Semiconductor device, semiconductor device package, and manufacturing methods thereof

Patent metadata

Field	Value
Publication number	US-12100928-B2
Application number	US-202318310106-A
Country	US
Kind code	B2
Filing date	May 1, 2023
Priority date	Mar 27, 2018
Publication date	Sep 24, 2024
Grant date	Sep 24, 2024

Abstract

A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

First claim

What is claimed is:

1. A method of manufacturing a semiconductor device, the method comprising, in this order:
preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces;
joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and
fixing a semiconductor element to the bottom plate,
wherein a height of the upper portion of the one or more inclined surfaces relative to the reference part in the step of fixing the semiconductor element is lower than a height of the upper portion of the one or more inclined surfaces relative to the reference part in the step of preparing the bottom plate, due to warpage that occurs in the bottom plate during the step of joining the frame member.

2. The method according to claim 1 , wherein:
at least a portion of the reference part is disposed in a central part of the lower surface.

3. The method according to claim 1 , wherein:
the lower surface of the bottom plate has a first side and a second side that oppose each other and a third side and a fourth side that oppose each other.

4. The method according to claim 3 , wherein:
the one or more inclined surfaces are connected to at least one of the first side, the second side, the third side and the fourth side.

5. The method according to claim 1 , the method further comprising, after the step of fixing the semiconductor element, joining a lid to the frame member.

6. The method according to claim 1 , wherein, in the step of fixing the semiconductor element, the semiconductor element is a semiconductor laser element.

7. A method of manufacturing a semiconductor device package, the method comprising, in this order:
preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; and
joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate,
wherein a height of the upper portion of the one or more inclined surfaces relative to the reference part after the step of joining the frame member is lower than a height of the upper portion of the one or more inclined surfaces relative to the reference part in the step of preparing the bottom plate, due to warpage that occurs in the bottom plate during the step of joining the frame member.

8. The method according to claim 7 , wherein:
at least a portion of the reference part is disposed in a central part of the lower surface.

9. The method according to claim 7 , wherein:
the lower surface of the bottom plate has a first side and a second side that oppose each other and a third side and a fourth side that oppose each other.

10. The method according to claim 9 , wherein:
the one or more inclined surfaces are connected to at least one of the first side, the second side, the third side and the fourth side.

Assignees

• Nichia Corp
• Shinko Electric Ind Co

Inventors

• Hashimoto Takuya
• Okahisa Eiichiro
• Nakazawa Katsuya
• Matsushita Shigeru
• Uehara Sumio
• Kobayashi Suguru
• Yumoto Kazuhito

Classifications

• H10H20/8506

  Containers · CPC title

• H10H20/8582 Primary

  characterised by their shape · CPC title

• H01S5/02255

  using beam deflecting elements · CPC title

• H01S5/02355

  Fixing laser chips on mounts · CPC title

• H01S5/02208

  characterised by the shape of the housings · CPC title