Circuit board and method for manufacturing thereof

Patent metadata

Field	Value
Publication number	US-12108533-B2
Application number	US-202217855032-A
Country	US
Kind code	B2
Filing date	Jun 30, 2022
Priority date	May 31, 2022
Publication date	Oct 1, 2024
Grant date	Oct 1, 2024

Abstract

A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.

First claim

What is claimed is:

1. A method for manufacturing a circuit board, comprising:
forming a recess in a first circuit substrate;
disposing an electronic component in the recess;
bonding a second circuit substrate to the first circuit substrate such that the second circuit substrate and the first circuit substrate collectively form a third circuit substrate, wherein the electronic component is embedded in the third circuit substrate;
forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate in the opening;
disposing an insulation case in the opening, wherein the insulation case comprises:
a first segment surrounding and directly contacting the electronic component;
a second segment positioned by the first segment and facing the inner surface;
an inner wall between the first segment and second segment;
a first chamber surrounded by the first segment and the inner wall; and
a second chamber surrounded by the second segment and the inner wall; and

adding a heat-exchanging fluid into the first chamber.

2. The method for manufacturing the circuit board of claim 1 , wherein forming the opening in the third circuit substrate comprises making the opening extend from a top surface of the third circuit substrate to an inside of the third circuit substrate, and making a bottom of the opening is below a bottom of the electronic component.

3. The method for manufacturing the circuit board of claim 2 , wherein a distance between the bottom of the opening and the bottom of the electronic component is larger than 10 μm.

4. The method for manufacturing the circuit board of claim 1 , wherein
forming the opening in the third circuit substrate comprises exposing a top surface and a side surface of the electronic component in the opening; and
disposing the insulation case in the opening comprises making the first segment directly contact the top surface and the side surface of the electronic component.

5. The method for manufacturing the circuit board of claim 1 , wherein disposing the insulation case in the opening comprises making the second segment directly contact the inner surface of the third circuit substrate.

6. The method for manufacturing the circuit board of claim 1 , wherein disposing the insulation case in the opening comprises disposing an adhesive material between the insulation case and the third circuit substrate, and bonding the insulation case and the third circuit substrate with the adhesive material.

7. The method for manufacturing the circuit board of claim 1 , further comprising:
disposing a heat-dissipating layer on the insulation case, wherein the heat-dissipating layer directly contacts the insulation case.

8. The method for manufacturing the circuit board of claim 7 , further comprising:
forming a hole in the insulation case before adding the heat-exchanging fluid into the first chamber, wherein the heat-exchanging fluid is added into the first chamber through the hole.

9. The method for manufacturing the circuit board of claim 8 , wherein disposing the heat-dissipating layer on the insulation case comprises covering the hole with the heat-dissipating layer to seal the first chamber and keep heat-exchanging fluid in the first chamber.

10. The method for manufacturing the circuit board of claim 1 , wherein forming the opening in the third circuit substrate comprises removing a portion of the electronic component, such that a side surface of the electronic component is vertical.

11. The method for manufacturing the circuit board of claim 1 , further comprising:
disposing a heat-dissipating member on the third circuit substrate; and
disposing a heat-dissipating layer on the insulation case and the heat-dissipating member, wherein the heat-dissipating layer directly contacts the insulation case and the heat-dissipating member.

12. A circuit board, comprising:
a circuit substrate;
an electronic component, embedded in the circuit substrate;
an insulation case, embedded in the circuit substrate and between the circuit substrate and the electronic component, wherein the insulation case comprises:
a first segment surrounding and directly contacting the electronic component;
a second segment positioned by the first segment and facing an inner surface of the circuit substrate;
an inner wall between the first segment and second segment;
a first chamber surrounded by the first segment and the inner wall; and
a second chamber surrounded by the second segment and the inner wall; and

a heat-exchanging fluid, distributed in the first chamber.

13. The circuit board of claim 12 , wherein a cross-sectional profile of the insulation case is an inverted-U shape.

14. The circuit board of claim 12 , wherein the heat-exchanging fluid comprises a liquid and a gas.

15. The circuit board of claim 13 , wherein a liquid level of the heat-exchanging fluid is identical to or higher than a top surface of the electronic component.

16. The circuit board of claim 12 , wherein air is present in the second chamber.

17. The circuit board of claim 12 , further comprising:
a heat-dissipating layer, disposed on and directly contacting the insulation case.

18. The circuit board of claim 17 , further comprising:
a heat-dissipating member, disposed on the circuit substrate,
wherein a projection of the heat-dissipating member on the circuit substrate is spaced away from a projection of the electronic component on the circuit substrate, and
wherein the heat-dissipating layer is disposed on and directly contacts the heat-dissipating member.

19. The circuit board of claim 12 , wherein the electronic component is a capacitor and comprises:
a first electrode;
a second electrode, disposed below the first electrode; and
a dielectric layer, disposed between the first electrode and the second electrode, wherein a side surface of the first electrode, a side surface of the second electrode and a side surface of the dielectric layer are coplanar to each other.

20. The circuit board of claim 19 , wherein
the side surface of the first electrode, the side surface of the second electrode and the side surface of the dielectric layer directly contact the first segment;
a top surface of the first electrode directly contacts the first segment; and
a bottom surface of the second electrode directly contacts the circuit substrate.

Assignees

• Avary Holding Shenzhen Co Ltd
• Qingding Prec Electronics Huaian Co Ltd
• Garuda Tech Co Ltd

Inventors

• Guo Zhi
• Xiong Chen
• Chen Po-Yuan

Classifications

• H05K3/321

  by conductive adhesives · CPC title

• H05K2201/10984

  Component carrying a connection agent, e.g. solder, adhesive · CPC title

• H05K2201/10416

  Metallic blocks or heatsinks completely inserted in a PCB · CPC title

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

• H05K3/4697

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title