucleus formation step contains a first-heating step where the coated member is heated at 70° ° C. to 300° C. for 1 minute to 300 minutes, and
the crystal nucleus synthesis step contains a second-heating step where the crystal nucleus of copper and the crystal nucleus of silver are irradiated with pulsed light having an energy density of 0.5 J/cm 2 to 5.0 J/cm 2 for an irradiation time of 1 s or less so that the copper-silver alloy is synthesized.

2. The method for synthesizing a copper-silver alloy according to claim 1 , wherein after the crystal nucleus formation step and before the crystal nucleus synthesis step, the coated member is cooled to a temperature region of lower than 60° C.

3. The method for synthesizing a copper-silver alloy according to claim 1 , wherein the copper-silver ink further contains a dispersion medium.

4. The method for synthesizing a copper-silver alloy according to claim 1 , comprising a preheating step of performing preheating at 25° C. or higher and lower than 70° ° C. for 0 minute to 10 minutes, after the coating step and before the crystal nucleus formation step.

5. The method for synthesizing a copper-silver alloy according to claim 1 , wherein the ink preparation step comprises the steps of:
mixing the amine-based solvent and the copper salt particle to prepare a solution, and
mixing the solution and the silver salt particle to prepare the copper-silver ink.

6. The method for synthesizing a copper-silver alloy according to claim 1 , wherein the energy density of the pulsed light is 0.5 J/cm 2 to 4.0 J/cm 2 .

7. The method for synthesizing a copper-silver alloy according to claim 1 , wherein the crystal nucleus of copper and the crystal nucleus of silver diffuse and grow to synthesize the copper-silver alloy in the crystal nucleus synthesis step.

8. The method for synthesizing a copper-silver alloy according to claim 1 , wherein the irradiation time is from 1 μs to 1 s.

9. A method for forming a conduction part, comprising the method for synthesizing a copper-silver alloy according to claim 1 .

Assignees

• Senju Metal Industry Co
• Univ Osaka

Inventors

• Jiu Jinting
• Ueshima Minoru
• Suganuma Katsuaki
• Li Wanli

Classifications

• C23C18/08 Primary

  characterised by the deposition of metallic material · CPC title

• C22C9/00

  Alloys based on copper · CPC title

• C22C5/08

  with copper as the next major constituent · CPC title

• C22C1/00

  Making non-ferrous alloys (by electrothermic methods C22B4/00; by electrolysis C25C1/24, C25C3/36) · CPC title

• C09D11/52

  Electrically conductive inks · CPC title