Molded article, electrical product and method for producing molded article

US12115706B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12115706-B2
Application numberUS-202117796739-A
CountryUS
Kind codeB2
Filing dateJan 22, 2021
Priority dateFeb 6, 2020
Publication dateOct 15, 2024
Grant dateOct 15, 2024

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A molded article or an electrical product facilitates layout of a wiring line from an electrical circuit of a circuit film integrally molded with a molded body to a connection terminal. The molded article includes a circuit film and a molded body. The circuit film includes an insulating film and an electrical circuit. The molded body is integrally molded with the circuit film. The circuit film includes a flexible wiring portion. The molded body has a through-hole that penetrates from a first main surface to a second main surface. In the flexible wiring portion, a connection terminal is arranged at a position of passing through the through-hole and beyond the second main surface.

First claim

Opening claim text (preview).

The invention claimed is: 1. A molded article, comprising: a circuit film that includes a thermoplastic insulating film and an electrical circuit formed on the insulating film; and a molded body having a first main surface and a second main surface opposed to the first main surface, the molded body being integrally molded with the circuit film located on the first main surface, wherein the circuit film includes a flexible wiring portion in which a wiring line connected to the electrical circuit is formed, the molded body has a through-hole that penetrates from the first main surface to the second main surface, and in the flexible wiring portion, a first flexible wiring portion surface is arranged so as to run along a wall surface of the through-hole and a second flexible wiring portion surface is arranged such that a clearance is formed between the second flexible wiring portion surface and the wall surface of the through-hole, and a connection terminal is arranged in the through-hole or at a position of passing through the through-hole and beyond the second main surface. 2. A molded article, comprising: a circuit film that includes a thermoplastic insulating film and an electrical circuit formed on the insulating film; and a thermoplastic flexible wiring portion formed of a flexible printed board, separated from the circuit film, and connected to the electrical circuit; and a molded body having a first main surface and a second main surface opposed to the first main surface, the molded body being integrally molded with both of the circuit film located on the first main surface and the flexible wiring portion, wherein the molded body has a through-hole that penetrates from the first main surface to the second main surface, and in the flexible wiring portion, a first flexible wiring portion surface is arranged so as to run along a wall surface of the through-hole and a second flexible wiring portion surface is arranged such that a clearance is formed between the second flexible wiring portion surface and the wall surface of the through-hole, and a connection terminal is arranged in the through-hole or at a position of passing through the through-hole and beyond the second main surface. 3. The molded article according to claim 1 , further comprising a three-dimensional component arranged in the through-hole and separated from the molded body. 4. The molded article according to claim 1 , further comprising a three-dimensional component that covers the through-hole and is separated from the molded body. 5. The molded article according to claim 1 , further comprising a design film that covers the through-hole and covers at least a portion of the circuit film, the design film being integrally molded with the molded body. 6. The molded article according to claim 1 , wherein the flexible wiring portion is fixedly secured to a wall surface of the through-hole. 7. An electrical product, comprising: a chassis including the molded article according to claim 1 ; and an electrical device arranged in the chassis and connected to the connection terminal of the flexible wiring portion, wherein the molded article is mounted with the first main surface facing an outside of the chassis and the second main surface facing an inside of the chassis. 8. A method for manufacturing a molded article, the method comprising: (a) pre-forming a circuit film that includes a thermoplastic insulating film and an electrical circuit formed on the insulating film; (b) setting the circuit film in a first mold; (c) clamping the first mold and a second mold; and (d) injecting a molten material into a cavity of the first mold and the second mold to form a molded body integrally molded with the circuit film, wherein in (a), a thermoplastic flexible wiring portion or the thermoplastic flexible wiring portion separate from the circuit film in which a wiring line connected to the electrical circuit is formed is stood in a direction intersecting with an in-plane direction of the circuit film; in (b), at least a portion of the flexible wiring portion is arranged on a side surface of a projection of the first mold; in (c), the projection of the first mold is fitted to a recessed portion of the second mold, and a connection terminal of the flexible wiring portion is sandwiched between the first mold and the second mold in the recessed portion; and in (d), a through-hole is provided in the molded body with the projection and the circuit film and the molded body are integrally molded such that the flexible wiring portion is arranged in the through-hole without the connection terminal in contact with the molten material. 9. The molded article according to claim 1 , wherein the connection terminal is arranged on the first flexible wiring portion surface at the position of the flexible wiring portion passing through the through-hole. 10. The molded article according to claim 9 , further comprising a reinforcing film provided on the second flexible wiring portion surface opposite the connection terminal. 11. The molded article according to claim 1 , wherein the connection terminal is arranged on the second flexible wiring portion surface at the position of the flexible wiring portion passing through the through-hole. 12. The molded article according to claim 11 , further comprising a reinforcing film provided on the first flexible wiring portion surface opposite the connection terminal. 13. The molded article according to claim 2 , wherein the connection terminal is arranged on the first flexible wiring portion surface at the position of the flexible wiring portion passing through the through-hole. 14. The molded article according to claim 2 , wherein the connection terminal is arranged on the second flexible wiring portion surface at the position of the flexible wiring portion passing through the through-hole. 15. The molded article of claim 1 , further comprising a fitted portion formed on the first main surface of the molded body, wherein the through-hole is arranged within an inside surface of the fitted portion. 16. The molded article of claim 2 , further comprising a fitted portion formed on the first main surface of the molded body, wherein the through-hole is arranged within an inside surface of the fitted portion. 17. The method of claim 8 , wherein the flexible wiring portion includes a reinforcing film opposite the connection terminal within the recessed portion. 18. The method of claim 17 , further comprising arranging the reinforcing film to be a distance within the recessed portion from an inner surface of the second mold.

Assignees

Inventors

Classifications

  • Casings, cabinets or drawers for electric apparatus · CPC title

  • positioning inserts having a part extending into a positioning cavity outside the mould cavity · CPC title

  • using fixed mould wall projections for centering the insert · CPC title

  • Moulds · CPC title

  • against the mould wall · CPC title

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Frequently asked questions

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What does patent US12115706B2 cover?
A molded article or an electrical product facilitates layout of a wiring line from an electrical circuit of a circuit film integrally molded with a molded body to a connection terminal. The molded article includes a circuit film and a molded body. The circuit film includes an insulating film and an electrical circuit. The molded body is integrally molded with the circuit film. The circuit film …
Who is the assignee on this patent?
Nissha Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C45/14467. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 15 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).