Circuit substrate with embedded heat sink

Patent metadata

Field	Value
Publication number	US-10034375-B2
Application number	US-201615145828-A
Country	US
Kind code	B2
Filing date	May 4, 2016
Priority date	May 21, 2015
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.

First claim

The invention claimed is:

1. An apparatus, comprising:
a main substrate, configured for mounting a component in a mounting location thereon and having a cavity located below the mounting location;
a device, mounted in the mounting location; and
a heat spreader, fitted into the cavity and coupled directly to the device and to a grounded heat sink, wherein the heat spreader is made from a material configured to conduct heat from the device to the grounded heat sink and to provide electrical insulation between the device and the grounded heat sink, such that the device is electrically floating relative to the grounded heat sink.

2. The apparatus according to claim 1 , wherein the main substrate is configured to provide electrical interconnections to the device.

3. The apparatus according to claim 1 , wherein the device is configured to emit light.

4. The apparatus according to claim 1 , wherein the main substrate comprises a printed circuit board (PCB).

5. The apparatus according to claim 1 , wherein the heat spreader comprises aluminum nitride (AlN).

6. The apparatus according to claim 1 , wherein the heat spreader is configured to protrude from the cavity, beyond a surface of the main substrate that faces the grounded heat sink.

7. The apparatus according to claim 1 , and comprising a secondary substrate that is coupled to the main substrate and is configured for mounting a peripheral device.

8. The apparatus according to claim 7 , wherein the secondary substrate is configured to provide electrical interconnection between the peripheral device and the main substrate.

9. The apparatus according to claim 7 , wherein the secondary substrate is configured to provide electrical interconnection between the device and the main substrate.

10. A method for production, comprising:
producing a main substrate having a mounting location for mounting a component thereon and having a cavity located below the mounting location;
mounting a device in the mounting location; and
fitting a heat spreader into the cavity and coupling the heat spreader directly to the device and to a grounded heat sink, wherein the heat spreader is made from a material that conducts heat from the device to the grounded heat sink and provides electrical insulation between the device and the grounded heat sink, such that the device is electrically floating relative to the grounded heat sink.

11. The method according to claim 10 , wherein producing the main substrate comprises providing on the main substrate electrical interconnections to the device.

12. The method according to claim 10 , wherein mounting the device comprises mounting a light emitter.

13. The method according to claim 10 , wherein producing the main substrate comprises producing a printed circuit board (PCB).

14. The method according to claim 10 , wherein the heat spreader comprises aluminum nitride (AlN).

15. The method according to claim 10 , wherein fitting the heat spreader comprises fitting the heat spreader to protrude from the cavity beyond a surface of the main substrate that faces the grounded heat sink.

16. The method according to claim 10 , and comprising producing a secondary substrate, coupling the secondary substrate to the main substrate and mounting a peripheral device on the secondary substrate.

17. The method according to claim 16 , wherein producing the secondary substrate comprises providing on the secondary substrate electrical interconnection between the peripheral device and the main substrate.

18. The method according to claim 16 , wherein producing the secondary substrate comprises providing on the secondary substrate electrical interconnection between the device and the main substrate.

Assignees

• Apple Inc

Inventors

• Pyper Dennis R
• Raju Venkataram R
• Alnahhas Yazan Z

Classifications

• H05K1/183

  associated with components mounted in and supported by recessed areas of the PCBs · CPC title

• H05K2201/10416

  Metallic blocks or heatsinks completely inserted in a PCB · CPC title

• H05K1/144

  Stacked arrangements of planar printed circuit boards · CPC title

• H05K1/021

  Components thermally connected to metal substrates or heat-sinks by insert mounting · CPC title

• H05K1/0204

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title