Molded product, electrical product, and method for manufacturing molded product

Patent metadata

Field	Value
Publication number	US-10710288-B2
Application number	US-201816620286-A
Country	US
Kind code	B2
Filing date	Jul 19, 2018
Priority date	Aug 3, 2017
Publication date	Jul 14, 2020
Grant date	Jul 14, 2020

Abstract

A molded product and an electrical product comprising a molded article that includes a main body made of resin and a standing wall made of resin. The standing wall integrally stands up from the end portion of the main body. A decorative sheet includes a base film and a conductive circuit layer. The base film continuously covers from the main body front surface to a wall front surface. The conductive circuit layer is disposed between the base film and the main body front surface. The decorative sheet is integrated with the molded article to implement a decoration with the base film. A flexible printed circuit board is disposed between the molded article and the conductive circuit layer. The flexible printed circuit board is partially embedded into and integrated with the standing wall. The flexible printed circuit board is electrically connected to the conductive circuit layer.

First claim

The invention claimed is:

1. A molded product comprising:
a molded article that includes a main body made of resin and a standing wall made of resin, the standing wall integrally standing up from an end portion of the main body;
a decorative sheet that includes a base film and a conductive circuit layer, the base film continuously covering from a main body front surface of the main body to a wall front surface of the standing wall, the conductive circuit layer being disposed between the base film and a molded article front surface of the molded article, the decorative sheet being integrated with the molded article to implement a decoration; and
a flexible printed circuit board disposed between the molded article and the conductive circuit layer, the flexible printed circuit board being partially embedded into and integrated with the standing wall, the flexible printed circuit board being electrically connected to the conductive circuit layer.

2. The molded product according to claim 1 , wherein
an electrical connecting part for the flexible printed circuit board and the conductive circuit layer are laminated on the wall front surface.

3. The molded product according to claim 1 , wherein
the conductive circuit layer includes an electrode of a sensor.

4. The molded product according to claim 1 , wherein
the decorative sheet and the flexible printed circuit board are wrapped around and fixed so as to be inclined inward with respect to an inclined direction of the wall front surface.

5. The molded product according to claim 1 , further comprising:
a fixing portion made of resin that annularly covers the flexible printed circuit board together with the molded article in at least a part of the flexible printed circuit board.

6. An electrical product comprising:
the molded product according to claim 1 ; and
an electrical device electrically connected to the flexible printed circuit board of the molded product.

7. A method for manufacturing the molded product of claim 1 , the method comprising:
preforming the decorative sheet in a shape close to a shape of the molded article;
setting the decorative sheet in a recess portion of a first mold such that the base film faces the first mold and disposing an external connecting portion for connecting the conductive circuit layer to an external electrical circuit on an extension of a peripheral wall of the recess portion;
clamping the first mold, a second mold, and a third mold, protruding the external connecting portion from a first cavity formed with the recess portion to an external space outside the first cavity, and sandwiching the external connecting portion between the second mold and the third mold; and
injecting molten resin into the first cavity to form the molded article integrated with the decorative sheet.

8. The method for manufacturing the molded product according to claim 7 , comprising:
forming the external connecting portion by electrically connecting the flexible printed circuit board to the conductive circuit layer with an anisotropic conductive film with a temperature and a pressure at which a shape of the preformed decorative sheet is kept, and fixing the flexible printed circuit board to the decorative sheet.

9. The method for manufacturing the molded product according to claim 7 , comprising:
forming a second cavity on a front surface of the external connecting portion and the wall front surface with a fourth mold to inject molten resin into the second cavity so as to form a fixing portion made of resin, the fixing portion annually covering at least a part of the external connecting portion together with the molded article.

10. A method for manufacturing the molded product of claim 1 , the method comprising:
preforming the decorative sheet in a shape close to a shape of the molded article;
setting the decorative sheet in a recess portion of a first mold such that the decorative sheet faces the first mold and disposing an extension portion of the decorative sheet extending from a peripheral edge portion of the decorative sheet on the wall front surface;
clamping the first mold, a second mold, and a third mold to form a first cavity with the recess portion, and sandwiching a vicinity of a boundary between the peripheral edge portion and the extension portion between the second mold and the third mold; and
injecting molten resin into the first cavity to form the molded article integrated with the decorative sheet.

11. The method for manufacturing the molded product according to claim 10 , further comprising:
forming a second cavity on a surface of the extension portion and the wall front surface with a fourth mold to inject molten resin into the second cavity so as to form a fixing portion made of resin, the fixing portion annularly covering at least a part of the extension portion together with the molded article.

Assignees

• Nissha Co Ltd

Inventors

• Yamazaki Seiichi
• Higashikawa Toshihiro
• Hirai Hitoshi

Classifications

• H04N23/50

  Constructional details · CPC title

• H05K2203/1327

  Moulding over PCB locally or completely · CPC title

• H05K2201/0999

  Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing · CPC title

• H05K3/361

  Assembling flexible printed circuits with other printed circuits · CPC title

• H05K3/323

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title