Circuit board assembly and semi-finished product thereof, floodlight, camera module and application thereof

Patent metadata

Field	Value
Publication number	US-12101877-B2
Application number	US-202117182353-A
Country	US
Kind code	B2
Filing date	Feb 23, 2021
Priority date	Aug 24, 2018
Publication date	Sep 24, 2024
Grant date	Sep 24, 2024

Abstract

The present disclosure provides a circuit board assembly, a TOF camera module including the circuit board assembly and applications thereof. The circuit board assembly is used to support an electronic component, and includes a conductive portion and an insulating portion. The insulating portion is integrally bonded to the conductive portion, and the conductive portion extends through the insulating portion. The electronic component is supported by the conductive portion and is communicated with the conductive portion, so that the electronic component directly dissipates heat through the conductive portion during operation.

First claim

What is claimed is:

1. A semi-finished product of a circuit board assembly, comprising:
a plurality of conductive portions and a plurality of insulating portions,
wherein each of the conductive portions comprises a first conductive portion and a second conductive portion,
wherein the insulating portions are integrally molded to the first conductive portions and the second conductive portions, and for each conductive portion, the first conductive portion and the second conductive portion are separated by at least part of an insulating portion, and
wherein adjacent conductive portions are connected to each other, and
the first conductive portion of one of the conductive portions is connected to the first conductive portion of an adjacent one of the conductive portions by a connector before the semi-finished product is divided into a plurality of circuit board assemblies each comprising a conductive portion of the plurality of conductive portions and an insulating portion of the plurality of insulating portions.

2. The semi-finished product of the circuit board assembly according to claim 1 , wherein the second conductive portion of one of the conductive portions is connected to the second conductive portion of an adjacent one of the conductive portions.

3. A semi-finished product of a circuit board assembly, comprising:
a plurality of conductive portions and a plurality of insulating portions,
wherein each of the conductive portions comprises a first conductive portion and a second conductive portion,
wherein the insulating portions are integrally molded to the first conductive portions and the second conductive portions, and for each conductive portion, the first conductive portion and the second conductive portion are separated by at least part of an insulating portion, and
wherein adjacent conductive portions are connected to each other, and
wherein the first conductive portion of one of the conductive portions is connected to the second conductive portion of an adjacent conductive portion by a connector before the semi-finished product is divided into a plurality of circuit board assemblies each comprising a conductive portion of the plurality of conductive portions and an insulating portion of the plurality of insulating portions.

4. The semi-finished product of the circuit board assembly according to claim 1 ,
wherein the first conductive portion has an upper surface, and the second conductive portion has an upper surface, and
wherein the upper surface of the first conductive portion is larger than the upper surface of the second conductive portion.

5. The semi-finished product of the circuit board assembly according to claim 1 ,
wherein the first conductive portion has an upper surface and a lower surface that are oppositely disposed, and
wherein the upper surface of the first conductive portion is larger than the lower surface of the first conductive portion.

6. A time of flight (TOF) camera module, comprising:
a floodlight, used to emit a light ray to a subject to be photographed, the floodlight comprising a light-emitting element, a circuit board assembly formed by dividing the semi-finished product of the circuit board assembly according to claim 1 ,
a bracket forming a light window, wherein the light-emitting element is supported by the first conductive portion of the circuit board assembly, and the bracket is connected to the circuit board assembly; and
a receiver, configured to receive a reflected light ray reflected by the subject to be photographed, and obtain a depth information of the subject to be photographed based on information of the emitted light ray and the reflected light ray.

7. The TOF camera module according to claim 6 , wherein the receiver comprises a lens assembly, a photosensitive element, a circuit board, and a flexible circuit board,
wherein the lens assembly provides a light-passing path for light to reach the photosensitive element for photoelectric conversion, and
wherein the photosensitive element is conductively connected to the circuit board, the circuit board is conductively connected to the flexible circuit board, and the floodlight is conductively connected to the flexible circuit board.

8. The TOF camera module according to claim 6 , wherein the floodlight further comprises a flexible circuit board which is conductively connected to the conductive portion of the circuit board assembly.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Huang Zhen
• Zeng Junjie
• Xu Chenxiang
• Chen Feifan

Classifications

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/56

  provided with illuminating means · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K2201/10113

  Lamp · CPC title

• H05K1/0274

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title