Method and apparatus to determine a patterning process parameter
US-2019155173-A1 · May 23, 2019 · US
US12105036B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12105036-B2 |
| Application number | US-201917276124-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 26, 2019 |
| Priority date | Sep 13, 2018 |
| Publication date | Oct 1, 2024 |
| Grant date | Oct 1, 2024 |
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A system and a method for monitoring a beam in an inspection system are provided. The system includes an image sensor configured to collect a sequence of images of a beam spot of a beam formed on a surface, each image of the sequence of images having been collected at a different exposure time of the image sensor, and a controller configured to combine the sequence of images to obtain a beam profile of the beam.
Opening claim text (preview).
What is claimed is: 1. A system for monitoring a light beam in an inspection system, comprising: a light emitter that includes circuitry to emit a light beam onto a surface of a sample and form a beam spot on the surface; an image sensor that includes circuitry to collect a sequence of images of the beam spot formed on the surface such that each image of the sequence of images is collected at a different exposure time of the image sensor; and a controller having one or more processors and a memory, the controller configured to combine the sequence of images to obtain a beam profile of the light beam. 2. The system of claim 1 , wherein the controller is further configured to adjust an image of the sequence of images by using a grey level magnification factor associated with the image. 3. The system of claim 2 , wherein the controller is further configured to adjust the image by multiplying a grey level of each pixel in the image that contains useful information by the grey level magnification factor associated with the image. 4. The system of claim 2 , wherein the controller is configured to determine the grey level magnification factor associated with the image based on an exposure time at which the image is collected. 5. The system of claim 2 , wherein the controller is configured to determine the grey level magnification factor associated with the image based on a comparison of grey levels of pixels in the sequence of images. 6. The system of claim 5 , wherein the image is a first selected image of the sequence of images, and the controller is configured to determine the grey level magnification factor associated with the first selected image based on: a comparison of the first selected image with a second selected image of the plurality of images to obtain a plurality of overlapping pixel pairs; and a determination of the grey level magnification factor associated with the first selected image based on grey levels of pixels in the plurality of overlapping pixel pairs. 7. The system of claim 1 , wherein the controller is further configured to transform coordinates of a particular image of the sequence of images based on positions of the light beam and the image sensor with respect to the beam spot and a magnification factor of an optical system arranged between the image sensor and the surface to obtain a projection of the light beam on the surface. 8. The system of claim 1 , wherein the image sensor includes circuitry to, at an exposure time, collect a plurality of images of the beam spot formed at different locations on the surface, and the controller is configured to: generate an averaged image based on the plurality of images; and use the averaged image as the collected image for the exposure time. 9. The system of claim 8 , wherein the controller is configured to generate the averaged image by: for a pixel, determine an averaged grey level based on the grey levels of pixels in the plurality of images. 10. The system of claim 1 , wherein the controller is further configured to: obtain a total grey level of the beam spot by summing the grey levels of all pixels in the beam profile; and determine a power of the beam based on a relationship between the total grey level and the power. 11. The system of claim 10 , wherein the controller is configured to determine the relationship between the total grey level and the power by: obtaining a power of a sample beam measured by a power meter; obtaining an image of a sample beam spot formed by the sample beam; obtaining a beam profile of the sample beam based on the image of the sample beam; obtaining a total grey level of the sample beam spot by summing the grey levels of the pixels in the beam profile of the sample beam; determining a relationship between the total grey level of the sample beam spot and the power of the sample beam; and determining the relationship between the total grey level and the power based on the relationship between the total grey level of the sample beam spot and the power of the sample beam. 12. The system of claim 10 , wherein the controller is further configured to adjust an output power of the light emitter based on the determined power of the beam. 13. The system of claim 1 , wherein the inspection system further includes a beam shaper, and the controller is further configured to control the beam shaper based on the beam profile of the light beam. 14. The system of claim 1 , wherein the inspection system further includes a charged particle beam tool configured to emit a charged particle beam onto the surface. 15. A non-transitory computer-readable medium that stores a set of instructions that is executable by a processor of a system for monitoring a light beam in an inspection system to cause the system to perform a method, the method comprising: directing a light beam emitted by a light emitter onto a surface of a sample to form a beam spot on the surface; obtaining a sequence of images of the beam spot formed on the surface, wherein each image of the sequence of images is collected by an image sensor at a different exposure time of the image sensor; and combining the sequence of images to obtain a beam profile of the light beam. 16. The system of claim 14 , wherein the controller is configured to control the light emitter to form the beam spot at a location of the surface that is irradiated by the charged particle beam. 17. The system of claim 14 , wherein the light emitter and the image sensor are disposed outside a vacuum chamber of the charged particle beam tool, and wherein the sample is disposed in the vacuum chamber. 18. The system of claim 14 , wherein at least one of the light emitter or the image sensor is disposed inside a vacuum chamber of the charged particle beam tool, and wherein the sample is disposed in the vacuum chamber. 19. The system of claim 1 , wherein the sample is a wafer. 20. The system of claim 1 , wherein the light beam is a laser beam.
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