Methods for memory power management and memory devices and systems employing the same
US-2021035617-A1 · Feb 4, 2021 · US
US12112830B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12112830-B2 |
| Application number | US-202217991489-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 21, 2022 |
| Priority date | Aug 2, 2019 |
| Publication date | Oct 8, 2024 |
| Grant date | Oct 8, 2024 |
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Systems, apparatuses, and methods for operating a memory device or devices are described. A memory device or module may introduce latency in commands to coordinate operations at the device or to improve timing or power consumption at the device. For example, a host may issue a command to a memory module, and a component or feature of the memory module may receive the command and modify the command or the timing of its execution in manner that is invisible or non-disruptive to the host while facilitating operations at the memory module. In some examples, components or features of a memory module may be disabled to effect or introduce latency in operation without affecting timing or operation of a host device. A memory module may operate in different modes that allow for different latencies; the use or introduction of latencies may not affect other features or operability of the memory module.
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What is claimed is: 1. A method comprising: receiving, from a host at a component of a memory module, an indication of a duration corresponding to enabling an input buffer of a memory device of the memory module; reducing, in response to receiving the indication of the duration, a programmable latency of the memory device by an amount corresponding to the duration; receiving, from the host at the component of the memory module at a first time, an enable signal for the memory device; receiving, from the host at the component at the first time, a command/address signal for the memory device; sending the enable signal from the component to the memory device at a second time subsequent to the first time; enabling a disabled input buffer of the memory device in response to detecting the enable signal; and sending the command/address signal from the component to the memory device at a third time subsequent to the second time by a delay corresponding to the duration. 2. The method of claim 1 , wherein the delay corresponds to a number of clock cycles of the memory device. 3. The method of claim 1 , wherein receiving the enable signal for the memory device at the component of the memory module comprises receiving the enable signal at a registering clock driver (RCD) of the memory module. 4. The method of claim 1 , wherein receiving the command/address signal for the memory device at the component of the memory module comprises receiving the command/address signal at a registering clock driver (RCD) of the memory module. 5. The method of claim 1 , wherein sending the enable signal from the component at the second time comprises sending the enable signal from a registering clock driver (RCD) of the memory module to the memory device. 6. The method of claim 1 , wherein sending the command/address signal from the component at the third time comprises: delaying the command/address signal for a number of clock cycles of the memory device; and sending the command/address signal from a registering clock driver (RCD) of the memory module to the memory device. 7. The method of claim 1 , further comprising: disabling the input buffer of the memory device prior to sending the enable signal at the second time. 8. The method of claim 1 , wherein enabling the disabled input buffer is complete before the third time. 9. The method of claim 1 , wherein the enable signal is a chip select (CS) signal. 10. A memory module, comprising: a memory device; and a registering clock driver (RCD) coupled to the memory device and configured to: receive an indication of a duration corresponding to enabling an input buffer of the memory device; receive an enable signal and a command/address signal at a first time, send the enable signal to the memory device at a second time subsequent to the first time, and send the command/address signal to the memory device at a third time subsequent to the second time by a delay corresponding to the duration, wherein the memory device is configured to: reduce, in response to the RCD receiving the indication of the duration, a programmable latency of the memory device by an amount corresponding to the duration; and enable a disabled input buffer in response to detecting the enable signal. 11. The memory module of claim 10 , wherein the delay corresponds to a number of clock cycles of the memory device. 12. The memory module of claim 10 , wherein the memory device is further configured to: disable the input buffer in response to a determination that the memory device is idle. 13. The memory module of claim 10 , wherein the memory device is configured to complete enabling the disabled input buffer before the third time. 14. The memory module of claim 10 , wherein the memory device comprises a dynamic random access memory (DRAM) device. 15. The memory module of claim 10 , wherein the memory module comprises a dual in-line memory module (DIMM). 16. A memory device, comprising: an input buffer; and circuitry coupled to the input buffer and configured to: reduce a programmable latency of the memory device by an amount corresponding to a duration that corresponds to enabling the input buffer; disable the input buffer in response to a determination that the memory device is idle; re-enable the input buffer in response to detecting an enable signal received at the memory device at a first time; and receive a command/address signal at a second time subsequent to the first time by a delay corresponding to the duration. 17. The memory device of claim 16 , wherein the memory device comprises a dynamic random access memory (DRAM) device. 18. The memory device of claim 16 , wherein the memory device comprises a dual in-line memory module (DIMM).
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