Thermoelectric module

Patent metadata

Field	Value
Publication number	US-12108673-B2
Application number	US-202017791150-A
Country	US
Kind code	B2
Filing date	Dec 21, 2020
Priority date	Jan 7, 2020
Publication date	Oct 1, 2024
Grant date	Oct 1, 2024

Abstract

A thermoelectric module according to one embodiment of the present invention comprises: a heat exchange unit; and a thermoelectric element disposed on the heat exchange unit, wherein the heat exchange unit includes a case for accommodating a material for heat exchange and a cover covering the case, the thermoelectric element is disposed on the cover, and the thermal conductivity of the cover is higher than the thermal conductivity of the case.

First claim

The invention claimed is:

1. A thermoelectric module comprising:
a heat exchange unit; and
a thermoelectric device disposed on the heat exchange unit,
wherein the heat exchange unit includes a case for accommodating a heat exchange material and a cover for covering the case,
wherein the thermoelectric device includes a lower substrate, lower electrodes, P-type thermoelectric legs, N-type thermoelectric legs, upper electrodes, an upper substrate and a sealing member,
wherein the sealing member is disposed on side surfaces of the lower electrodes, the P-type thermoelectric legs, the N-type thermoelectric legs, and the upper electrodes between the lower substrate and the upper substrate,
wherein an area of the lower substrate is 1.2 to 5 times an area of the upper substrate,
wherein the thermoelectric device is disposed on the cover, and
wherein a thermal conductivity of the cover is higher than a thermal conductivity of the case.

2. The thermoelectric module of claim 1 , wherein the cover includes:
a first surface which is disposed toward an outside of the case and on which the thermoelectric device is disposed; and
a second surface disposed toward an inside of the case, and
wherein a plurality of heat radiation fins are formed on the second surface.

3. The thermoelectric module of claim 2 , wherein the case includes:
a first region in which the plurality of heat radiation fins are accommodated; and
a second region which surrounds the first region and includes a coupling part for coupling the case to the cover.

4. The thermoelectric module of claim 3 , wherein the coupling part includes a plurality of holes, and
wherein the case and the cover are coupled by a plurality of coupling members disposed in the plurality of holes in the second region.

5. The thermoelectric module of claim 3 , wherein the coupling part includes a groove having a ring shape, and
wherein an O-ring is disposed in the groove.

6. The thermoelectric module of claim 3 , wherein the case further includes a third region which surrounds the second region and of which a height is greater than a height of the second region.

7. The thermoelectric module of claim 3 , wherein a bottom surface of the first region and the plurality of heat radiation fins are spaced a predetermined distance from each other.

8. The thermoelectric module of claim 3 , wherein at least one guide protruding from a bottom surface is disposed in the first region, and
wherein one end of the guide is spaced apart from a wall surface of the case.

9. The thermoelectric module of claim 3 , wherein a fluid inlet and a fluid outlet are formed in the case.

10. The thermoelectric module of claim 1 , wherein the cover includes a metal, and
wherein the case includes an insulation material.

11. The thermoelectric module of claim 7 , wherein a height of the second region is higher than a height of the bottom surface of the first region, and
wherein the predetermined distance between the bottom surface of the first region and the plurality of heat radiation fins is 0.1 to 0.7 times a difference between the height of the second region and the height of the bottom surface of the first region.

12. The thermoelectric module of claim 8 , wherein an extension direction of the plurality of heat radiation fins is parallel to an extension direction of the at least one guide.

13. The thermoelectric module of claim 1 , wherein a width of the thermoelectric device is less than a width of the cover.

14. The thermoelectric module of claim 1 , wherein the cover includes a first surface which is disposed toward an outside of the case and on which the thermoelectric device is disposed; and a second surface disposed toward an inside of the case,
wherein the case includes a first region accommodating the heat exchange material, and
wherein a second region which surrounds the first region and includes a coupling part for coupling the case to the cover.

15. The thermoelectric module of claim 14 , wherein a height of the second region is higher than a height of the bottom surface of the first region, and the second surface of the cover is in contact with the second region.

16. The thermoelectric module of claim 15 , wherein the case further includes a third region which surrounds the second region and of which a height is greater than a height of the second region, and the third region is disposed on a side surface of the cover.

17. The thermoelectric module of claim 16 , wherein a width of the third region is 0.5 to 2 times a width of the second region.

18. The thermoelectric module of claim 14 , wherein a fluid inlet and a fluid outlet are formed on a first surface of the case,
wherein a guide protruding from a bottom surface is disposed in the first region,
wherein the guide extends from the first surface of the case toward a second surface of the case opposite to the first surface of the case, and
wherein the guide is spaced apart from the second surface of the case.

19. The thermoelectric module of claim 14 , wherein a fluid inlet and a fluid outlet are formed on a first surface of the case,
wherein a plurality of guides protruding from a bottom surface are disposed in the first region,
wherein a portion of the plurality of guides extends from the first surface of the case toward a second surface of the case opposite to the first surface of the case, and is spaced apart from the second surface of the case, and
wherein another portion of the plurality of guides extends from the second surface of the case toward the first surface of the case, and is spaced apart from the first surface of the case.

20. The thermoelectric module of claim 14 , wherein the case and the cover are water-tightly coupled in the second region.

Assignees

• Lg Innotek Co Ltd

Inventors

• Won Boone

Classifications

• H10N30/02

  Forming enclosures or casings · CPC title

• H10N10/81

  Structural details of the junction · CPC title

• H10N30/88

  Mounts; Supports; Enclosures; Casings · CPC title

• H10N10/17

  characterised by the structure or configuration of the cell or thermocouple forming the device · CPC title

• H10N10/80

  Constructional details · CPC title