Piezoelectric microelectromechanical system microphone with optimized output capacitance

Patent metadata

Field	Value
Publication number	US-12101601-B2
Application number	US-202217929071-A
Country	US
Kind code	B2
Filing date	Sep 1, 2022
Priority date	Sep 7, 2021
Publication date	Sep 24, 2024
Grant date	Sep 24, 2024

Abstract

A microelectromechanical system microphone includes a piezoelectric diaphragm, upper inner electrodes and upper outer electrodes disposed on an upper surface of the diaphragm, and lower inner electrodes and lower outer electrodes disposed on a lower surface of the diaphragm. The diaphragm is divided into a plurality of sectors, a first of the sectors including an inner and an outer upper electrode physically disconnected from an inner and an outer upper electrode on a second sector adjacent to the first sector, and an inner and an outer lower electrode physically disconnected from an inner and an outer lower electrode on the second sector. A first via extends between and electrically couples the upper and lower inner electrodes of the first sector and a first bond pad. A second via extends between and electrically couples the upper and lower outer electrodes of the second sector and a second bond pad.

First claim

What is claimed is:

1. A piezoelectric microelectromechanical system microphone comprising:
a support substrate;
a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm;
upper electrodes disposed on an upper surface of the diaphragm, the upper electrodes including upper inner electrodes and upper outer electrodes;
lower electrodes disposed on a lower surface of the diaphragm, the lower electrodes including lower inner electrodes and lower outer electrodes, the diaphragm being divided into a plurality of sectors, a first sector of the plurality of sectors including an inner and an outer upper electrode physically disconnected from an inner and an outer upper electrode on a second sector adjacent to the first sector, and an inner and an outer lower electrode physically disconnected from an inner and an outer lower electrode on the second sector;
a first conductive via extending between and electrically coupling the upper and lower inner electrodes of the first sector and in electrical communication with a first bond pad; and
a second conductive via extending between and electrically coupling the upper and lower outer electrodes of the second sector and in electrical communication with a second bond pad.

2. The piezoelectric microelectromechanical system microphone of claim 1 wherein the diaphragm includes an upper layer of the piezoelectric material, a lower layer of the piezoelectric material, and inner and outer middle electrodes disposed at an interface between the upper and lower layers of piezoelectric material.

3. The piezoelectric microelectromechanical system microphone of claim 2 wherein the inner and outer middle electrodes in each of the plurality of sectors are electrically connected.

4. The piezoelectric microelectromechanical system microphone of claim 2 wherein the inner and outer middle electrodes in each of the plurality of sectors are electrically floating.

5. The piezoelectric microelectromechanical system microphone of claim 1 further comprising a third conductive via extending between and electrically connecting the upper and lower outer electrodes of the first sector.

6. The piezoelectric microelectromechanical system microphone of claim 5 further comprising a fourth conductive via extending between and electrically connecting the upper and lower inner electrodes of the second sector.

7. The piezoelectric microelectromechanical system microphone of claim 6 wherein the upper and lower outer electrodes of the first sector are electrically connected to the upper and lower inner electrodes of the second sector.

8. The piezoelectric microelectromechanical system microphone of claim 6 wherein the upper and lower outer electrodes of the first sector are electrically connected to upper and lower inner electrodes of a third sector adjacent to the first sector.

9. The piezoelectric microelectromechanical system microphone of claim 1 wherein the upper and lower outer electrodes of the first sector are electrically unconnected.

10. The piezoelectric microelectromechanical system microphone of claim 9 wherein the upper and lower inner electrodes of the second sector are electrically unconnected.

11. The piezoelectric microelectromechanical system microphone of claim 10 further comprising an electrical conductor extending between and electrically coupling the upper outer electrode of the first sector to the upper inner electrode of the second sector.

12. The piezoelectric microelectromechanical system microphone of claim 11 further comprising an electrical conductor extending between and electrically coupling the lower outer electrode of the first sector to the lower inner electrode of the second sector.

13. The piezoelectric microelectromechanical system microphone of claim 9 further comprising a third sector adjacent to the first sector and including upper and lower inner electrodes that are electrically unconnected.

14. The piezoelectric microelectromechanical system microphone of claim 13 further comprising an electrical conductor extending between and electrically coupling the upper outer electrode of the first sector to the upper inner electrode of the third sector.

15. The piezoelectric microelectromechanical system microphone of claim 14 further comprising an electrical conductor extending between and electrically coupling the lower outer electrode of the first sector to the lower inner electrode of the third sector.

16. The piezoelectric microelectromechanical system microphone of claim 1 wherein the diaphragm is circular.

17. An electronics device module including the piezoelectric microelectromechanical system microphone of claim 1 .

18. An electronic device including the electronic device module of claim 17 .

19. A telephone including the electronic device module of claim 17 .

20. A method of forming the piezoelectric microelectromechanical system microphone of claim 1 , the method comprising selecting areas of the upper and lower electrodes and a number of the plurality of sectors to provide the piezoelectric microelectromechanical system microphone with a desired output capacitance.

21. The method of claim 20 wherein the desired output capacitance matches a capacitance of circuitry electrically connected to the piezoelectric microelectromechanical system microphone.

Assignees

• Skyworks Solutions Inc

Inventors

• Chen Guofeng
• Qian You
• Kumar Rakesh
• Wurtz Michael Jon
• Campanella-Pineda Humberto

Classifications

• H04R2201/003

  Mems transducers or their use · CPC title

• H04R2499/11

  Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's · CPC title

• H04R2410/03

  Reduction of intrinsic noise in microphones · CPC title

• H04R31/003

  for diaphragms or their outer suspension · CPC title

• H04R17/02 Primary

  Microphones · CPC title