Chip resistor

Patent metadata

Field	Value
Publication number	US-12112869-B2
Application number	US-202017773720-A
Country	US
Kind code	B2
Filing date	Oct 29, 2020
Priority date	Nov 12, 2019
Publication date	Oct 8, 2024
Grant date	Oct 8, 2024

Abstract

A chip resistor includes a substrate, an upper electrode and a resistor body, a back electrode, a side electrode, and a metal plating layer. The substrate includes an upper surface, a back surface that intersect a thickness-wise direction and a side surface that joins the upper surface and the back surface. The upper electrode and the resistor body are formed on the upper surface. The back electrode is formed on the back surface. The side electrode is formed on the side surface. The metal plating layer includes a back plating layer and a side plating layer. The back plating layer covers at least a portion of the back electrode. The side plating layer covers at least a portion of the side electrode. The metal plating layer has a thickness that is greater than or equal to 10 μm and less than or equal to 60 μm.

First claim

The invention claimed is:

1. A chip resistor, comprising:
a substrate including an upper surface, a back surface, and a side surface, the upper surface and the back surface intersecting a thickness-wise direction, and the side surface joining the upper surface and the back surface;
an upper electrode and a resistor body formed on the upper surface;
a back electrode formed on the back surface;
a side electrode formed on the side surface; and
a metal plating layer including a back plating layer covering at least a portion of the back electrode and a side plating layer covering at least a portion of the side electrode, wherein the metal plating layer has a thickness that is greater than or equal to 10 μm and less than or equal to 60 μm, wherein
the substrate includes a corner joining the back surface and the side surface,
the corner includes an inclined surface intersecting the back surface and the side surface, and
the metal plating layer includes a portion that covers the corner and is roundly curved.

2. The chip resistor according to claim 1 , wherein the thickness of the metal plating layer is greater than or equal to 20 μm and less than or equal to 40 μm.

3. The chip resistor according to claim 1 , wherein the metal plating layer is greater in thickness than the back electrode.

4. The chip resistor according to claim 1 , wherein the metal plating layer is greater in thickness than the side electrode.

5. The chip resistor according to claim 1 , wherein the metal plating layer is greater in thickness than the upper electrode.

6. The chip resistor according to claim 1 , wherein the upper electrode is greater in thickness than the back electrode.

7. The chip resistor according to claim 1 , wherein the substrate has a thickness that is greater than or equal to 0.28 mm and less than or equal to 0.47 mm.

8. The chip resistor according to claim 1 , wherein the metal plating layer includes copper.

9. The chip resistor according to claim 1 , further comprising a second plating layer wherein the metal plating layer includes a first plating layer, wherein
the second plating layer covers the first plating layer, and
the second plating layer includes nickel.

10. The chip resistor according to claim 1 , further comprising a first plating layer covering at least a portion of the side electrode and at least a portion of the back electrode, wherein
the metal plating layer includes a second plating layer covering the first plating layer, and
the second plating layer includes nickel.

11. The chip resistor according to claim 9 , further comprising a third plating layer covering the second plating layer, wherein the third plating layer includes tin.

12. The chip resistor according to claim 1 , wherein the side electrode is formed from an alloy including nickel and chromium.

13. The chip resistor according to claim 1 , wherein the back electrode is formed from a synthetic resin including a metal particle.

14. The chip resistor according to claim 1 , wherein the substrate is formed from a ceramic including alumina.

15. The chip resistor according to claim 1 , further comprising a relief layer formed between the back surface of the substrate and the back electrode and formed from an insulative resin.

16. The chip resistor according to claim 1 , wherein the metal plating layer includes an upper plating layer covering at least a portion of a surface of the upper electrode.

17. The chip resistor according to claim 16 , further comprising a protective layer covering the resistor body and a portion of the upper electrode, wherein
the upper plating layer includes an overlapping portion, and
the overlapping portion covers at least partially a portion of the protective layer that covers the upper electrode.

Assignees

• Rohm Co Ltd

Inventors

• Sakakibara Soichi
• Shinoura Takanori
• Imahashi Wataru

Classifications

• H05K2201/10022

  Non-printed resistor · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H01C3/08

  Dimension or characteristic of resistive element changing gradually or in discrete steps from one terminal to another · CPC title

• H01C17/24

  by removing or adding resistive material (H01C17/23, H01C17/232, H01C17/235 take precedence) · CPC title

• H01C7/003

  Thick film resistors · CPC title